JPS6295248A - Thermal printing head apparatus - Google Patents

Thermal printing head apparatus

Info

Publication number
JPS6295248A
JPS6295248A JP23687485A JP23687485A JPS6295248A JP S6295248 A JPS6295248 A JP S6295248A JP 23687485 A JP23687485 A JP 23687485A JP 23687485 A JP23687485 A JP 23687485A JP S6295248 A JPS6295248 A JP S6295248A
Authority
JP
Japan
Prior art keywords
leads
common
head
wiring board
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP23687485A
Other languages
Japanese (ja)
Other versions
JPH0712698B2 (en
Inventor
Hiroaki Onishi
弘朗 大西
Hiroshi Fukumoto
博 福本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Priority to JP23687485A priority Critical patent/JPH0712698B2/en
Publication of JPS6295248A publication Critical patent/JPS6295248A/en
Publication of JPH0712698B2 publication Critical patent/JPH0712698B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
    • B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
    • B41J2/345—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads characterised by the arrangement of resistors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits

Landscapes

  • Electronic Switches (AREA)

Abstract

PURPOSE:To unify and integrate all of common leads, by superposing a FP wiring board to a head to mutually connect respective individual leads and respective common leads and electrically connecting the common leads of the FP wiring board to a connection lead. CONSTITUTION:Individual leads 7 connected to the individual leads 3 of a head 1, common leads 11 connected to common leads 10 and a unifying common lead 12 provided in parallel to the individual leads 7 in the side thereof are provided on one surface of a FP wiring board 5 while a connection lead 14 electrically connected to the unifying common lead 12 by a through-hole 13 is provided to the other surface of said wiring board 5. The end part of the FP wiring board 5 is superposed to the end part of the head 1, and leads 3, 7 and leads 10, 11 are mutually contacted to be connected by soldering. Then, the connection lead 14 is electrically connected to the common leads 11 and the unifying common lead 12 by through-holes 13, 15. By this method, the common leads 10 are collectively connected to the unifying common lead 12 through the common leads 11 and the connection lead 14.

Description

【発明の詳細な説明】 （産業上の利用分野） この発明はサーマルプリントヘッド装置に関する。[Detailed description of the invention] (Industrial application field) The present invention relates to a thermal print head device.

（従来の技術） 周知のようにこの種サーマルプリントヘッド装置は、セ
ラミック製の基板の表面に設けられた発熱部と、これか
ら導出されてあるリードとよりなるヘッドと、フレキシ
ブルプリント配線板（以下単にＦＰ配線板）とによって
構成される。そしてヘッドのリードをＦＰ配線板のリー
ドとを接続することによって、前記リードを外部に導出
するようにしている。(Prior Art) As is well known, this type of thermal print head device consists of a head consisting of a heat generating part provided on the surface of a ceramic substrate, leads derived from the heat generating part, and a flexible printed wiring board (hereinafter simply referred to as FP wiring board). By connecting the leads of the head to the leads of the FP wiring board, the leads are led to the outside.

第３図は一般のこの種ヘッドを示し、１はセラミックな
どからなる基板、２はその表面に設けられた発熱部で、
図では例として６箇の発熱部を備えたものを示している
。３は各発熱部２の一方の端部に接続されてある個別リ
ード、４は他方の各端部に共通に接続されてある統一共
通リードである。５はＦＰ配線板で、その樹脂製のベー
ス６の一方の面に、前記各個別リード３に接続される個
別リード７と、統一共通り−ド４に接続される統一共通
り一ド８とを備えている。Figure 3 shows a general head of this type, where 1 is a substrate made of ceramic or the like, 2 is a heat generating part provided on its surface,
The figure shows an example with six heat generating parts. 3 is an individual lead connected to one end of each heat generating part 2, and 4 is a unified common lead commonly connected to each other end. Reference numeral 5 denotes an FP wiring board, on one side of which is a resin base 6, individual leads 7 connected to the respective individual leads 3, and a unified common lead 8 connected to the unified common lead 4. It is equipped with

実際にはヘッド１上のリードとＦＰ配線板Ｓ上のリード
とは互いに重ね合せてから、半田によって接続されるの
が一般的である。そのためにＦＰ配線板５にはヘッド１
の表面と向い合う面、すなわち図では裏側の面に各リー
ド７．８が現れるようにし、これをそのままヘッド１の
表面に重ね合わすようにしている。In practice, the leads on the head 1 and the leads on the FP wiring board S are generally overlapped with each other and then connected by soldering. For this purpose, the head 1 is mounted on the FP wiring board 5.
The leads 7 and 8 are made to appear on the surface facing the surface of the head 1, that is, on the back side in the figure, and are overlapped directly on the surface of the head 1.

