JPS6188268U - - Google Patents
Info
- Publication number
- JPS6188268U JPS6188268U JP17454184U JP17454184U JPS6188268U JP S6188268 U JPS6188268 U JP S6188268U JP 17454184 U JP17454184 U JP 17454184U JP 17454184 U JP17454184 U JP 17454184U JP S6188268 U JPS6188268 U JP S6188268U
- Authority
- JP
- Japan
- Prior art keywords
- module board
- utility
- scope
- registration request
- led out
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
Description
第1図および第2図は本考案実施例の断面図お
よび斜視図である。
1……印刷配線板、2……孔、3……短リード
、4……長リード、5……モジユール基板、6…
…短リードクリツプ、7……長リードクリツプ、
8……接着剤、9……テープ。
1 and 2 are a sectional view and a perspective view of an embodiment of the present invention. 1... Printed wiring board, 2... Hole, 3... Short lead, 4... Long lead, 5... Module board, 6...
...Short lead clip, 7...Long lead clip,
8...adhesive, 9...tape.
Claims (1)
ードに対して絶縁性テーピング材を装着したモジ
ユール基板。 A module board with insulating taping material attached to multiple leads led out from the top of the module board.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17454184U JPS6188268U (en) | 1984-11-16 | 1984-11-16 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17454184U JPS6188268U (en) | 1984-11-16 | 1984-11-16 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6188268U true JPS6188268U (en) | 1986-06-09 |
Family
ID=30732160
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP17454184U Pending JPS6188268U (en) | 1984-11-16 | 1984-11-16 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6188268U (en) |
-
1984
- 1984-11-16 JP JP17454184U patent/JPS6188268U/ja active Pending
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