JPS6294654U - - Google Patents

Info

Publication number
JPS6294654U
JPS6294654U JP18606285U JP18606285U JPS6294654U JP S6294654 U JPS6294654 U JP S6294654U JP 18606285 U JP18606285 U JP 18606285U JP 18606285 U JP18606285 U JP 18606285U JP S6294654 U JPS6294654 U JP S6294654U
Authority
JP
Japan
Prior art keywords
mounting base
pressure transducer
semiconductor pressure
metal body
bonded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18606285U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP18606285U priority Critical patent/JPS6294654U/ja
Publication of JPS6294654U publication Critical patent/JPS6294654U/ja
Pending legal-status Critical Current

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  • Pressure Sensors (AREA)
  • Measuring Fluid Pressure (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の実施例を示す断面図である。 1……n形シリコン単結晶基板、2……p形ゲ
ージ抵抗、3……酸化膜、4……アルミニウム電
極、5……金―シリコン共晶合金接合層、6……
p形シリコン取付台、7……金―シリコン共晶合
金接合層、8……金線、9……金属本体、10…
…ハーメチツクシール、11……外部引出線。
FIG. 1 is a sectional view showing an embodiment of the present invention. DESCRIPTION OF SYMBOLS 1... N-type silicon single crystal substrate, 2... P-type gauge resistor, 3... Oxide film, 4... Aluminum electrode, 5... Gold-silicon eutectic alloy bonding layer, 6...
P-type silicon mounting base, 7... Gold-silicon eutectic alloy bonding layer, 8... Gold wire, 9... Metal body, 10...
...Hermetic seal, 11...External leader line.

Claims (1)

【実用新案登録請求の範囲】 1 シリコン基板に一体的にひずみゲージ素子を
形成したダイアフラム形感圧素子を取付台に接合
し前記取付台を金属本体に接合してなる半導体圧
力変換器において、前記取付台が前記シリコン基
板と逆の導電性を有することを特徴とする半導体
圧力変換器。 2 実用新案登録請求の範囲第1項において、感
圧素子、取付台、金属本体の接合を金―シリコン
共晶により行うことを特徴とする半導体圧力変換
器。
[Claims for Utility Model Registration] 1. A semiconductor pressure transducer comprising a diaphragm pressure-sensitive element in which a strain gauge element is integrally formed on a silicon substrate is bonded to a mounting base, and the mounting base is bonded to a metal body, A semiconductor pressure transducer characterized in that a mounting base has a conductivity opposite to that of the silicon substrate. 2. A semiconductor pressure transducer according to claim 1 of the utility model registration claim, characterized in that the pressure-sensitive element, the mounting base, and the metal body are joined by gold-silicon eutectic.
JP18606285U 1985-12-04 1985-12-04 Pending JPS6294654U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18606285U JPS6294654U (en) 1985-12-04 1985-12-04

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18606285U JPS6294654U (en) 1985-12-04 1985-12-04

Publications (1)

Publication Number Publication Date
JPS6294654U true JPS6294654U (en) 1987-06-17

Family

ID=31135277

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18606285U Pending JPS6294654U (en) 1985-12-04 1985-12-04

Country Status (1)

Country Link
JP (1) JPS6294654U (en)

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