ところでこのような構成は発熱部２の列がヘッド１のほ
ぼ中央あるいは端部からある程度離れたところに設置さ
れてあって、その列の一方の側に統一共通り−ド４が設
置できる余裕のある空間が存在しているときに限って製
作できる。しかしヘッドの種類によっては発熱部をヘッ
ドの一方の側縁に近接して設置することが要求されるこ
とがある。このような場合は発熱部の列の一方の側とヘ
ッドの側縁との間の空間が狭くなりすぎてしまい、そこ
に前記したような統一共通リードを設置することができ
ないようになる。Incidentally, in such a configuration, the row of heat generating parts 2 is installed approximately at the center of the head 1 or at a certain distance from the end, and there is enough room to install the unified common board 4 on one side of the row. It can only be produced when a certain space exists. However, depending on the type of head, it may be necessary to install the heat generating part close to one side edge of the head. In such a case, the space between one side of the row of heat generating parts and the side edge of the head becomes too narrow, making it impossible to install the unified common lead as described above there.

これを解決しようとしたのが第４図に示す構成である。The configuration shown in FIG. 4 is an attempt to solve this problem.

これは各発熱部の２箇を１群としその各群に属する２個
の発熱部２Ａ、２Ｂの一方の端部を短絡導体９によって
短絡しておき、またひとつの群のひとつの発熱部２Ａと
、これに隣接する他の群に属する他のひとつの発熱部２
Ｂとに共通する共通り−ド１０を設けたものである。This is done by arranging two of each heat generating part into a group, one end of each of the two heat generating parts 2A and 2B belonging to each group is short-circuited by a shorting conductor 9, and one heat generating part 2A of one group is short-circuited. and another heat generating part 2 belonging to another group adjacent to this
A common board 10 is provided which is common to both.

これによれば発熱部の列の一方の側とヘッドの側縁との
間には、幅が狭くてよい短絡導体９を設置するだけの空
間が確保されるだけでよいので、発熱部をヘッドの側縁
に可及的に接近して設置できるようになって都合がよい
。なおこの構成ではひとつの個別リードとこれに隣合う
共通リードとの間に電圧を印加すれば、両リード間にあ
る２箇の発熱部が同時に発熱するようになっている。According to this, it is only necessary to secure a space between one side of the row of heat generating parts and the side edge of the head to install the shorting conductor 9, which may have a narrow width. It is convenient because it can be installed as close as possible to the side edge of the In this configuration, if a voltage is applied between one individual lead and the adjacent common lead, the two heat generating parts between the leads simultaneously generate heat.

しかしこのような構成のヘッドに連なるＦＰ配線板のリ
ードは、ヘッドのリードパターンと合致させなければな
らない。そのためＦＰ配線板の共通リードは個別リード
の間に点在するようになり、第３図に示すようにすべて
を一括したものにはならない。したがってこのＦＰ配線
板に接続される他の回路との接続作業が極めて煩雑とな
る。However, the leads of the FP wiring board connected to the head with such a configuration must match the lead pattern of the head. Therefore, the common leads of the FP wiring board are scattered among the individual leads, and are not all integrated as shown in FIG. Therefore, the connection work with other circuits connected to this FP wiring board becomes extremely complicated.

（発明が解決しようとする問題点） この発明は発熱部の列をヘッドの側縁に接近して設置し
ても、ＦＰ配線板では全ての共通リードを統一して一括
することを目的とする。(Problems to be Solved by the Invention) The purpose of this invention is to unify all the common leads on the FP wiring board even if the row of heat generating parts is installed close to the side edge of the head. .

（問題点を解決するための手段） この発明はＦＰ配線板として、その一方の面にヘッドの
個別リードおよび共通リードのそれぞれに接続される個
別リードおよび共通リードと、この個別リードの群の少
なくとも一方の側に並設される統一共通リードとを、ま
た他方の面には前記統一共通リードしこ電気的に接続さ
れてある接続リードとを設け、このＦＰ配線板をヘッド
に重ねてそれぞれの個別リードと、それぞれの共通リー
ドとを互いに接続するとともに、ＦＰ配線板の各共通リ
ードを前記接続リードに電気的に接続したことを特徴と
する。(Means for Solving the Problems) The present invention is an FP wiring board, and has at least one of the individual leads and the common lead connected to the individual leads and the common lead of the head on one surface thereof, and the group of the individual leads. A unified common lead arranged in parallel on one side and a connecting lead electrically connected to the unified common lead are provided on the other side, and this FP wiring board is stacked on the head, and each The present invention is characterized in that the individual leads and the respective common leads are connected to each other, and each common lead of the FP wiring board is electrically connected to the connection lead.

