JPS63284884A - Pattern formation - Google Patents

Abstract

PURPOSE:To contrive high efficiency and improvement in quality by forming a mask pattern at the surface of a substrate and then, by performing either electrolytic or electroless deposition, or vaporization, thereby removing the mask pattern. CONSTITUTION:Required mask patterns 2 are formed at the surface of a substrate 1 and conductive films 3 are arranged on the mask patterns 2 and either electric or electroless deposition, or vaporization is performed on the conductive films and then, thin films 4 are formed. Further, required patterns 5 are obtained by removing the mask patterns 2. Thus, no only the productivity is improved but also high quality metals or inorganic patterns are formed.

Description

DETAILED DESCRIPTION OF THE INVENTION (Technical Field) The present invention relates to a pattern forming method. More specifically, the present invention provides printed wiring boards, decorative boards,
The present invention relates to a pattern forming method that enables highly efficient and high quality production of metal or inorganic patterns useful as nameplates and the like.

(Background Art) Conventionally, flexible printed boards have been used in the manufacture of printed wiring boards in order to downsize and lower the cost of devices. In addition, recently, IC chips have been directly attached to flexible printed circuit boards using wi! Chip-on-board systems are also being adopted.

In this case, high precision and high definition are required, with a pattern width of about three lines between bins, and strong pattern adhesion strength is required to prevent peeling during processes such as bonding.

Methods for manufacturing such flexible printed boards include (a) a method of laminating a base film and copper foil, and then forming a pattern using screen printing or a water-soluble dry film to form an edge and a chip; (b) Additive methods, in which a resist or ink pattern is formed on a base film by means such as dry film or screen printing, copper is deposited by electroless plating or electrolytic plating, and then a conductor pattern is formed by removing the mask pattern. Alternatively, (1) a method is known in which a copper thin film is formed on a base film in a vapor phase using a cluster ion beam or the like, and a conductor pattern is formed by a subtractive method.

However, many problems still remain with these manufacturing methods. First, in the laminating method (a), it is not possible to make the copper foil thin, and it is difficult to achieve high definition due to etching of thick copper foil.Moreover, when using various metal conductors, etching agents are required. In addition, the following (a) additive method uses a mixture of highly concentrated chromic acid and sulfuric acid to perform electrolytic or electroless plating on the surface of a plastic film. It is necessary to perform surface treatment and etching using a liquid. These processing agents cause pollution, and the manufacturing process and equipment required to counteract them become complicated, resulting in high costs.

Furthermore, in the case of gas phase method/subtractive method,
Conventional methods have a slow film formation rate and require long operations to obtain a desired film thickness, resulting in poor productivity and high costs.

Decorative plates or nameplates can also be manufactured by a similar method, but the current problem still remains as described above. Further, when a metal film or an inorganic film is formed by a vapor deposition method, the adhesion of the metal film or inorganic film is poor, and it is not easy to increase the film thickness.

(Objective of the invention) This invention was made in view of the above circumstances, and it improves the drawbacks of the conventional method, does not use surface treatment agents that cause pollution, and can treat various inorganic materials as well as metals. It is an object of the present invention to provide a pattern forming method that can form a thin film pattern with high efficiency and high quality and has good adhesion to a substrate.

(Disclosure of the Invention) In order to achieve the above object, the pattern forming method of the present invention forms a mask pattern on the surface of a substrate, arranges a conductive film, and then performs electrolytic or electroless plating, or vapor deposition. , and then the mask pattern is removed.

The present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 is a process diagram of the method of the invention.

As shown in FIG. 1, (a) a required mask pattern (2) is placed on the surface of the substrate (1).
) to form. As the masking material, starch, polyvinyl alcohol, other water-soluble inks, water-soluble dry films, or thermosetting or UV-curable resins such as melamine, acrylic, and polyester can be used.

This pattern formation can be performed by conventional screen printing or dry film photolithography.

There are no particular limitations on the substrate; polyester, polyamide, vinyl chloride resin, acrylic resin, polyimide, ABS
vIJ resin, epoxy resin, laminates thereof, and even F
A film, sheet, plate made of any material such as RP, or even a three-dimensional treetop body can be used.

(b) Next, a conductive film (3) is provided on this mask pattern (2). This conductive film (3) may be produced by a vapor phase method, a laminating method, or a printing method.

Particularly preferred is plasma beam deposition (PB)
D) by law. In this case, a conductive film with excellent adhesion can be produced with high efficiency. This method uses a pressure gradient plasma gun to
In a chamber maintained at a vacuum level of 500 to 8
A plasma discharge is caused by an applied voltage of 00 V, and a plasma beam is emitted to form a film.

Film formation can be performed at a high speed of substrate movement of 10 m/min or more.

As the conductive film (3), copper (Cu), gold (Aug, I
N (Ag), aluminum (AI), nickel (N i
), a metal such as titanium (TI), or an inorganic material such as indium oxide or ITO. The film thickness in this case can be, for example, about 0.5 to 1 μm.

Since ITO is a transparent film, it is useful for both decorative plates and printed wiring boards with interference colors. It may also be ITO colored by electrophoresis.

(C) A thin film (4) is formed on the conductive wA (3) by electroplating, electroless plating, or vapor deposition.

Metal films formed by plating include copper (Cu), nickel (
N1), aluminum (AI), etc. are formed as appropriate. Further, any dry coating method such as vacuum evaporation, CVD, sputtering, ion blasting, plasma beam deposition (PBD), etc., which may be used to layer a metal or an inorganic material by evaporation, can be used.

The thin film is appropriately selected to have a thickness of about 0.2 to 30 μm.

(d) Next, remove the mask pattern (2) to obtain the desired pattern (5).

In the above method, the pattern (5) formed on the substrate (1) can also be transferred onto the surface of the other substrate. In this case, an adhesive layer can be provided on the surface of the pattern (5) and the pattern can be transferred, or the pattern can be transferred simultaneously with molding. When performing such transfer, it is also effective to provide an M-type layer in advance before forming the mask pattern (2).

Of course, it goes without saying that etching for pattern formation may be added as appropriate to the method of the present invention.

Next, the present invention will be further explained in detail by showing examples.

Example A mask pattern made of a water-soluble polyvinyl alcohol-based mask material was formed on the surface of a PET film (width: 30 cm) having a thickness of 35 μfS by screen printing. A 0.7 μm thick ITO film was deposited using a plasma beam deposition method.

Deposition was performed using a roll-to-roll method using a pressure gradient plasma gun while moving the film at a moving speed of 10 m/min. Next, a thin film (20 μm) of AS<cu> was deposited by electrolytic plating. Formed.

The mask was removed to obtain the desired ITo/copper pattern.

(Effects of the Invention) According to the present invention, high-quality metal or inorganic patterns can be formed with good productivity.

Patterns useful as printed wiring boards, decorative patterns, nameplates, etc. can be efficiently formed.

[Brief explanation of drawings]

FIGS. 1(a), 1(b), 1(c) and 1(d) are process diagrams showing the method of the present invention. 1...Substrate, 2...Mask pattern, 3...
- Conductive film, 4... Plating/evaporation thin film, 5... Pattern. Agent Patent Attorney Toshio Nishizawa Figure 1

Claims (1)

[Claims] (1) A pattern forming method comprising forming a mask pattern on the surface of a substrate, disposing a conductive film, performing electrolytic or electroless plating, or vapor deposition, and then removing the mask pattern.