JPS6181174U - - Google Patents

Info

Publication number
JPS6181174U
JPS6181174U JP16545784U JP16545784U JPS6181174U JP S6181174 U JPS6181174 U JP S6181174U JP 16545784 U JP16545784 U JP 16545784U JP 16545784 U JP16545784 U JP 16545784U JP S6181174 U JPS6181174 U JP S6181174U
Authority
JP
Japan
Prior art keywords
dividing
dividing line
slit
printed wiring
conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16545784U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP16545784U priority Critical patent/JPS6181174U/ja
Publication of JPS6181174U publication Critical patent/JPS6181174U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structure Of Printed Boards (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の印刷配線基板の一実施例を示
す上面図、第2図は従来の印刷配線基板を示す上
面図である。 1……親基板、7……スリツト、5……導体部
FIG. 1 is a top view showing an embodiment of the printed wiring board of the present invention, and FIG. 2 is a top view showing a conventional printed wiring board. 1... Mother board, 7... Slit, 5... Conductor portion.

Claims (1)

【実用新案登録請求の範囲】 (1) 回路パターンとしての導体部の形成された
親基板に、この親基板を複数の領域に区分する凹
溝またはミシン目等の分割部を形成し、この分割
部を分割線として複数の分割基板を得るよう構成
された印刷配線基板において、前記導体部に近接
する分割部の分割線上に前記導体部に対向してス
リツトを形成したことを特徴とする印刷配線基板
。 (2) スリツトは、導体部を分割線に投影した長
さより長いことを特徴とする実用新案登録請求の
範囲第1項記載の印刷配線基板。
[Claims for Utility Model Registration] (1) A dividing portion such as a groove or a perforation is formed on a parent board on which a conductive portion as a circuit pattern is formed to divide the parent board into a plurality of areas, and A printed wiring board configured to obtain a plurality of divided boards using a part as a dividing line, characterized in that a slit is formed on the dividing line of the dividing part adjacent to the conductor part and facing the conductor part. substrate. (2) The printed wiring board according to claim 1, wherein the slit is longer than the length of the conductor portion projected onto the dividing line.
JP16545784U 1984-10-31 1984-10-31 Pending JPS6181174U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16545784U JPS6181174U (en) 1984-10-31 1984-10-31

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16545784U JPS6181174U (en) 1984-10-31 1984-10-31

Publications (1)

Publication Number Publication Date
JPS6181174U true JPS6181174U (en) 1986-05-29

Family

ID=30723306

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16545784U Pending JPS6181174U (en) 1984-10-31 1984-10-31

Country Status (1)

Country Link
JP (1) JPS6181174U (en)

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