JPS6282762U - - Google Patents
Info
- Publication number
- JPS6282762U JPS6282762U JP17524185U JP17524185U JPS6282762U JP S6282762 U JPS6282762 U JP S6282762U JP 17524185 U JP17524185 U JP 17524185U JP 17524185 U JP17524185 U JP 17524185U JP S6282762 U JPS6282762 U JP S6282762U
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit boards
- series
- base material
- line
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims description 5
- 239000000758 substrate Substances 0.000 description 3
Landscapes
- Structure Of Printed Boards (AREA)
Description
第１図は本考案に係るプリント基板連設構体の
一実施例を示す平面図、第２図乃至第４図は第１
図のＡ―Ａ線、Ｂ―Ｂ線、Ｃ―Ｃ線に沿う拡大断
面図である。第５図乃至第１３図は従来のプリン
ト基板用基板母材を説明するためのもので、第５
図は一基板母材の平面図、第６図及び第７図は第
５図のＤ―Ｄ線及びＥ―Ｅ線に沿う拡大断面図、
第８図は他の一基板母材の平面図、第９図及び第
１０図は第８図のＦ―Ｆ線及びＧ―Ｇ線に沿う拡
大断面図、第１１図は本考案の前提となる基板母
材の平面図、第１２図及び第１３図は第１１図の
Ｈ―Ｈ線及びＩ―Ｉ線に沿う拡大断面図である。
１０……基板母材、１１……Ｖカツト部分、１
２……プツシユバツク部分、１３……単位プリン
ト基板。
FIG. 1 is a plan view showing an embodiment of the printed circuit board interconnection structure according to the present invention, and FIGS.
It is an enlarged sectional view taken along the line AA, line BB, and line CC in the figure. Figures 5 to 13 are for explaining the conventional substrate base material for printed circuit boards.
The figure is a plan view of one substrate base material, FIGS. 6 and 7 are enlarged cross-sectional views taken along the lines DD and EE in FIG. 5,
Fig. 8 is a plan view of another substrate base material, Figs. 9 and 10 are enlarged sectional views taken along lines FF and GG in Fig. 8, and Fig. 11 is a premise of the present invention. 12 and 13 are enlarged sectional views taken along line HH and line II in FIG. 11, respectively. 10... Board base material, 11... V cut part, 1
2...Pushback part, 13...Unit printed circuit board.
Claims (1)
かれて同一部分に戻されたプツシユバツク部分と
で切離容易にした単位プリント基板を複数個連設
形成したことを特徴とするプリント基板連設構体
。 A series of printed circuit boards characterized in that a plurality of unit printed circuit boards are formed in series and are easily separated by a V-cut part in which a V-groove is formed in the base material of the board and a push-back part that is punched out and returned to the same part. Structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17524185U JPS6282762U (en) | 1985-11-14 | 1985-11-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17524185U JPS6282762U (en) | 1985-11-14 | 1985-11-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6282762U true JPS6282762U (en) | 1987-05-27 |
Family
ID=31114380
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17524185U Pending JPS6282762U (en) | 1985-11-14 | 1985-11-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6282762U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006060189A (en) * | 2005-02-03 | 2006-03-02 | Taihei Denshi Kogyo Kk | Method of manufacturing processing board |
| JP5037739B1 (en) * | 2012-04-23 | 2012-10-03 | 太平電子工業有限会社 | Mold for processing base plate, method for manufacturing processed plate, and method for manufacturing product plate |
-
1985
- 1985-11-14 JP JP17524185U patent/JPS6282762U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006060189A (en) * | 2005-02-03 | 2006-03-02 | Taihei Denshi Kogyo Kk | Method of manufacturing processing board |
| JP5037739B1 (en) * | 2012-04-23 | 2012-10-03 | 太平電子工業有限会社 | Mold for processing base plate, method for manufacturing processed plate, and method for manufacturing product plate |