JPS6214742U - - Google Patents
Info
- Publication number
- JPS6214742U JPS6214742U JP1985106201U JP10620185U JPS6214742U JP S6214742 U JPS6214742 U JP S6214742U JP 1985106201 U JP1985106201 U JP 1985106201U JP 10620185 U JP10620185 U JP 10620185U JP S6214742 U JPS6214742 U JP S6214742U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- frame
- positioning hole
- electric element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007789 sealing Methods 0.000 claims 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Description
第１図は、本考案の好適な実施例を示す断面図
である。第２図は、本考案の好適な実施例を基板
に装着した状態を示す断面図である。 １……枠体、２……突起部、３……プリント基
板、４……位置決め穴、６……電気素子、７……
コーテイング樹脂。
である。第２図は、本考案の好適な実施例を基板
に装着した状態を示す断面図である。 １……枠体、２……突起部、３……プリント基
板、４……位置決め穴、６……電気素子、７……
コーテイング樹脂。
Claims (1)
- プリント基板上に配設した電気素子を封止する
リング状枠体に於いて、該枠体のプリント基板と
接する面に突設し且つプリント基板の位置決め穴
の嵌合位置に配設する突起部を具備することを特
徴とするプリント基板におけるモールド用枠体。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985106201U JPS6214742U (ja) | 1985-07-11 | 1985-07-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985106201U JPS6214742U (ja) | 1985-07-11 | 1985-07-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6214742U true JPS6214742U (ja) | 1987-01-29 |
Family
ID=30981337
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985106201U Pending JPS6214742U (ja) | 1985-07-11 | 1985-07-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6214742U (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02170379A (ja) * | 1988-12-23 | 1990-07-02 | Sanyo Electric Co Ltd | 混成集積回路のコネクタ構造 |
-
1985
- 1985-07-11 JP JP1985106201U patent/JPS6214742U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02170379A (ja) * | 1988-12-23 | 1990-07-02 | Sanyo Electric Co Ltd | 混成集積回路のコネクタ構造 |