JPS63122300A - Parts mounter - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to an apparatus for positioning and mounting electronic components on a printed circuit board.

[Prior art and its problems]

Normally, positioning marks are used to help determine the relative position of the IC and the board, but this is used to determine the horizontal and rotational positional misalignment errors between the IC and the board.

Positioning marks at two locations must be recognized.

Conventionally, this method has been carried out using two video cameras or one video camera.

First, the case where one camera is used will be explained using FIG.

In this method, after determining the relative positional relationship between IC3 and IC chuck 6, video camera 1
It also moves onto the positioning mark 5. In this state, the positioning mark 5 is imaged by the camera 1, and the relative positional relationship between the IC chuck 6 and the positioning mark 5 is determined by the image processing device 1. next.

Video camera 1. The IC chuck 6 and the IC 3 are moved onto the positioning mark 5', and the relative positional relationship between the IC chuck 6 and the positioning mark 5' is determined in the same manner as described above. Here, the relative positions of the IC chuck 6 on the positioning mark 5 and the position of the IC chuck 6 on the positioning mark 5' are known from the coordinate system of the robot arm 12, so the I
The relative positions of the C chuck 6 and the positioning marks 5 and 5' are calculated.

Since the relative positional relationship between IC3 and IC chuck 6 is already known, IC3 and positioning mark 5 are determined from the results of 2 and above.
and 5', that is, the positional deviation error between the substrate 4 and the IC 3 is determined.

As described above, in this method, it is necessary to move the video camera to take images of the positioning marks at two locations, and the mounting time increases by the time required for movement. Also,
Since the coordinate system of the robot arm is used when calculating the relative position between the IC and the substrate, there is a drawback that the positioning error of the robot arm is included in the result.

Next, the case where two video cameras are used will be explained using FIG.

This method is based on the same principle as using one video camera, but the difference is that two video cameras are used to image two positioning marks at the same time, without moving the video camera or anything else. .

This method does not require movement of the IC chuck 6 compared to the method using one video camera.

There is an advantage that the positioning error of the robot arm is not included in the calculation results, but since the distance between video cameras 1 and 1' is fixed, the distance between the two positioning marks 5.5' may differ due to changes in the IC to be mounted. If

It is necessary to adjust the distance. Furthermore, if a plurality of ICs of different sizes are mounted at the same time, it may not be possible to handle the case.

〔the purpose〕

In order to eliminate these drawbacks, this invention compresses the IC leads and positioning marks in the direction of the IC lead arrangement, inputs 9 images by expanding them in the vertical direction of the lead arrangement, and widens them in the direction of the IC lead arrangement. The field of view and high resolution in the direction perpendicular to the array were made possible.

The purpose is to recognize the position of an IC lead or board with high precision, and at the same time to be able to handle ICs of different sizes.

〔Example〕

An embodiment of the present invention will be described below.

The device configuration is shown in Figure 2. This device is IC3 lead 7,
Lands on the board (not shown) or.

Video cameras 1 and 1' that image the positioning mark 5 for recognizing the relative positional deviation between the IC 3 and the component mounting position on the board 4, an image memory 89 that stores signals from the video camera, and the contents of the image memory 8. A calculation unit 9 calculates the relative position of the component 3 gripped by the video cameras 1, 1' and the IC chuck 6 or the relative positional relationship with the mounting position of the component 3, and issues necessary commands to the robot controller 11 from the calculation results. FIG. 1 shows the detailed structure of the component gripping section, which is composed of a central processing section 10.

In this way, between the video cameras 1, 1' and the lead 7,
Convex lenses 2, 2' having curvature in only one direction are arranged,
Expand the input image in the vertical direction of the lead array. In this case, if the lenses 2 and 2' are arranged to form a right angle, the program for processing one image becomes simple.

These determine the imaging area of the video camera.

Spreads in the direction of read alignment. The situation is shown in Figure 3.

A (area surrounded by a solid line) indicates the imaging range of the video camera 1, and b (area surrounded by a broken line) indicates the imaging range of the video camera 1'.

Regarding a, the input image remains unchanged in the y direction,
Expanded in the X direction. In other words, the resolution in the X direction is improved while the imaging range in the y direction remains the same.

Therefore, by recognizing the two positioning marks 5, 5' and the tip of each lead, it is possible to recognize with high precision either the rotational direction of the substrate and the IC, or the relative position in the X direction.

Similarly, using the video camera 1', ie area b.

Relative positional deviation in the X direction can be recognized with high precision.

Furthermore, if rod-shaped concave lenses having curvature only in the lead arrangement direction are used as the lenses 2 and 2', a wide range in the lead arrangement direction can be compressed and input as an input image. Therefore, the alignment marks 5, 5' and the tips of each lead 7 are photographed at the same time, and the relative positional deviation between the rotational direction of the board 4 and the component 3 and the arrangement direction of the leads is detected by the camera.
, 1' can be recognized with high precision, and the robot can be controlled to identify part 7.
can be accurately mounted on the mounting position of the board 4.

It was determined by the calculation unit 9 according to the above procedure. The amount of deviation in each direction is output to the central processing unit 10, and the central processing unit issues a correction command to the robot controller 11.

In this way, the two components and the board are positioned relative to each other and mounted.

〔effect〕

As described above, according to the present invention, it is possible to position marks or lands on a wide range of substrates and IC leads with high precision using a relatively simple optical system.

Therefore, the range that can be applied to ICs of different sizes is widened.

Although two video cameras are used in this embodiment, it is also possible to use just one video camera using optical fibers or the like.

[Brief explanation of the drawing]

FIGS. 4 and 5 show examples of position recognition using conventional devices. FIG. 2 shows an embodiment of the present invention. FIG. 1 shows an embodiment of the IC gripping part of the present invention. Third
The figure shows the imaging range of a video camera 1° 1' according to the invention. - 1.1' video camera, 2.2': lens having curvature in one direction, 5.5': positioning mark, 6: component gripping section, 8: image memory, 9: image processing section. 10: Central processing unit, 11: RoboSoto controller, 12
: Robot arm. 1゛＼、Representative Patent Attorney Katsuo Ogawa・・ノ'、、、'、、－゛Figure 1Figure 2

Claims (1)

[Claims] 1. In an apparatus that has a visual device and uses the visual sense to position the electronic component and the printed circuit board, and then mounts the electronic component on the printed circuit board, one or more imaging units in the visual device A rod-shaped concave lens with a curvature according to the lead arrangement direction, a convex lens with a curvature in the direction perpendicular to the lead arrangement, or an optical device with an equivalent function is placed between the gripped part and the leads of the component having leads in one direction or in multiple directions. Arrange one or more systems,
A component mounting device that compresses an image in the direction of arrangement of each lead, and expands and inputs an image in a direction perpendicular to the lead arrangement.