JPS6297763A - はんだ付け方法および装置 - Google Patents

はんだ付け方法および装置

Info

Publication number
JPS6297763A
JPS6297763A JP23756485A JP23756485A JPS6297763A JP S6297763 A JPS6297763 A JP S6297763A JP 23756485 A JP23756485 A JP 23756485A JP 23756485 A JP23756485 A JP 23756485A JP S6297763 A JPS6297763 A JP S6297763A
Authority
JP
Japan
Prior art keywords
brush
soldering
solder
soldered
thin metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP23756485A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0523871B2 (enrdf_load_stackoverflow
Inventor
Mitsuo Zen
三津夫 禅
Yuji Kawamata
勇司 川又
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SENJIYU KINZOKU KOGYO KK
Senju Metal Industry Co Ltd
Original Assignee
SENJIYU KINZOKU KOGYO KK
Senju Metal Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SENJIYU KINZOKU KOGYO KK, Senju Metal Industry Co Ltd filed Critical SENJIYU KINZOKU KOGYO KK
Priority to JP23756485A priority Critical patent/JPS6297763A/ja
Publication of JPS6297763A publication Critical patent/JPS6297763A/ja
Publication of JPH0523871B2 publication Critical patent/JPH0523871B2/ja
Granted legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06Solder feeding devices; Solder melting pans
    • B23K3/0646Solder baths

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Molten Solder (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP23756485A 1985-10-25 1985-10-25 はんだ付け方法および装置 Granted JPS6297763A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23756485A JPS6297763A (ja) 1985-10-25 1985-10-25 はんだ付け方法および装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23756485A JPS6297763A (ja) 1985-10-25 1985-10-25 はんだ付け方法および装置

Publications (2)

Publication Number Publication Date
JPS6297763A true JPS6297763A (ja) 1987-05-07
JPH0523871B2 JPH0523871B2 (enrdf_load_stackoverflow) 1993-04-06

Family

ID=17017181

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23756485A Granted JPS6297763A (ja) 1985-10-25 1985-10-25 はんだ付け方法および装置

Country Status (1)

Country Link
JP (1) JPS6297763A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04157064A (ja) * 1990-10-12 1992-05-29 Sanyo Electric Co Ltd 半田付方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04157064A (ja) * 1990-10-12 1992-05-29 Sanyo Electric Co Ltd 半田付方法

Also Published As

Publication number Publication date
JPH0523871B2 (enrdf_load_stackoverflow) 1993-04-06

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