JPS63105346U - - Google Patents
Info
- Publication number
- JPS63105346U JPS63105346U JP20331486U JP20331486U JPS63105346U JP S63105346 U JPS63105346 U JP S63105346U JP 20331486 U JP20331486 U JP 20331486U JP 20331486 U JP20331486 U JP 20331486U JP S63105346 U JPS63105346 U JP S63105346U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- substrate
- resin
- displacement
- lead wires
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 9
- 238000006073 displacement reaction Methods 0.000 claims description 7
- 230000001105 regulatory effect Effects 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
第１図は本考案になる半導体装置の一実施例の
断面図、第２図は第１図に示す半導体装置の分解
斜視図、第３図はキヤツプを取外した状態の半導
体装置の平面図、第４図は変位規制孔の機能を説
明するための要部断面図、第５図は変位規制部の
他実施例を示す図、第６図は従来の半導体装置に
おいてリード線の断面事故が発生した理由を説明
するための図である。
５……半導体装置、６……フオトダイオード、
８……ステム、９……セラミツク基板、１８……
ＩＣ、２０，２０ａ……樹脂、２１，２７〜２９
……変位規制孔、２５……電極パターン、２６…
…リード線、３０……変位規制突起、３１……変
位規制部材。
FIG. 1 is a sectional view of an embodiment of the semiconductor device according to the present invention, FIG. 2 is an exploded perspective view of the semiconductor device shown in FIG. 1, and FIG. 3 is a plan view of the semiconductor device with the cap removed. Fig. 4 is a cross-sectional view of the main part to explain the function of the displacement regulating hole, Fig. 5 is a diagram showing another embodiment of the displacement regulating part, and Fig. 6 is a cross-sectional view of a lead wire in a conventional semiconductor device. FIG. 5...Semiconductor device, 6...Photodiode,
8... Stem, 9... Ceramic substrate, 18...
IC, 20, 20a...Resin, 21, 27-29
...Displacement regulation hole, 25... Electrode pattern, 26...
...Lead wire, 30...Displacement regulating protrusion, 31...Displacement regulating member.
Claims (1)
をリード線接続すると共に該半導体素子及びリー
ド線を被覆して該基板上に樹脂を覆設する構成の
半導体装置において、上記覆設時における該樹脂
の変位を規制する変位規制部を該基板に設けてな
ることを特徴とする半導体装置。 In a semiconductor device having a structure in which an electrode pattern provided on a substrate and a semiconductor element are connected by lead wires, and the semiconductor element and lead wires are covered with a resin, the resin is coated on the substrate during the covering. A semiconductor device characterized in that the substrate is provided with a displacement regulating section for regulating displacement.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20331486U JPS63105346U (en) | 1986-12-24 | 1986-12-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20331486U JPS63105346U (en) | 1986-12-24 | 1986-12-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63105346U true JPS63105346U (en) | 1988-07-08 |
Family
ID=31168526
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20331486U Pending JPS63105346U (en) | 1986-12-24 | 1986-12-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63105346U (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5511361A (en) * | 1978-07-11 | 1980-01-26 | Citizen Watch Co Ltd | Semiconductor fitting construction |
| JPS5516491A (en) * | 1978-07-24 | 1980-02-05 | Fujitsu Ltd | Semiconductor device |
| JPS5926254B2 (en) * | 1980-12-24 | 1984-06-26 | 株式会社幸和工業 | Steam venting mechanism of baking mold in corn cup manufacturing equipment |
-
1986
- 1986-12-24 JP JP20331486U patent/JPS63105346U/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5511361A (en) * | 1978-07-11 | 1980-01-26 | Citizen Watch Co Ltd | Semiconductor fitting construction |
| JPS5516491A (en) * | 1978-07-24 | 1980-02-05 | Fujitsu Ltd | Semiconductor device |
| JPS5926254B2 (en) * | 1980-12-24 | 1984-06-26 | 株式会社幸和工業 | Steam venting mechanism of baking mold in corn cup manufacturing equipment |