JPS6291435U - - Google Patents
Info
- Publication number
- JPS6291435U JPS6291435U JP18382085U JP18382085U JPS6291435U JP S6291435 U JPS6291435 U JP S6291435U JP 18382085 U JP18382085 U JP 18382085U JP 18382085 U JP18382085 U JP 18382085U JP S6291435 U JPS6291435 U JP S6291435U
- Authority
- JP
- Japan
- Prior art keywords
- insulating
- insulating substrate
- pellets
- holes
- mounting agent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000008188 pellet Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims 3
- 239000003795 chemical substances by application Substances 0.000 claims 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15151—Shape the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Die Bonding (AREA)
Description
第１図は本考案の混成集積回路装置の一実施例
で同図ａは表面図、同図ｂはａのＡ―Ａ線断面図
である。第２図は従来の混成集積回路装置の一実
施例で同図ａの表面図、同図ｂはａのＡ―Ａ線断
面図である。 １……絶縁基板、２……スルーホール、３……
絶縁ペースト、４……マウント剤、５……ペレツ
ト。
で同図ａは表面図、同図ｂはａのＡ―Ａ線断面図
である。第２図は従来の混成集積回路装置の一実
施例で同図ａの表面図、同図ｂはａのＡ―Ａ線断
面図である。 １……絶縁基板、２……スルーホール、３……
絶縁ペースト、４……マウント剤、５……ペレツ
ト。
Claims (1)
- スルーホールをあけた絶縁基板と、絶縁ベース
トと、マウント剤と、ペレツトとを備え、前記絶
縁基板のスルーホールをカバーする絶縁ペースト
を有し、絶縁ペースト上にマウント剤でペレツト
をマウントすることを特徴とする混成集積回路装
置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18382085U JPS6291435U (ja) | 1985-11-28 | 1985-11-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18382085U JPS6291435U (ja) | 1985-11-28 | 1985-11-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6291435U true JPS6291435U (ja) | 1987-06-11 |
Family
ID=31130904
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18382085U Pending JPS6291435U (ja) | 1985-11-28 | 1985-11-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6291435U (ja) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5842940B2 (ja) * | 1979-01-24 | 1983-09-22 | 株式会社日立メデイコ | 電離箱型ｘ線検出器及びその製造方法 |
-
1985
- 1985-11-28 JP JP18382085U patent/JPS6291435U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5842940B2 (ja) * | 1979-01-24 | 1983-09-22 | 株式会社日立メデイコ | 電離箱型ｘ線検出器及びその製造方法 |