JPH0381654U - - Google Patents

Info

Publication number
JPH0381654U
JPH0381654U JP14354889U JP14354889U JPH0381654U JP H0381654 U JPH0381654 U JP H0381654U JP 14354889 U JP14354889 U JP 14354889U JP 14354889 U JP14354889 U JP 14354889U JP H0381654 U JPH0381654 U JP H0381654U
Authority
JP
Japan
Prior art keywords
light
substrate
display device
wiring
sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14354889U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP14354889U priority Critical patent/JPH0381654U/ja
Publication of JPH0381654U publication Critical patent/JPH0381654U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/32257—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic the layer connector connecting to a bonding area disposed in a recess of the surface of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Illuminated Signs And Luminous Advertising (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図…本考案の第１の実施例にかかわる発光
表示装置、第２図…発光ダイオード付近の平面図
、第３図…従来の発光表示装置、第４図…本考案
の第２の実施例にかかわる発光表示装置、第５図
…本考案の第３の実施例にかかわる発光表示装置
、第６図…本考案の第４の実施例にかかわる発光
表示装置。 図において、１…基板、２…シート、２−１…
透光部、２−２…遮光部、３…モールド体、４…
発光ダイオード、４−１…接続部、５…ダイボン
デイング部、６−１，６−２…配線、７…中板、
７−１…透光部、７−２…遮光部、８…発光ダイ
オード、９…ダイボンデイング部、１０−１，１
０−２…配線、１１…基板、２０…基板、２１…
シート、２１−１…透光部、２１−２…遮光部、
２２…発光ダイオード、２３…ダイボンデイング
部、２４…金線、２５，２６…リードフレーム、
２７…透明樹脂、２８…遮光板、２９，３０…配
線、３１，３２…半田付け部、Ｄ…発光ダイオー
ド体である。 Fig. 1: A light emitting display device according to a first embodiment of the present invention, Fig. 2: A plan view of the vicinity of a light emitting diode, Fig. 3: A conventional light emitting display device, Fig. 4: A second embodiment of the present invention. A light emitting display device according to an example, FIG. 5: a light emitting display device according to a third embodiment of the present invention, FIG. 6: a light emitting display device according to a fourth embodiment of the present invention. In the figure, 1...substrate, 2...sheet, 2-1...
Transparent part, 2-2... Light shielding part, 3... Mold body, 4...
Light emitting diode, 4-1... Connection part, 5... Die bonding part, 6-1, 6-2... Wiring, 7... Middle plate,
7-1... Transparent part, 7-2... Light shielding part, 8... Light emitting diode, 9... Die bonding part, 10-1, 1
0-2... Wiring, 11... Board, 20... Board, 21...
sheet, 21-1...light-transmitting part, 21-2...light-shielding part,
22... Light emitting diode, 23... Die bonding part, 24... Gold wire, 25, 26... Lead frame,
27... Transparent resin, 28... Light shielding plate, 29, 30... Wiring, 31, 32... Soldering portion, D... Light emitting diode body.

Claims (1)