（実施例） この発明の実施例を第１図乃至第３図によって説明する
。ここに使用するヘッドは第５図に示したものと同じで
、これに図のようなＦＰ配線板５を使用する。このＦＰ
配線板５はリードがその表裏両面に設けである２Ｍ構造
とされてある。(Example) An example of the present invention will be described with reference to FIGS. 1 to 3. The head used here is the same as that shown in FIG. 5, and an FP wiring board 5 as shown in the figure is used for this. This FP
The wiring board 5 has a 2M structure in which leads are provided on both the front and back sides.

すなわち一方の面にはヘッド１の個別リード３に接続さ
れる個別リード７と、共通リード１０に接続される共通
り−ド１１と、前記個別リード７の群の少なくとも一方
の側に並設される統一共通リード１２とが設けられてあ
る。また他方の面には前記統一共通リード１２に電気的
にたとえばスルーホール１３によって接続されてある接
続り一ド１４が設けである。That is, on one side, the individual leads 7 connected to the individual leads 3 of the head 1, the common lead 11 connected to the common lead 10, and the group of individual leads 7 are arranged in parallel on at least one side. A unified common lead 12 is provided. Further, on the other side, a connection lead 14 is provided which is electrically connected to the unified common lead 12 by, for example, a through hole 13.

そしてこのＦＰ配線板５をヘッド１に重ねて両個別リー
ド３，７と、両共通リード１０．１１とを互いに接続す
るとともに、ＦＰ配線板５の統一共通リード１２に電気
的に接続されてある接続リード１４に、共通リード１１
を電気的にたとえばスルーホール１５によって接続され
てある。Then, this FP wiring board 5 is stacked on the head 1, and both individual leads 3 and 7 and both common leads 10 and 11 are connected to each other and electrically connected to the unified common lead 12 of the FP wiring board 5. Common lead 11 to connection lead 14
are electrically connected by, for example, a through hole 15.

なお図では統一共通り−ド１２は個別リード７の群の一
方の側にのみ設けているが、これに代えて両側に設ける
ようにしてもよい。またリード７゜１１はリード３．１
０に接することができるようにベース６の端部から露出
しておく必要があるが、統一共通リード１２はヘッド１
の各リードに接することのないようにするために、絶縁
性のカバーレイ１６で覆っておくとよい。なおリード１
４もカバーレイ１６で覆っておく。In the figure, the unified common lead 12 is provided only on one side of the group of individual leads 7, but it may be provided on both sides instead. Also, lead 7°11 is lead 3.1
The unified common lead 12 must be exposed from the end of the base 6 so that it can contact the head 1.
In order to prevent the leads from coming into contact with each other, it is preferable to cover them with an insulating coverlay 16. Furthermore, lead 1
4 is also covered with coverlay 16.

以上の構成において、ヘット１の端部にＦＰ配線板５の
端部を重ねて、リード３，７同志およびリード１０．１
１同志を互いに接触させて半田などにより接続する。そ
して共通リート１１、統一共通リート１２に接続リード
１４をスルーホール１３．１５によって電気的に接続す
る。In the above configuration, the ends of the FP wiring board 5 are overlapped with the ends of the head 1, and the leads 3 and 7 and the leads 10.1
1 comrades are brought into contact with each other and connected by soldering or the like. Then, the connection lead 14 is electrically connected to the common REIT 11 and the unified common REIT 12 through the through holes 13.15.

このようにすれば、ヘッド１の表面において個別リード
３、共通り−ド１０が入り乱れて存在していても、共通
リード１ｏはＦＰ配線板５の共通り−ト１１および接続
リード１４を介して統一共通リード１２に一括接続され
るようになる。したがってＦＰ配線板としては第４図に
示したと同様に、個別リードの一括された群と、その一
方の側に並設される統一共通リードとによって構成する
ことができるようになる。In this way, even if the individual leads 3 and the common leads 10 are mixedly present on the surface of the head 1, the common leads 1o can be connected via the common leads 11 and the connecting leads 14 of the FP wiring board 5. It comes to be connected to the unified common lead 12 all at once. Therefore, as shown in FIG. 4, the FP wiring board can be constructed of a group of individual leads and a unified common lead arranged in parallel on one side of the group.

（発明の効果） 以上詳述したようにこの発明によれば、発熱部の列をヘ
ッドの側縁に接近して設置しても、ＦＰ配線板では全て
の共通リードを統一して一括することができるとともに
、統一共通リードを個別リードの群のいずれかの側に並
設することができるといった効果を奏する。(Effects of the Invention) As detailed above, according to the present invention, even if the row of heat generating parts is installed close to the side edge of the head, all the common leads can be unified and integrated on the FP wiring board. In addition, the integrated common lead can be arranged in parallel on either side of the group of individual leads.

