JPS63136335U - - Google Patents
Info
- Publication number
- JPS63136335U JPS63136335U JP1987028297U JP2829787U JPS63136335U JP S63136335 U JPS63136335 U JP S63136335U JP 1987028297 U JP1987028297 U JP 1987028297U JP 2829787 U JP2829787 U JP 2829787U JP S63136335 U JPS63136335 U JP S63136335U
- Authority
- JP
- Japan
- Prior art keywords
- tape
- metal foil
- intermediate structure
- attached
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000011888 foil Substances 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 239000008188 pellet Substances 0.000 claims description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
Landscapes
- Wire Bonding (AREA)
Description
第１図は本考案に係る第１の実施例の正面断面
図、第２図は第１の実施例の縮小平面図、第３図
は第２の実施例の正面断面図、第４図は第３の実
施例の正面断面図、第５図は第４の実施例の正面
断面図、第６図は第４の実施例の縮小底面図であ
る。第７図は従来のＴＡＢリード型半導体装置の
平面図、第８図は同じく断面図、第９図は中間構
体の縮小部分図である。
３……金属箔リード、３ａ……電極パターン、
３ｂ……金属箔リードの内端部、４……半導体ペ
レツト、５……バンプ電極、６……絶縁性テープ
、７……角孔、９……補助テープ、Ａ……中間構
体。
Fig. 1 is a front sectional view of the first embodiment of the present invention, Fig. 2 is a reduced plan view of the first embodiment, Fig. 3 is a front sectional view of the second embodiment, and Fig. 4 is a front sectional view of the first embodiment. FIG. 5 is a front sectional view of the third embodiment, FIG. 5 is a front sectional view of the fourth embodiment, and FIG. 6 is a reduced bottom view of the fourth embodiment. FIG. 7 is a plan view of a conventional TAB lead type semiconductor device, FIG. 8 is a sectional view of the same, and FIG. 9 is a reduced partial view of the intermediate structure. 3... Metal foil lead, 3a... Electrode pattern,
3b...Inner end of metal foil lead, 4...Semiconductor pellet, 5...Bump electrode, 6...Insulating tape, 7...Square hole, 9...Auxiliary tape, A...Intermediate structure.
Claims (1)
ごとに穿設された複数の角孔と、上記角孔の周縁
部上に放射状に固着され、角孔内に延びた内端部
先端が半導体ペレツトのバンプ電極に圧着される
複数の金属箔リードとを具備する半導体中間構体
において、 上記角孔内に延びる金属箔リードを保護する補
助テープを上記絶縁性テープの表面又は裏面に貼
着したことを特徴とする半導体中間構体。[Claims for Utility Model Registration] A long insulating tape, a plurality of square holes drilled in the tape at predetermined intervals, and fixed radially on the periphery of the square holes, In a semiconductor intermediate structure comprising a plurality of metal foil leads whose extended inner end tips are crimped to bump electrodes of a semiconductor pellet, an auxiliary tape for protecting the metal foil leads extending into the square hole is attached to the insulating tape. A semiconductor intermediate structure characterized by being attached to the front or back surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987028297U JPS63136335U (en) | 1987-02-26 | 1987-02-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987028297U JPS63136335U (en) | 1987-02-26 | 1987-02-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63136335U true JPS63136335U (en) | 1988-09-07 |
Family
ID=30831123
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987028297U Pending JPS63136335U (en) | 1987-02-26 | 1987-02-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63136335U (en) |
-
1987
- 1987-02-26 JP JP1987028297U patent/JPS63136335U/ja active Pending