JPS6310550U - - Google Patents
Info
- Publication number
- JPS6310550U JPS6310550U JP1986105213U JP10521386U JPS6310550U JP S6310550 U JPS6310550 U JP S6310550U JP 1986105213 U JP1986105213 U JP 1986105213U JP 10521386 U JP10521386 U JP 10521386U JP S6310550 U JPS6310550 U JP S6310550U
- Authority
- JP
- Japan
- Prior art keywords
- flattening layer
- semiconductor device
- semiconductor chip
- utility
- device characterized
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8338—Bonding interfaces outside the semiconductor or solid-state body
- H01L2224/83385—Shape, e.g. interlocking features
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15151—Shape the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Die Bonding (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986105213U JPH0735389Y2 (ja) | 1986-07-09 | 1986-07-09 | 半導体装置 |
KR2019870007249U KR920005952Y1 (ko) | 1986-07-06 | 1987-05-13 | 반도체장치 |
MYPI87000928A MY102308A (en) | 1986-07-09 | 1987-07-01 | Hybrid printed circuit structures |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986105213U JPH0735389Y2 (ja) | 1986-07-09 | 1986-07-09 | 半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6310550U true JPS6310550U (US06262066-20010717-C00424.png) | 1988-01-23 |
JPH0735389Y2 JPH0735389Y2 (ja) | 1995-08-09 |
Family
ID=14401389
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1986105213U Expired - Lifetime JPH0735389Y2 (ja) | 1986-07-06 | 1986-07-09 | 半導体装置 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JPH0735389Y2 (US06262066-20010717-C00424.png) |
KR (1) | KR920005952Y1 (US06262066-20010717-C00424.png) |
MY (1) | MY102308A (US06262066-20010717-C00424.png) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4489137B1 (ja) * | 2009-01-20 | 2010-06-23 | パナソニック株式会社 | 回路モジュール及び電子機器 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002222914A (ja) * | 2001-01-26 | 2002-08-09 | Sony Corp | 半導体装置及びその製造方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5272468A (en) * | 1975-12-15 | 1977-06-16 | Matsushita Electric Ind Co Ltd | Printed circuit board |
JPS57178446U (US06262066-20010717-C00424.png) * | 1981-05-07 | 1982-11-11 | ||
JPS58150862U (ja) * | 1982-04-01 | 1983-10-08 | パイオニア株式会社 | チツプ部品取付装置 |
JPS60114844U (ja) * | 1984-01-10 | 1985-08-03 | 三菱電機株式会社 | サ−マルヘツド |
JPS6181140U (US06262066-20010717-C00424.png) * | 1984-11-01 | 1986-05-29 |
-
1986
- 1986-07-09 JP JP1986105213U patent/JPH0735389Y2/ja not_active Expired - Lifetime
-
1987
- 1987-05-13 KR KR2019870007249U patent/KR920005952Y1/ko not_active IP Right Cessation
- 1987-07-01 MY MYPI87000928A patent/MY102308A/en unknown
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5272468A (en) * | 1975-12-15 | 1977-06-16 | Matsushita Electric Ind Co Ltd | Printed circuit board |
JPS57178446U (US06262066-20010717-C00424.png) * | 1981-05-07 | 1982-11-11 | ||
JPS58150862U (ja) * | 1982-04-01 | 1983-10-08 | パイオニア株式会社 | チツプ部品取付装置 |
JPS60114844U (ja) * | 1984-01-10 | 1985-08-03 | 三菱電機株式会社 | サ−マルヘツド |
JPS6181140U (US06262066-20010717-C00424.png) * | 1984-11-01 | 1986-05-29 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4489137B1 (ja) * | 2009-01-20 | 2010-06-23 | パナソニック株式会社 | 回路モジュール及び電子機器 |
WO2010084540A1 (ja) * | 2009-01-20 | 2010-07-29 | パナソニック株式会社 | 回路基板、回路モジュール、及び回路モジュールを備えた電子機器 |
JP2010171082A (ja) * | 2009-01-20 | 2010-08-05 | Panasonic Corp | 回路モジュール及び電子機器 |
Also Published As
Publication number | Publication date |
---|---|
MY102308A (en) | 1992-05-28 |
KR880003791U (ko) | 1988-04-14 |
KR920005952Y1 (ko) | 1992-08-27 |
JPH0735389Y2 (ja) | 1995-08-09 |