JPS63108648U - - Google Patents
Info
- Publication number
- JPS63108648U JPS63108648U JP1986203811U JP20381186U JPS63108648U JP S63108648 U JPS63108648 U JP S63108648U JP 1986203811 U JP1986203811 U JP 1986203811U JP 20381186 U JP20381186 U JP 20381186U JP S63108648 U JPS63108648 U JP S63108648U
- Authority
- JP
- Japan
- Prior art keywords
- chip
- lead frame
- resin package
- semiconductor device
- sealing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W90/736—
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Die Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986203811U JPS63108648U (enExample) | 1986-12-27 | 1986-12-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986203811U JPS63108648U (enExample) | 1986-12-27 | 1986-12-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63108648U true JPS63108648U (enExample) | 1988-07-13 |
Family
ID=31169491
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986203811U Pending JPS63108648U (enExample) | 1986-12-27 | 1986-12-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63108648U (enExample) |
-
1986
- 1986-12-27 JP JP1986203811U patent/JPS63108648U/ja active Pending