JPS63116498A - Manufacture of molded printed wiring board - Google Patents

Abstract

(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION (Technical Field) The present invention relates to a method for manufacturing a molded printed wiring board. More specifically, the present invention relates to a method of manufacturing a printed wiring board by forming a metal pattern on a mold structure such as a device housing and integrally molding the metal pattern.

(Background Art) At present, attempts are being made to form conductor patterns on the back surface of the equipment housing and mount components thereon in order to make the equipment more compact and to lower the price. However, this attempt still has many problems. In this regard, additive methods have conventionally been adopted. In this method, a resist or ink pattern is formed on an injection molded mold plate by means such as dry film or screen printing, and then copper (Cu) is deposited by electroless plating or electrolytic plating, and then the above mask pattern is formed. A conductive pattern was formed by removing the . In the case of this conventional additive method, the manufacturing process is complicated,
There were problems in that quality control and cost reduction were difficult, and the shape was limited to flat plates.

For this reason, this is a printed wiring board manufacturing technology that can efficiently form conductor patterns on equipment casings of arbitrary shapes, and also realizes miniaturization of equipment, rationalization of manufacturing processes, and reduction of manufacturing costs. The practical application of this board is strongly desired.

(Purpose of the Invention) This invention was made in view of the above-mentioned method, and it is possible to efficiently form a molded TFI body with a metal conductor pattern into any shape, with high quality and at low cost. The purpose of the present invention is to provide a method for manufacturing printed wiring boards that can be manufactured using the following methods.

(Disclosure of the Invention) In order to achieve the above object, the present invention provides a gold HJ film after forming a pattern on the surface of a base film with a water-soluble masking material, and then integrates a mask pattern forming layer and a mold structure. Provided is a method for manufacturing a molded printed wiring board, which comprises molding and peeling off a base film after the molding.

A major feature of this method is that the metal pattern and the mold can be formed at the same time.

The masking material used in this method is water-soluble, and any suitable water-soluble ink or dry film that can be used for masking can be used. The metal film may also be formed by either a dry process or a wet process.

DESCRIPTION OF THE PREFERRED EMBODIMENTS In order to explain in more detail the method of manufacturing a molded printed wiring board by simultaneous integration of the present invention, the drawings will be shown and explained.

Figures 1, 2 and 3 of the accompanying drawings show an example of the manufacturing process of the second invention.

As shown in Figure 1, for example, water-soluble ink is applied as a masking method to the surface of a PET (polyethylene terephthalate) base film (1) with a thickness of 25 to 75 μm, or a water-soluble dry film is used as a resist. A desired mask (2) pattern is formed using plate photolithography.

As the base film, any relatively heat-resistant plastic film such as polyester or nylon can be used. As a mask, starch, polyvinyl alcohol, colored inks with low water solubility thereof, or ordinary dry films can be used. After forming the mask (2) pattern, a metal film (4) is formed directly or via a release layer (3).

In the method of this invention, it is necessary to separate the metal pattern and the base film after integral molding, and as a method for this purpose, a metal that has weak adhesion to the base film, such as gold (Au), is used. After forming the ultra-thin film, the required metal, such as copper (Cu) in the case of conductive patterns, can be formed.

The thickness of the gold a film (4) can be set arbitrarily depending on the application. In the case of copper (Cu), preferably 5 to 10μ
Let it be m. However, if the pattern width is as large as about 1 inch, a thickness of about 1 μm is sufficient, and if the pattern is as thin as 100 μm, it is preferable to increase the thickness to 10 to 30 μm. For soldering when mounting zero components that can use UV-curable resins or UV-curable resins, the material and film thickness of the release layer are selected appropriately so as to have sufficient conductivity.

As this mold layer (3), SiO2 or TIO
By using a transparent inorganic compound such as No. 2, it can also be used as a protective film for a metal layer. In this case as well, in order to obtain sufficient conductivity, it is preferable to use an extremely thin layer of 50 to 100 A when soldering.

Money! The X film (4) may be formed by a vapor phase dry process such as vapor deposition or ion blating, or may be formed by wet means such as wet plating.

Next, the laminate shown in FIG. 1 is immersed in water to dissolve and remove the pattern of the water-soluble masking material, thereby obtaining a metal pattern forming layer (5). Figure 2 shows this.

This metal pattern formation 1 (5) is attached to a mold (6), and injection molding is performed.
) is supplied from the supply passage (7).

As shown in FIG. 3, in the method of the present invention, it is possible to extremely easily make holes in the printed wiring board, for example, by forming holes (8) by molding. The operating conditions for injection molding can be selected as appropriate, and the injection temperature of the mold is also selected as appropriate, for example, for ABS resin (about 250°C), polyimide (about 400°C), engineering plastic (about 300°C), etc. .

Here, in order to increase the degree of adhesion between the mold and the metal pattern, a cold-curable or UV-curable adhesive layer of methacrylic acid ester, epoxy, melamine, polyurethane, etc. may be provided on the metal layer.

Further, the above method can also be carried out continuously by taking advantage of the advantages of using a film plate. It is manufactured by roll-to-roll (Figure 4).

After molding, the base film may be peeled off.

(Effects of the Invention) As described above, the present invention makes it possible to efficiently form a conductor pattern on a mold structure of any shape. The manufacturing equipment can also be downsized and can be manufactured at low cost.

[Brief explanation of the drawing]

FIGS. 1, 2, and 3 are cross-sectional views sequentially showing an example of the method of the present invention. FIG. 4 is a schematic diagram showing the continuous method. The numbers in the figure indicate the following. 1...Base film, 2...Mask 3...
Template layer 4...Gold 1X film 5...Metal pattern forming layer 6...Mold 7...Mold supply passage 8...Pattern hole 9.10...Roll agent Patent attorney West Toshio Sawa Figure 1 Figure Otsu Figure 2 Figure 3 Figure 4

Claims (5)

[Claims] (1) After forming a pattern with a water-soluble masking material on the surface of the base film, a metal film is provided, and then the metal pattern forming layer formed by removing the mask pattern and the mold structure are integrally molded, and the mold structure is molded. A method for manufacturing a molded printed wiring board, which comprises peeling off the base film afterwards. (2) The method for manufacturing a molded printed wiring board according to claim (1), wherein the masking material is a water-soluble ink or a water-soluble dry film. (3) A method for manufacturing a molded printed wiring board according to claim (1), in which a metal film is provided directly or via a mold release layer. (4) A method for manufacturing a molded printed wiring board according to claim (1), which uses a metal pattern forming layer formed by providing an adhesive layer on a metal film. (5) The method for manufacturing a molded printed wiring board according to claim (1), in which a transparent inorganic layer of SiO_2 or TiO_2 is used as the mold release layer.