JPS6236541U - - Google Patents
Info
- Publication number
- JPS6236541U JPS6236541U JP1985127078U JP12707885U JPS6236541U JP S6236541 U JPS6236541 U JP S6236541U JP 1985127078 U JP1985127078 U JP 1985127078U JP 12707885 U JP12707885 U JP 12707885U JP S6236541 U JPS6236541 U JP S6236541U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- frame
- ring
- shaped frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000465 moulding Methods 0.000 claims 1
- 238000007789 sealing Methods 0.000 claims 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は、本考案の好適な第１実施例を示す断
面図である。第２図は、本考案の好適な第１実施
例を基板に装着した状態を示す断面図である。第
３図は、本考案の好適な第２実施例を示す断面図
である。 １，８……枠体、２，９１……突起部、３……
プリント基板、４……位置決め穴、６……電気素
子、７……コーテイング樹脂、９……支持部材、
２１，９２……係止手段としての係止部。
面図である。第２図は、本考案の好適な第１実施
例を基板に装着した状態を示す断面図である。第
３図は、本考案の好適な第２実施例を示す断面図
である。 １，８……枠体、２，９１……突起部、３……
プリント基板、４……位置決め穴、６……電気素
子、７……コーテイング樹脂、９……支持部材、
２１，９２……係止手段としての係止部。
Claims (1)
- プリント基板上に配設した電気素子を封止する
リング状枠体に於いて、該枠体のプリント基板と
接する面に突設し、プリント基板の位置決め穴の
嵌合位置に配設し且つ係止手段を有する突起部を
具備することを特徴とするプリント基板における
モールド用枠体。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985127078U JPS6236541U (ja) | 1985-08-20 | 1985-08-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985127078U JPS6236541U (ja) | 1985-08-20 | 1985-08-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6236541U true JPS6236541U (ja) | 1987-03-04 |
Family
ID=31021483
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985127078U Pending JPS6236541U (ja) | 1985-08-20 | 1985-08-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6236541U (ja) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6444637U (ja) * | 1987-09-12 | 1989-03-16 | ||
| JPH04159760A (ja) * | 1990-10-23 | 1992-06-02 | Nec Kyushu Ltd | 半導体集積回路 |
-
1985
- 1985-08-20 JP JP1985127078U patent/JPS6236541U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6444637U (ja) * | 1987-09-12 | 1989-03-16 | ||
| JPH04159760A (ja) * | 1990-10-23 | 1992-06-02 | Nec Kyushu Ltd | 半導体集積回路 |