【図面の簡単な説明】[Brief explanation of drawings]

第１図はこの発明の実施例を示す平面図、第２図は回正
面図、第３図は同断面図、第４図は従来例の平面図、第
５図はヘッドの平面図である。 １・・・ヘッド、２Ａ、２Ｂ・・・発熱部、３・・・個
別リード、５・・・ＦＰ配線板、７・・個別リード、９
・・短絡導体、１０・・・共通リード、１１・・共通リ
ード、１２・・・統一共通リード、１４・・・接続リー
ド。Fig. 1 is a plan view showing an embodiment of the present invention, Fig. 2 is a front view, Fig. 3 is a sectional view thereof, Fig. 4 is a plan view of a conventional example, and Fig. 5 is a plan view of the head. . DESCRIPTION OF SYMBOLS 1...Head, 2A, 2B...Heating part, 3...Individual lead, 5...FP wiring board, 7...Individual lead, 9
... Short circuit conductor, 10... Common lead, 11... Common lead, 12... Unified common lead, 14... Connection lead.

Claims (1)

【特許請求の範囲】[Claims] ヘッドの表面に設けられてあるプリント用の複数の発熱
部につき、その各２箇を１群とし、その各群に属する２
個の発熱部の一方の端部を短絡導体によって短絡し、ま
たひとつの群のひとつの発熱部と、これに隣接する他の
群に属しかつ前記ひとつの発熱部に隣接する発熱部とに
共通する共通リードを、および隣合わない発熱部に個別
リードを設け、またフレキシブルプリント配線板の一方
の面には前記ヘッドの個別リードに接続される個別リー
ドと、この個別リードの群の少なくとも一方の側に並設
される統一共通リードとを、また他方の面には前記統一
共通リードに電気的に接続されてある接続リードとを設
け、前記フレキシブルプリント配線板を前記ヘッドに重
ね合せて、前記両個別リードと、両共通リードとを互い
に接続するとともに、前記フレキシブルプリント配線板
の各共通リードを電気的に接続してなるサーマルプリン
トヘッド装置。Regarding the plurality of heat generating parts for printing provided on the surface of the head, each two of them are considered as one group, and the two parts belonging to each group are
One end of each heat generating part is short-circuited by a shorting conductor, and one heat generating part of one group is common to the heat generating part belonging to another group adjacent to said heat generating part and adjacent to said one heat generating part. A common lead is provided for the head, and individual leads are provided for non-adjacent heating parts, and one surface of the flexible printed wiring board is provided with individual leads connected to the individual leads of the head, and at least one of the group of individual leads. a unified common lead arranged in parallel on one side and a connection lead electrically connected to the unified common lead on the other side, the flexible printed wiring board is superimposed on the head, and the flexible printed wiring board is superimposed on the head. A thermal print head device in which both individual leads and both common leads are connected to each other, and each common lead of the flexible printed wiring board is electrically connected.
JP23687485A 1985-10-22 1985-10-22 Thermal print head device Expired - Fee Related JPH0712698B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23687485A JPH0712698B2 (en) 1985-10-22 1985-10-22 Thermal print head device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23687485A JPH0712698B2 (en) 1985-10-22 1985-10-22 Thermal print head device

Publications (2)

Publication Number Publication Date
JPS6295248A true JPS6295248A (en) 1987-05-01
JPH0712698B2 JPH0712698B2 (en) 1995-02-15

Family

ID=17007068

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23687485A Expired - Fee Related JPH0712698B2 (en) 1985-10-22 1985-10-22 Thermal print head device

Country Status (1)

Country Link
JP (1) JPH0712698B2 (en)

Also Published As

Publication number Publication date
JPH0712698B2 (en) 1995-02-15

Similar Documents

Publication Publication Date Title
JPS62229896A (en) Printed wiring board
JPS6295248A (en) Thermal printing head apparatus
JPS6295250A (en) Thermal printing head apparatus
JPS6295249A (en) Thermal printing head apparatus
JPS6295251A (en) Thermal printing head apparatus
JPS6225067A (en) Electrode forming method for thermal head
JPH04335561A (en) Semiconductor device
JPS63292689A (en) Apparatus for circuit wiring of printed substrate
JPH0396357A (en) Thermal head array
JPS63128654A (en) Semiconductor device mounting body
JPH0642370Y2 (en) Printed circuit board equipment
JPH09232708A (en) Connection structure of printed circuit board
JPH01316961A (en) Printed wiring board mounted with ic socket
JP2835505B2 (en) Circuit mounting type panel and power supply separated type circuit connection structure using the same
JPS63229797A (en) Manufacture of thick film integrated circuit
JPH02143493A (en) Multilayered printed-wiring board for both surface mounting use
JPS6337692A (en) Multilayer interconnection board
JPH0672249U (en) Integrated circuit device
JPH0268940A (en) Thin film printed board for bare chip
JPS62259879A (en) Thermal head
JPS61253894A (en) Multilayer printed wiring board
JPS58194393A (en) Device for connecting printed circuit board
JPS61207063U (en)
JPH03160781A (en) Printed board
JPH0527252A (en) Liquid crystal display device

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees