JPS63106508A - Method and apparatus for inspecting mounting state - Google Patents

Method and apparatus for inspecting mounting state

Info

Publication number
JPS63106508A
JPS63106508A JP25181186A JP25181186A JPS63106508A JP S63106508 A JPS63106508 A JP S63106508A JP 25181186 A JP25181186 A JP 25181186A JP 25181186 A JP25181186 A JP 25181186A JP S63106508 A JPS63106508 A JP S63106508A
Authority
JP
Japan
Prior art keywords
circuit
detected
camera
image
mounting state
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP25181186A
Other languages
Japanese (ja)
Inventor
Shinichi Uno
Mitsuji Inoue
Junzo Uchida
Hiroshi Tsukada
Tadanori Komatsu
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP25181186A priority Critical patent/JPS63106508A/en
Publication of JPS63106508A publication Critical patent/JPS63106508A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To certainly inspect the mounting state of an object to be detected, by a method wherein the predetermined object containing the object to be detected is irradiated with light from a diagonally upward side and the side opposite to the object to be detected to generate shades on the side surface of the object to be detected and the side surface thereof on the opposite side thereof and unnecessary information is removed from the image informations obtained by said irradiation to perform the matching of shaded patterns with a standard pattern.
CONSTITUTION: A plurality of circuit parts 3aW3d are mounted to the required places of a circuit substrate 1 having a required pattern 2 formed thereon. An image pickup camera 6 is arranged above the board 1 and the predetermined region of the board 1 present within the visual field of the camera 6 is separately irradiated with the lights from light irradiation devices 7a, 7b arranged at diagonally upward parts on both sides of the camera 6. The image informations picked up by the camera 6 are converted by an A/D converter circuit 9 to be respectively recorded on the first and second image memories 10a, 10b. The difference between the image informations of the memories 10a, 10b on the same coordinates is calculated by a subtractor circuit 11 and the matching of the shaded patterns of the image informations with a preset standard pattern is taken by a pattern matching circuit 13 inputting the output from a binarization circuit 12 to inspect the mounting state of the parts 3aW3d.
COPYRIGHT: (C)1988,JPO&Japio
JP25181186A 1986-10-24 1986-10-24 Method and apparatus for inspecting mounting state Pending JPS63106508A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP25181186A JPS63106508A (en) 1986-10-24 1986-10-24 Method and apparatus for inspecting mounting state

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP25181186A JPS63106508A (en) 1986-10-24 1986-10-24 Method and apparatus for inspecting mounting state

Publications (1)

Publication Number Publication Date
JPS63106508A true JPS63106508A (en) 1988-05-11

Family

ID=17228273

Family Applications (1)

Application Number Title Priority Date Filing Date
JP25181186A Pending JPS63106508A (en) 1986-10-24 1986-10-24 Method and apparatus for inspecting mounting state

Country Status (1)

Country Link
JP (1) JPS63106508A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8548224B2 (en) 2009-07-03 2013-10-01 Koh Young Technology Inc. Method for inspecting measurement object
WO2020008713A1 (en) * 2018-07-04 2020-01-09 Dmg森精機株式会社 Measurement device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8548224B2 (en) 2009-07-03 2013-10-01 Koh Young Technology Inc. Method for inspecting measurement object
US20130294679A1 (en) * 2009-07-03 2013-11-07 Koh Young Technology Inc. Method for inspecting measurement object
US8724883B2 (en) * 2009-07-03 2014-05-13 Koh Young Technology Inc. Method for inspecting measurement object
WO2020008713A1 (en) * 2018-07-04 2020-01-09 Dmg森精機株式会社 Measurement device
JP2020008348A (en) * 2018-07-04 2020-01-16 Dmg森精機株式会社 Measuring apparatus

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