JPS6282574U - - Google Patents
Info
- Publication number
- JPS6282574U JPS6282574U JP17352685U JP17352685U JPS6282574U JP S6282574 U JPS6282574 U JP S6282574U JP 17352685 U JP17352685 U JP 17352685U JP 17352685 U JP17352685 U JP 17352685U JP S6282574 U JPS6282574 U JP S6282574U
- Authority
- JP
- Japan
- Prior art keywords
- jumper wire
- hybrid
- lower layer
- recess
- insulation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000009413 insulation Methods 0.000 claims 2
- 239000004020 conductor Substances 0.000 claims 1
- 230000001681 protective effect Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Multi-Conductor Connections (AREA)
Description
第１図、第２図は本考案の一実施例のジヤンパ
線の斜視図、第３図は実施例の正面図、第４図は
第３図の横断面図である。
１…線材、２，２′…段差、３…接続部、４…
座、５…絶縁基板、６，６′，７…下層配線、８
…配線保護膜、９…はんだ。
1 and 2 are perspective views of a jumper wire according to an embodiment of the present invention, FIG. 3 is a front view of the embodiment, and FIG. 4 is a cross-sectional view of FIG. 3. 1...Wire rod, 2, 2'...Step, 3...Connection part, 4...
seat, 5... insulating substrate, 6, 6', 7... lower layer wiring, 8
...Wiring protective film, 9...Solder.
Claims (1)
いて、下層導体との絶縁性が高信頼度の空気絶縁
構造となるように、ジヤンパ線材に凹部を設けた
ことを特徴とする混成ＩＣ用ジヤンパ線。 A jumper wire for a hybrid IC, characterized in that a recess is provided in the jumper wire so that the jumper wire provided in the multilayer wiring part of the hybrid IC has a highly reliable air insulation structure with insulation from a lower layer conductor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17352685U JPS6282574U (en) | 1985-11-13 | 1985-11-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17352685U JPS6282574U (en) | 1985-11-13 | 1985-11-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6282574U true JPS6282574U (en) | 1987-05-26 |
Family
ID=31111066
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17352685U Pending JPS6282574U (en) | 1985-11-13 | 1985-11-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6282574U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03124572U (en) * | 1990-03-30 | 1991-12-17 |
-
1985
- 1985-11-13 JP JP17352685U patent/JPS6282574U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03124572U (en) * | 1990-03-30 | 1991-12-17 |
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