JPS6313663A - リフロ−ソルダリング装置 - Google Patents
リフロ−ソルダリング装置Info
- Publication number
- JPS6313663A JPS6313663A JP15627386A JP15627386A JPS6313663A JP S6313663 A JPS6313663 A JP S6313663A JP 15627386 A JP15627386 A JP 15627386A JP 15627386 A JP15627386 A JP 15627386A JP S6313663 A JPS6313663 A JP S6313663A
- Authority
- JP
- Japan
- Prior art keywords
- heater
- temperature
- solder
- signal
- reflow soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005476 soldering Methods 0.000 title claims description 18
- 229910000679 solder Inorganic materials 0.000 claims description 35
- 238000000926 separation method Methods 0.000 claims description 10
- 238000007711 solidification Methods 0.000 claims description 9
- 230000008023 solidification Effects 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 8
- 238000001816 cooling Methods 0.000 claims description 4
- 238000003825 pressing Methods 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 description 5
- 238000005345 coagulation Methods 0.000 description 3
- 230000015271 coagulation Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 230000007423 decrease Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000003111 delayed effect Effects 0.000 description 2
- 230000001360 synchronised effect Effects 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 210000000078 claw Anatomy 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000003779 heat-resistant material Substances 0.000 description 1
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 230000011664 signaling Effects 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15627386A JPS6313663A (ja) | 1986-07-04 | 1986-07-04 | リフロ−ソルダリング装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15627386A JPS6313663A (ja) | 1986-07-04 | 1986-07-04 | リフロ−ソルダリング装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6313663A true JPS6313663A (ja) | 1988-01-20 |
JPH0331546B2 JPH0331546B2 (enrdf_load_stackoverflow) | 1991-05-07 |
Family
ID=15624206
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15627386A Granted JPS6313663A (ja) | 1986-07-04 | 1986-07-04 | リフロ−ソルダリング装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6313663A (enrdf_load_stackoverflow) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02220774A (ja) * | 1989-02-21 | 1990-09-03 | Ohashi Seisakusho:Kk | 加熱圧着装置 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5423056A (en) * | 1977-07-22 | 1979-02-21 | Hitachi Ltd | Automatic soldering device |
JPS5631758A (en) * | 1979-08-24 | 1981-03-31 | Sharp Kk | Detector for clogging condition of flexible tube |
JPS574118A (en) * | 1980-06-10 | 1982-01-09 | Toshiba Corp | Vapor phase reaction of semiconductor substrate |
JPS6141461U (ja) * | 1984-08-13 | 1986-03-17 | 日立電子株式会社 | 自動はんだ付けロボツト |
-
1986
- 1986-07-04 JP JP15627386A patent/JPS6313663A/ja active Granted
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5423056A (en) * | 1977-07-22 | 1979-02-21 | Hitachi Ltd | Automatic soldering device |
JPS5631758A (en) * | 1979-08-24 | 1981-03-31 | Sharp Kk | Detector for clogging condition of flexible tube |
JPS574118A (en) * | 1980-06-10 | 1982-01-09 | Toshiba Corp | Vapor phase reaction of semiconductor substrate |
JPS6141461U (ja) * | 1984-08-13 | 1986-03-17 | 日立電子株式会社 | 自動はんだ付けロボツト |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02220774A (ja) * | 1989-02-21 | 1990-09-03 | Ohashi Seisakusho:Kk | 加熱圧着装置 |
Also Published As
Publication number | Publication date |
---|---|
JPH0331546B2 (enrdf_load_stackoverflow) | 1991-05-07 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term | ||
S531 | Written request for registration of change of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R313531 |
|
R360 | Written notification for declining of transfer of rights |
Free format text: JAPANESE INTERMEDIATE CODE: R360 |
|
R370 | Written measure of declining of transfer procedure |
Free format text: JAPANESE INTERMEDIATE CODE: R370 |