JPS631335U - - Google Patents
Info
- Publication number
- JPS631335U JPS631335U JP1986095148U JP9514886U JPS631335U JP S631335 U JPS631335 U JP S631335U JP 1986095148 U JP1986095148 U JP 1986095148U JP 9514886 U JP9514886 U JP 9514886U JP S631335 U JPS631335 U JP S631335U
- Authority
- JP
- Japan
- Prior art keywords
- ground
- lead
- semiconductor element
- electrode
- level
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H10W72/0198—
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- H10W72/07352—
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- H10W72/321—
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- H10W72/536—
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- H10W72/5363—
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- H10W72/5449—
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- H10W72/884—
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- H10W90/736—
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- H10W90/756—
Landscapes
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986095148U JPS631335U (enExample) | 1986-06-20 | 1986-06-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986095148U JPS631335U (enExample) | 1986-06-20 | 1986-06-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS631335U true JPS631335U (enExample) | 1988-01-07 |
Family
ID=30959364
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986095148U Pending JPS631335U (enExample) | 1986-06-20 | 1986-06-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS631335U (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006032989A (ja) * | 2005-10-07 | 2006-02-02 | Yamaha Corp | 半導体パッケージ及び半導体パッケージの製造方法 |
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1986
- 1986-06-20 JP JP1986095148U patent/JPS631335U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006032989A (ja) * | 2005-10-07 | 2006-02-02 | Yamaha Corp | 半導体パッケージ及び半導体パッケージの製造方法 |