JPS61100136U - - Google Patents

Info

Publication number
JPS61100136U
JPS61100136U JP18569484U JP18569484U JPS61100136U JP S61100136 U JPS61100136 U JP S61100136U JP 18569484 U JP18569484 U JP 18569484U JP 18569484 U JP18569484 U JP 18569484U JP S61100136 U JPS61100136 U JP S61100136U
Authority
JP
Japan
Prior art keywords
bonding
lead frame
mounting table
elastic material
frame mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP18569484U
Other languages
English (en)
Other versions
JPH025536Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1984185694U priority Critical patent/JPH025536Y2/ja
Publication of JPS61100136U publication Critical patent/JPS61100136U/ja
Application granted granted Critical
Publication of JPH025536Y2 publication Critical patent/JPH025536Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary

Description

【図面の簡単な説明】
第１図及び第２図は本考案の一実施例を示し、
第１図はリードフレーム載置台の要部斜視図、第
２図はフレーム押えの要部斜視図、第３図は従来
のボンデイング装置の説明斜視図である。 １：リードフレーム、２：リードフレーム載置
台、２ａ：凹部、５：フレーム押え、１２：弾性
材、１３：コマ、１５：弾性材。

Claims (1)

  1. 【実用新案登録請求の範囲】 (1) リードフレームをフレーム押えでリードフ
    レーム載置台上に押えた状態でボンデイングする
    ボンデイング装置において、前記リードフレーム
    載置台上のボンデイングステージ部または前記フ
    レーム押えの下面の少なくとも一方に弾性材を設
    けたことを特徴とするボンデイング装置。 (2) 実用新案登録請求の範囲第１項において、
    リードフレーム載置台上のボンデイングステージ
    部に央部を形成し、この凹部に弾性材を取付けた
    コマを着脱自在に配設したことを特徴とするボン
    デイング装置。
JP1984185694U 1984-12-07 1984-12-07 Expired JPH025536Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984185694U JPH025536Y2 (ja) 1984-12-07 1984-12-07

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984185694U JPH025536Y2 (ja) 1984-12-07 1984-12-07

Publications (2)

Publication Number Publication Date
JPS61100136U true JPS61100136U (ja) 1986-06-26
JPH025536Y2 JPH025536Y2 (ja) 1990-02-09

Family

ID=30743159

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984185694U Expired JPH025536Y2 (ja) 1984-12-07 1984-12-07

Country Status (1)

Country Link
JP (1) JPH025536Y2 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002313834A (ja) * 2001-04-16 2002-10-25 Sanken Electric Co Ltd ボンディングステージ、ワイヤボンダ及び回路基板実装体の実装方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53159271U (ja) * 1977-05-20 1978-12-13
JPS542370U (ja) * 1977-06-08 1979-01-09
JPS57154848A (en) * 1981-03-20 1982-09-24 Hitachi Ltd Assembling device for semiconductor
JPS57194539A (en) * 1981-05-27 1982-11-30 Hitachi Ltd Pressing structure for lead frame

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3769650A (en) * 1972-10-20 1973-11-06 C Newell Battery terminal cleaner and shaper

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53159271U (ja) * 1977-05-20 1978-12-13
JPS542370U (ja) * 1977-06-08 1979-01-09
JPS57154848A (en) * 1981-03-20 1982-09-24 Hitachi Ltd Assembling device for semiconductor
JPS57194539A (en) * 1981-05-27 1982-11-30 Hitachi Ltd Pressing structure for lead frame

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002313834A (ja) * 2001-04-16 2002-10-25 Sanken Electric Co Ltd ボンディングステージ、ワイヤボンダ及び回路基板実装体の実装方法
JP4604384B2 (ja) * 2001-04-16 2011-01-05 サンケン電気株式会社 回路基板実装体の実装方法

Also Published As

Publication number Publication date
JPH025536Y2 (ja) 1990-02-09

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