JPS6284055U - - Google Patents

Info

Publication number
JPS6284055U
JPS6284055U JP17425185U JP17425185U JPS6284055U JP S6284055 U JPS6284055 U JP S6284055U JP 17425185 U JP17425185 U JP 17425185U JP 17425185 U JP17425185 U JP 17425185U JP S6284055 U JPS6284055 U JP S6284055U
Authority
JP
Japan
Prior art keywords
led array
common electrode
array chips
electrode section
provided corresponding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17425185U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP17425185U priority Critical patent/JPS6284055U/ja
Publication of JPS6284055U publication Critical patent/JPS6284055U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires

Landscapes

  • Dot-Matrix Printers And Others (AREA)
  • Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
  • Exposure Or Original Feeding In Electrophotography (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図ａは本考案の一実施例の構成を示す要部
平面図、第１図ｂは本考案の一実施例の側面図、
第２図ａは従来のＬＥＤアレイヘツドの要部平面
図、第２図ｂは従来のＬＥＤアレイヘツドの側面
図、第３図は従来のＬＥＤアレイヘツドの組立図
、第４図は本考案のＬＥＤアレイヘツドの組立図
である。 １０…ＬＥＤ、１１…アノード電極、１２…Ｌ
ＥＤアレイチツプ、１３…基板、１４…共通電極
部、１５…個別電極部、１６…ワイヤ、１８…接
着部、１９…セラミツクボード、２０…引き出し
電極部、２１…ワイア、２２…接着部。 FIG. 1a is a plan view of essential parts showing the configuration of an embodiment of the present invention, FIG. 1b is a side view of an embodiment of the present invention,
Figure 2a is a plan view of essential parts of a conventional LED array head, Figure 2b is a side view of a conventional LED array head, Figure 3 is an assembly diagram of a conventional LED array head, and Figure 4 is a diagram of the LED array head of the present invention. It is an assembly diagram. 10...LED, 11...Anode electrode, 12...L
ED array chip, 13...Substrate, 14...Common electrode section, 15...Individual electrode section, 16...Wire, 18...Adhesive section, 19...Ceramic board, 20...Extracting electrode section, 21...Wire, 22...Adhesive section.

補正 昭６１．４．４ 図面の簡単な説明を次のように補正する。 明細書第９頁第６行目及び第８行目に「ワイア
」とあるのを「ワイヤ」と補正する。Amendment April 4, 1986 The brief description of the drawing is amended as follows. The word "wire" in the sixth and eighth lines of page 9 of the specification is corrected to "wire."

Claims (1)

【実用新案登録請求の範囲】 それぞれ複数のＬＥＤを有する複数のＬＥＤア
レイチツプと、 前記各ＬＥＤアレイチツプに対応して設けられ
た共通電極部を有し且つ当該共通電極部と各ＬＥ
Ｄアレイチツプ毎の全てのＬＥＤの一方の電極と
の電気的接続をなす如く当該各共通電極部に前記
各ＬＥＤアレイチツプを接着固定して搭載するも
のであつて、前記各ＬＥＤアレイチツプと同等の
熱膨張係数を有するセラミツクボードと、 前記セラミツクボードを接着固定して搭載する
ものであつて、前記各ＬＥＤアレイチツプの各Ｌ
ＥＤの他方の電極に対応して設けられた個別電極
部及び前記共通電極部に対応して設けられた引き
出し電極部を形成した有機材料からなる基板と、 前記各ＬＥＤの他方の電極と前記個別電極部と
の電気的接続及び前記共通電極部と前記引き出し
電極部との電気的接続を行なう配線手段とを具備
することを特徴とするＬＥＤアレイヘツド。[Claims for Utility Model Registration] A plurality of LED array chips each having a plurality of LEDs, and a common electrode section provided corresponding to each of the LED array chips, and the common electrode section and each LE
Each of the LED array chips is adhesively fixed and mounted on each common electrode part so as to make an electrical connection with one electrode of all the LEDs of each D array chip, and the chip has the same thermal expansion as each of the LED array chips. A ceramic board having a coefficient and the ceramic board are adhesively fixed and mounted, and each L of each of the LED array chips
a substrate made of an organic material on which an individual electrode part provided corresponding to the other electrode of the ED and an extraction electrode part provided corresponding to the common electrode part are formed; An LED array head characterized by comprising wiring means for electrically connecting with an electrode section and electrically connecting the common electrode section and the extraction electrode section.
JP17425185U 1985-11-14 1985-11-14 Pending JPS6284055U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17425185U JPS6284055U (en) 1985-11-14 1985-11-14

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17425185U JPS6284055U (en) 1985-11-14 1985-11-14

Publications (1)

Publication Number Publication Date
JPS6284055U true JPS6284055U (en) 1987-05-28

Family

ID=31112457

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17425185U Pending JPS6284055U (en) 1985-11-14 1985-11-14

Country Status (1)

Country Link
JP (1) JPS6284055U (en)

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