JPS62843Y2 - - Google Patents
Info
- Publication number
- JPS62843Y2 JPS62843Y2 JP1981136317U JP13631781U JPS62843Y2 JP S62843 Y2 JPS62843 Y2 JP S62843Y2 JP 1981136317 U JP1981136317 U JP 1981136317U JP 13631781 U JP13631781 U JP 13631781U JP S62843 Y2 JPS62843 Y2 JP S62843Y2
- Authority
- JP
- Japan
- Prior art keywords
- polishing
- wafer
- temperature
- temperature measuring
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000005498 polishing Methods 0.000 claims description 56
- 235000012431 wafers Nutrition 0.000 claims description 24
- 239000007788 liquid Substances 0.000 claims description 16
- 239000004065 semiconductor Substances 0.000 claims description 15
- 239000000758 substrate Substances 0.000 claims description 14
- 239000000523 sample Substances 0.000 claims description 7
- 239000004744 fabric Substances 0.000 claims description 5
- 238000000034 method Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 239000000843 powder Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000003351 stiffener Substances 0.000 description 1
- 238000010897 surface acoustic wave method Methods 0.000 description 1
Landscapes
- Measuring Temperature Or Quantity Of Heat (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981136317U JPS5842937U (ja) | 1981-09-16 | 1981-09-16 | 半導体ウエハのポリシング装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981136317U JPS5842937U (ja) | 1981-09-16 | 1981-09-16 | 半導体ウエハのポリシング装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5842937U JPS5842937U (ja) | 1983-03-23 |
| JPS62843Y2 true JPS62843Y2 (enrdf_load_html_response) | 1987-01-09 |
Family
ID=29929649
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1981136317U Granted JPS5842937U (ja) | 1981-09-16 | 1981-09-16 | 半導体ウエハのポリシング装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5842937U (enrdf_load_html_response) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2025074660A (ja) * | 2023-10-30 | 2025-05-14 | 株式会社Sumco | ワークの研磨装置及び研磨方法 |
-
1981
- 1981-09-16 JP JP1981136317U patent/JPS5842937U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5842937U (ja) | 1983-03-23 |
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