JPS63121443U - - Google Patents

Info

Publication number
JPS63121443U
JPS63121443U JP1987013214U JP1321487U JPS63121443U JP S63121443 U JPS63121443 U JP S63121443U JP 1987013214 U JP1987013214 U JP 1987013214U JP 1321487 U JP1321487 U JP 1321487U JP S63121443 U JPS63121443 U JP S63121443U
Authority
JP
Japan
Prior art keywords
lead
semiconductor pellet
semiconductor
bending
die
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1987013214U
Other languages
English (en)
Other versions
JPH0526748Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987013214U priority Critical patent/JPH0526748Y2/ja
Publication of JPS63121443U publication Critical patent/JPS63121443U/ja
Application granted granted Critical
Publication of JPH0526748Y2 publication Critical patent/JPH0526748Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
第１図ａ，ｂ，ｃは本考案の第１の実施例を示
す構成図、第２図ａ，ｂは従来のリード修正装置
を示す構成図、第３図ａ，ｂ，ｃは本考案の第２
の実施例を示す構成図である。 １…半導体ペレツト、２…リード、３…テープ
キヤリア、４…ダイ、６…吸着コレツト、７…カ
ム、８…モーター、９…真空ホース、１０…バネ
。

Claims (1)

    【実用新案登録請求の範囲】
  1. 半導体ペレツトの電極が接続されたテープキヤ
    リアのリードを半導体ペレツト表面との接触を避
    けるために折り曲げる装置において、前記リード
    の基部を支えるリード曲げ用ダイと、前記半導体
    ペレツトの裏面を真空吸着し、前記ダイに対し相
    対変位してリードの折曲げを行なう吸着コレツト
    とを有することを特徴とする半導体のリード修正
    装置。
JP1987013214U 1987-01-31 1987-01-31 Expired - Lifetime JPH0526748Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987013214U JPH0526748Y2 (ja) 1987-01-31 1987-01-31

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987013214U JPH0526748Y2 (ja) 1987-01-31 1987-01-31

Publications (2)

Publication Number Publication Date
JPS63121443U true JPS63121443U (ja) 1988-08-05
JPH0526748Y2 JPH0526748Y2 (ja) 1993-07-07

Family

ID=30802064

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987013214U Expired - Lifetime JPH0526748Y2 (ja) 1987-01-31 1987-01-31

Country Status (1)

Country Link
JP (1) JPH0526748Y2 (ja)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6387829U (ja) * 1986-11-25 1988-06-08

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6387829U (ja) * 1986-11-25 1988-06-08

Also Published As

Publication number Publication date
JPH0526748Y2 (ja) 1993-07-07

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