JPS6278836A - 半導体素子用樹脂封止方法および装置 - Google Patents

半導体素子用樹脂封止方法および装置

Info

Publication number
JPS6278836A
JPS6278836A JP21861785A JP21861785A JPS6278836A JP S6278836 A JPS6278836 A JP S6278836A JP 21861785 A JP21861785 A JP 21861785A JP 21861785 A JP21861785 A JP 21861785A JP S6278836 A JPS6278836 A JP S6278836A
Authority
JP
Japan
Prior art keywords
plunger
motor
resin
pressure
mold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP21861785A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0449256B2 (US20050065096A1-20050324-C00069.png
Inventor
Minoru Tanaka
實 田中
Itaru Matsuo
至 松尾
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP21861785A priority Critical patent/JPS6278836A/ja
Publication of JPS6278836A publication Critical patent/JPS6278836A/ja
Publication of JPH0449256B2 publication Critical patent/JPH0449256B2/ja
Granted legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP21861785A 1985-09-30 1985-09-30 半導体素子用樹脂封止方法および装置 Granted JPS6278836A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21861785A JPS6278836A (ja) 1985-09-30 1985-09-30 半導体素子用樹脂封止方法および装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21861785A JPS6278836A (ja) 1985-09-30 1985-09-30 半導体素子用樹脂封止方法および装置

Publications (2)

Publication Number Publication Date
JPS6278836A true JPS6278836A (ja) 1987-04-11
JPH0449256B2 JPH0449256B2 (US20050065096A1-20050324-C00069.png) 1992-08-11

Family

ID=16722761

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21861785A Granted JPS6278836A (ja) 1985-09-30 1985-09-30 半導体素子用樹脂封止方法および装置

Country Status (1)

Country Link
JP (1) JPS6278836A (US20050065096A1-20050324-C00069.png)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0384122U (US20050065096A1-20050324-C00069.png) * 1989-12-15 1991-08-27
JPH06315960A (ja) * 1994-04-08 1994-11-15 Hitachi Ltd 半導体のレジン封止方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS615884A (ja) * 1984-06-19 1986-01-11 松下電器産業株式会社 洗濯機の蓋スイツチ

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS615884A (ja) * 1984-06-19 1986-01-11 松下電器産業株式会社 洗濯機の蓋スイツチ

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0384122U (US20050065096A1-20050324-C00069.png) * 1989-12-15 1991-08-27
JPH06315960A (ja) * 1994-04-08 1994-11-15 Hitachi Ltd 半導体のレジン封止方法

Also Published As

Publication number Publication date
JPH0449256B2 (US20050065096A1-20050324-C00069.png) 1992-08-11

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