JPS6295863U - - Google Patents
Info
- Publication number
- JPS6295863U JPS6295863U JP1985185980U JP18598085U JPS6295863U JP S6295863 U JPS6295863 U JP S6295863U JP 1985185980 U JP1985185980 U JP 1985185980U JP 18598085 U JP18598085 U JP 18598085U JP S6295863 U JPS6295863 U JP S6295863U
- Authority
- JP
- Japan
- Prior art keywords
- workpiece
- polishing
- suction hole
- vacuum source
- utilizes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005498 polishing Methods 0.000 claims 3
- 239000007788 liquid Substances 0.000 claims 1
Landscapes
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Description
第１図はこの考案の一実施例を示す全体の正面
図、第２図は同じく要部の断面図である。 １２……保持ヘツド、１２ａ……マウンテイン
グパツド、１３……ワーク保持面、１７……真空
ポンプ（真空源）、２０……吸引孔、ａ……ワー
ク。
図、第２図は同じく要部の断面図である。 １２……保持ヘツド、１２ａ……マウンテイン
グパツド、１３……ワーク保持面、１７……真空
ポンプ（真空源）、２０……吸引孔、ａ……ワー
ク。
Claims (1)
- 保持ヘツドのワーク保持面に液体の表面張力を
利用したマウンテイングパツドによりワークを装
着保持し、このワークを研磨台に接触させて研磨
するものにおいて、上記保持ヘツドのワーク保持
面に吸引孔を形成し、この吸引孔に真空源を接続
したことを特徴とするポリシング装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985185980U JPH0230211Y2 (ja) | 1985-12-04 | 1985-12-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985185980U JPH0230211Y2 (ja) | 1985-12-04 | 1985-12-04 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6295863U true JPS6295863U (ja) | 1987-06-18 |
| JPH0230211Y2 JPH0230211Y2 (ja) | 1990-08-14 |
Family
ID=31135116
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985185980U Expired JPH0230211Y2 (ja) | 1985-12-04 | 1985-12-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0230211Y2 (ja) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52155494A (en) * | 1976-06-21 | 1977-12-23 | Nippon Telegr & Teleph Corp <Ntt> | Process for w orking parallel plane of wafer |
-
1985
- 1985-12-04 JP JP1985185980U patent/JPH0230211Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52155494A (en) * | 1976-06-21 | 1977-12-23 | Nippon Telegr & Teleph Corp <Ntt> | Process for w orking parallel plane of wafer |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0230211Y2 (ja) | 1990-08-14 |