JPS63115222U - - Google Patents
Info
- Publication number
- JPS63115222U JPS63115222U JP734987U JP734987U JPS63115222U JP S63115222 U JPS63115222 U JP S63115222U JP 734987 U JP734987 U JP 734987U JP 734987 U JP734987 U JP 734987U JP S63115222 U JPS63115222 U JP S63115222U
- Authority
- JP
- Japan
- Prior art keywords
- pad
- width
- cutting
- measuring pad
- slit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims 1
- 238000005259 measurement Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 2
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Description
第１図１，２は本考案の実施例を示す測定用パ
ツドの平面図、第２図は従来の測定用パツドを有
する半導体ウエハの平面図、第３図１，２は第２
図中の測定用パツドの拡大平面図、第４図１，２
は本考案の他の実施例を示す測定用パツドの平面
図である。
１……半導体ウエハ、２……切断予定線（スク
ライブライン）、３，１０，２０……測定用パツ
ド、１０ａ，２０ａ……スリツト、１０ｂ，２０
ｂ……パツド残部、Ｃ……切断幅。
1 and 2 are plan views of a measurement pad showing an embodiment of the present invention, FIG. 2 is a plan view of a semiconductor wafer having a conventional measurement pad, and FIG.
Enlarged plan view of the measurement pad in the figure, Figure 4 1, 2
FIG. 3 is a plan view of a measuring pad showing another embodiment of the present invention. 1... Semiconductor wafer, 2... Cutting line (scribe line), 3, 10, 20... Measurement pad, 10a, 20a... Slit, 10b, 20
b...Remaining part of the pad, C...Cutting width.
Claims (1)
配設され、切断幅よりも大きな幅をもつ導電性の
測定用パツドにおいて、 前記パツドの切断幅よりも外側に位置する箇所
に、その箇所を分割するためのスリツトを形成し
たことを特徴とする測定用パツド。[Claims for Utility Model Registration] In a conductive measuring pad that is arranged on a planned cutting line on a substrate on which an integrated circuit is formed and has a width larger than the cutting width, outside the cutting width of the pad. A measuring pad characterized in that a slit is formed at a position to divide the position.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP734987U JPH0514513Y2 (en) | 1987-01-21 | 1987-01-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP734987U JPH0514513Y2 (en) | 1987-01-21 | 1987-01-21 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63115222U true JPS63115222U (en) | 1988-07-25 |
| JPH0514513Y2 JPH0514513Y2 (en) | 1993-04-19 |
Family
ID=30790717
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP734987U Expired - Lifetime JPH0514513Y2 (en) | 1987-01-21 | 1987-01-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0514513Y2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01186652A (en) * | 1988-01-14 | 1989-07-26 | Seiko Epson Corp | Semiconductor device |
| KR100960890B1 (en) | 2007-12-27 | 2010-06-04 | 주식회사 동부하이텍 | Test pattern of process change monitor for testing metal lines |
-
1987
- 1987-01-21 JP JP734987U patent/JPH0514513Y2/ja not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01186652A (en) * | 1988-01-14 | 1989-07-26 | Seiko Epson Corp | Semiconductor device |
| KR100960890B1 (en) | 2007-12-27 | 2010-06-04 | 주식회사 동부하이텍 | Test pattern of process change monitor for testing metal lines |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0514513Y2 (en) | 1993-04-19 |