JPS629728Y2 - - Google Patents
Info
- Publication number
- JPS629728Y2 JPS629728Y2 JP1981066438U JP6643881U JPS629728Y2 JP S629728 Y2 JPS629728 Y2 JP S629728Y2 JP 1981066438 U JP1981066438 U JP 1981066438U JP 6643881 U JP6643881 U JP 6643881U JP S629728 Y2 JPS629728 Y2 JP S629728Y2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- adhesive
- frame
- integrated circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000853 adhesive Substances 0.000 claims description 24
- 230000001070 adhesive effect Effects 0.000 claims description 24
- 239000010419 fine particle Substances 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 239000011889 copper foil Substances 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000004399 eye closure Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Casings For Electric Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981066438U JPS629728Y2 (ro) | 1981-05-07 | 1981-05-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981066438U JPS629728Y2 (ro) | 1981-05-07 | 1981-05-07 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57178446U JPS57178446U (ro) | 1982-11-11 |
| JPS629728Y2 true JPS629728Y2 (ro) | 1987-03-06 |
Family
ID=29862478
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1981066438U Expired JPS629728Y2 (ro) | 1981-05-07 | 1981-05-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS629728Y2 (ro) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0735389Y2 (ja) * | 1986-07-09 | 1995-08-09 | ソニー株式会社 | 半導体装置 |
| JP3580082B2 (ja) * | 1997-04-22 | 2004-10-20 | 株式会社村田製作所 | チップ状部品の実装構造および実装方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5121561B2 (ro) * | 1971-11-05 | 1976-07-03 | ||
| JPS5343477A (en) * | 1976-09-30 | 1978-04-19 | Nec Corp | Semiconductor device |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5529241Y2 (ro) * | 1974-08-05 | 1980-07-11 |
-
1981
- 1981-05-07 JP JP1981066438U patent/JPS629728Y2/ja not_active Expired
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5121561B2 (ro) * | 1971-11-05 | 1976-07-03 | ||
| JPS5343477A (en) * | 1976-09-30 | 1978-04-19 | Nec Corp | Semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57178446U (ro) | 1982-11-11 |
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