JPS63108971A - 自動ハンダコ−ト装置 - Google Patents

自動ハンダコ−ト装置

Info

Publication number
JPS63108971A
JPS63108971A JP61251925A JP25192586A JPS63108971A JP S63108971 A JPS63108971 A JP S63108971A JP 61251925 A JP61251925 A JP 61251925A JP 25192586 A JP25192586 A JP 25192586A JP S63108971 A JPS63108971 A JP S63108971A
Authority
JP
Japan
Prior art keywords
solder
rollers
lead frame
lead
pair
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP61251925A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0244625B2 (enExample
Inventor
Shigeaki Kataoka
片岡　繁昭
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Seiki Machine Works Ltd
Original Assignee
Fuji Seiki Machine Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Seiki Machine Works Ltd filed Critical Fuji Seiki Machine Works Ltd
Priority to JP61251925A priority Critical patent/JPS63108971A/ja
Priority to US07/100,189 priority patent/US4836131A/en
Publication of JPS63108971A publication Critical patent/JPS63108971A/ja
Publication of JPH0244625B2 publication Critical patent/JPH0244625B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • B23K3/0692—Solder baths with intermediary means for bringing solder on workpiece, e.g. rollers

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
JP61251925A 1986-10-24 1986-10-24 自動ハンダコ−ト装置 Granted JPS63108971A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP61251925A JPS63108971A (ja) 1986-10-24 1986-10-24 自動ハンダコ−ト装置
US07/100,189 US4836131A (en) 1986-10-24 1987-09-23 Solder coating apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61251925A JPS63108971A (ja) 1986-10-24 1986-10-24 自動ハンダコ−ト装置

Publications (2)

Publication Number Publication Date
JPS63108971A true JPS63108971A (ja) 1988-05-13
JPH0244625B2 JPH0244625B2 (enExample) 1990-10-04

Family

ID=17230010

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61251925A Granted JPS63108971A (ja) 1986-10-24 1986-10-24 自動ハンダコ−ト装置

Country Status (2)

Country Link
US (1) US4836131A (enExample)
JP (1) JPS63108971A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63170074U (enExample) * 1987-04-27 1988-11-04
JPH026162U (enExample) * 1988-06-21 1990-01-16
CN115116916A (zh) * 2022-08-29 2022-09-27 遂宁合芯半导体有限公司 一种半导体封装用引线焊接装置

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3881185D1 (de) * 1987-12-28 1993-06-24 Fuji Seiki Machine Works Verfahren und geraet zur beschichtung von elektrischen leitungen.
US5139822A (en) * 1990-08-20 1992-08-18 Amp Incorporated Method for coating solder on selective areas of a metal strip
JP3075610B2 (ja) * 1991-10-07 2000-08-14 株式会社不二精機製造所 ハンダコーテイング装置
US5381508A (en) * 1993-08-25 1995-01-10 Krumenacher; Paul F. Suction and light guide assembly
CN103717340B (zh) * 2012-08-02 2018-11-20 株式会社谷黑组 具有电极熔蚀防止层的部件及其制造方法
US9573214B2 (en) 2014-08-08 2017-02-21 Merlin Solar Technologies, Inc. Solder application method and apparatus

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5425234U (enExample) * 1977-07-22 1979-02-19
JPS5467724U (enExample) * 1977-10-20 1979-05-14
JPS558270A (en) * 1978-07-03 1980-01-21 Mitsubishi Electric Corp Gas insulated bus

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1707611A (en) * 1924-02-16 1929-04-02 Hamburger Apparatus for producing rolls of nonfraying material
US1654214A (en) * 1925-01-22 1927-12-27 Goodrich Co B F Apparatus for coating strip material
US1788610A (en) * 1927-03-30 1931-01-13 United Shoe Machinery Corp Heel-lift-cementing machine
GB526301A (en) * 1938-06-09 1940-09-13 American Can Co Improvements relating to mechanism for applying adhesive patterns to two sides of fibrous sheet material and the like
US2588967A (en) * 1949-05-21 1952-03-11 Goodrich Co B F Apparatus for coating strip material
US2754798A (en) * 1953-06-08 1956-07-17 Permafuse Corp Coater device for applying an adhesive agent in viscous fluid form to segments of brake lining friction material
US3006318A (en) * 1958-03-26 1961-10-31 Western Electric Co Apparatus for applying solder coatings to surfaces
US3882816A (en) * 1972-09-22 1975-05-13 Western Electric Co Apparatus for forming layers of fusible metal on articles
DE3108089C2 (de) * 1981-03-04 1987-01-15 Focke & Co, 2810 Verden Vorrichtung zum Auftragen von Leim auf Lappen von Verpackungen

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5425234U (enExample) * 1977-07-22 1979-02-19
JPS5467724U (enExample) * 1977-10-20 1979-05-14
JPS558270A (en) * 1978-07-03 1980-01-21 Mitsubishi Electric Corp Gas insulated bus

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63170074U (enExample) * 1987-04-27 1988-11-04
JPH026162U (enExample) * 1988-06-21 1990-01-16
CN115116916A (zh) * 2022-08-29 2022-09-27 遂宁合芯半导体有限公司 一种半导体封装用引线焊接装置
CN115116916B (zh) * 2022-08-29 2022-12-13 遂宁合芯半导体有限公司 一种半导体封装用引线焊接装置

Also Published As

Publication number Publication date
US4836131A (en) 1989-06-06
JPH0244625B2 (enExample) 1990-10-04

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