JPS6284939U - - Google Patents

Info

Publication number
JPS6284939U
JPS6284939U JP1985175794U JP17579485U JPS6284939U JP S6284939 U JPS6284939 U JP S6284939U JP 1985175794 U JP1985175794 U JP 1985175794U JP 17579485 U JP17579485 U JP 17579485U JP S6284939 U JPS6284939 U JP S6284939U
Authority
JP
Japan
Prior art keywords
pole
light emitting
emitting diodes
terminal piece
display device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1985175794U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985175794U priority Critical patent/JPS6284939U/ja
Publication of JPS6284939U publication Critical patent/JPS6284939U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16245—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape

Landscapes

  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図ないし第４図は、本考案によるＬＥＤ表
示装置の実施例を示し、第１図はリードフレーム
にＬＥＤチツプを並列に接続した一実施例を示す
平面図、第２図は第１図の側面図、第３図は第２
図のチツプ部分の拡大図、第４図は第１図と異な
る実施例を示す平面図、第５図ないし第７図は従
来のＬＥＤ表示装置の一例を示し、第５図は平面
図、第６図は第５図の側面図、第７図は第６図の
チツプ部分の拡大図である。 １ａ，１ｂ：リードフレーム、２：ＬＥＤチツ
プ、３：透明接着剤、６：導電性透明シート、８
：プリント基板の配線。 1 to 4 show an embodiment of an LED display device according to the present invention, FIG. 1 is a plan view showing an embodiment in which LED chips are connected in parallel to a lead frame, and FIG. 2 is a plan view showing an embodiment of the LED display device according to the present invention. side view, Figure 3 is the 2nd
4 is a plan view showing an embodiment different from FIG. 1; FIGS. 5 to 7 show an example of a conventional LED display device; FIG. 6 is a side view of FIG. 5, and FIG. 7 is an enlarged view of the tip portion of FIG. 6. 1a, 1b: lead frame, 2: LED chip, 3: transparent adhesive, 6: conductive transparent sheet, 8
: Printed circuit board wiring.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] プリント配線またはリードフレームによつて形
成された端子片上に複数の発光ダイオードをそれ
ぞれ載置した上で、その一方極を前記端子片に接
着し、他方の極を互に導電性透明シートを介して
接続してなることを特徴とするＬＥＤ表示装置。 A plurality of light emitting diodes are each placed on a terminal piece formed by printed wiring or a lead frame, one pole of the light emitting diodes is glued to the terminal piece, and the other pole is connected to each other through a conductive transparent sheet. An LED display device characterized by being connected.
JP1985175794U 1985-11-15 1985-11-15 Pending JPS6284939U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985175794U JPS6284939U (en) 1985-11-15 1985-11-15

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985175794U JPS6284939U (en) 1985-11-15 1985-11-15

Publications (1)

Publication Number Publication Date
JPS6284939U true JPS6284939U (en) 1987-05-30

Family

ID=31115443

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985175794U Pending JPS6284939U (en) 1985-11-15 1985-11-15

Country Status (1)

Country Link
JP (1) JPS6284939U (en)

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