【実用新案登録請求の範囲】 (1) 配線がプリントされた基板と、該配線にダ
イボンデイングされた発光ダイオードと、該発光
ダイオードの光を通過させる透光部と遮光部とか
ら成り且つ該発光ダイオードと電気的に接続する
ための配線がプリントされたシートと、前記基板
と前記シートとの間の発光ダイオード周辺を除い
た部分をモールドするモールド体とを具えたこと
を特徴とする発光表示装置。 (2) 前記シートを折り返した部分を前記基板と
して用いたことを特徴とする請求項１記載の発光
表示装置。 (3) 前記基板複数個をそれに取り付けられた発
光ダイオードが同方向に光を発するよう積層する
と共に、最下層の基板以外は該発光ダイオードの
光を通過させる透光部を有するものとしたことを
特徴とする請求項１記載の発光表示装置。[Claims for Utility Model Registration] (1) A substrate comprising a substrate on which wiring is printed, a light-emitting diode die-bonded to the wiring, a light-transmitting part through which light from the light-emitting diode passes, and a light-blocking part, and which emits light. A light emitting display device comprising: a sheet on which wiring for electrical connection with a diode is printed; and a mold body for molding a portion between the substrate and the sheet except for the area around the light emitting diode. . (2) The light emitting display device according to claim 1, wherein a folded portion of the sheet is used as the substrate. (3) The plurality of substrates are stacked so that the light-emitting diodes attached to them emit light in the same direction, and the substrates other than the lowest layer have a transparent portion that allows the light from the light-emitting diodes to pass through. The light emitting display device according to claim 1.
JP14354889U 1989-12-12 1989-12-12 Pending JPH0381654U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14354889U JPH0381654U (en) 1989-12-12 1989-12-12

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14354889U JPH0381654U (en) 1989-12-12 1989-12-12

Publications (1)

Publication Number Publication Date
JPH0381654U true JPH0381654U (en) 1991-08-21

Family

ID=31690316

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14354889U Pending JPH0381654U (en) 1989-12-12 1989-12-12

Country Status (1)

Country Link
JP (1) JPH0381654U (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11185517A (en) * 1997-12-24 1999-07-09 Kyocera Corp Reflection type led lighting system with two-layer structure
JP2003081197A (en) * 2001-09-13 2003-03-19 Ishikawajima Harima Heavy Ind Co Ltd Plant enjoying system and method
JP2008161484A (en) * 2006-12-28 2008-07-17 Sansei R & D:Kk Game machine
JP2009010204A (en) * 2007-06-28 2009-01-15 Nichia Corp Light emitting device
WO2014087564A1 (en) * 2012-12-06 2014-06-12 株式会社デンソー Display device
WO2015015719A1 (en) * 2013-07-30 2015-02-05 株式会社デンソー Display apparatus
JP2021503184A (en) * 2018-08-24 2021-02-04 ケーティー・アンド・ジー・コーポレーション Light emitting element and aerosol generator including it

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5613281B2 (en) * 1973-10-25 1981-03-27
JPS59151185A (en) * 1983-02-17 1984-08-29 株式会社東芝 Manufacture of display unit

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5613281B2 (en) * 1973-10-25 1981-03-27
JPS59151185A (en) * 1983-02-17 1984-08-29 株式会社東芝 Manufacture of display unit

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11185517A (en) * 1997-12-24 1999-07-09 Kyocera Corp Reflection type led lighting system with two-layer structure
JP2003081197A (en) * 2001-09-13 2003-03-19 Ishikawajima Harima Heavy Ind Co Ltd Plant enjoying system and method
JP2008161484A (en) * 2006-12-28 2008-07-17 Sansei R & D:Kk Game machine
JP2009010204A (en) * 2007-06-28 2009-01-15 Nichia Corp Light emitting device
CN104854648A (en) * 2012-12-06 2015-08-19 株式会社电装 Display apparatus
WO2014087564A1 (en) * 2012-12-06 2014-06-12 株式会社デンソー Display device
JP2014115345A (en) * 2012-12-06 2014-06-26 Denso Corp Display device
WO2015015719A1 (en) * 2013-07-30 2015-02-05 株式会社デンソー Display apparatus
JP2015028435A (en) * 2013-07-30 2015-02-12 株式会社デンソー Display unit
CN105308419A (en) * 2013-07-30 2016-02-03 株式会社电装 Display apparatus
US9776561B2 (en) 2013-07-30 2017-10-03 Denso Corporation Display apparatus
DE112014003496B4 (en) 2013-07-30 2021-08-19 Denso Corporation Display device
JP2021503184A (en) * 2018-08-24 2021-02-04 ケーティー・アンド・ジー・コーポレーション Light emitting element and aerosol generator including it

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