JPS6276527A - ワイヤボンデイングキヤピラリ - Google Patents

ワイヤボンデイングキヤピラリ

Info

Publication number
JPS6276527A
JPS6276527A JP60214602A JP21460285A JPS6276527A JP S6276527 A JPS6276527 A JP S6276527A JP 60214602 A JP60214602 A JP 60214602A JP 21460285 A JP21460285 A JP 21460285A JP S6276527 A JPS6276527 A JP S6276527A
Authority
JP
Japan
Prior art keywords
capillary
wire bonding
tip
outer diameter
bonding capillary
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60214602A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0471336B2 (enrdf_load_stackoverflow
Inventor
Shoji Okada
昭二 岡田
Tadashi Hayashi
林　但
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP60214602A priority Critical patent/JPS6276527A/ja
Publication of JPS6276527A publication Critical patent/JPS6276527A/ja
Publication of JPH0471336B2 publication Critical patent/JPH0471336B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H01L2224/78302—Shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H01L2224/78302—Shape
    • H01L2224/78305—Shape of other portions
    • H01L2224/78307—Shape of other portions outside the capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP60214602A 1985-09-30 1985-09-30 ワイヤボンデイングキヤピラリ Granted JPS6276527A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60214602A JPS6276527A (ja) 1985-09-30 1985-09-30 ワイヤボンデイングキヤピラリ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60214602A JPS6276527A (ja) 1985-09-30 1985-09-30 ワイヤボンデイングキヤピラリ

Publications (2)

Publication Number Publication Date
JPS6276527A true JPS6276527A (ja) 1987-04-08
JPH0471336B2 JPH0471336B2 (enrdf_load_stackoverflow) 1992-11-13

Family

ID=16658428

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60214602A Granted JPS6276527A (ja) 1985-09-30 1985-09-30 ワイヤボンデイングキヤピラリ

Country Status (1)

Country Link
JP (1) JPS6276527A (enrdf_load_stackoverflow)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04144962A (ja) * 1990-10-05 1992-05-19 Toshiba Corp ボンディングキャピラリおよび光コネクタ用部品
JPH04149065A (ja) * 1990-10-12 1992-05-22 Toshiba Corp ボンディングキャピラリおよび光コネクタ用部品
KR100334242B1 (ko) * 2000-04-17 2002-05-03 이강열 와이어 본딩용 캐필러리 소결제, 이를 이용한 와이어본딩용 캐필러리 소결체의 제조 방법 및 이를 적용한 와이어 본딩용 캐필러리 제조 방법
KR100400263B1 (ko) * 2001-07-04 2003-10-01 주식회사 코스마 와이어 본딩용 알루미나-지르코니아 복합체 캐필러리소결체 및 그의 제조 방법

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5190958A (enrdf_load_stackoverflow) * 1975-02-06 1976-08-10
JPS54146168U (enrdf_load_stackoverflow) * 1978-03-31 1979-10-11
JPS55130136A (en) * 1979-03-30 1980-10-08 Toshiba Corp Bonding repair tool
JPS58169919A (ja) * 1982-03-30 1983-10-06 Kyocera Corp 圧着用キヤピラリチツプ
JPS6049634U (ja) * 1983-09-14 1985-04-08 日本電気株式会社 ボンデイング装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5190958A (enrdf_load_stackoverflow) * 1975-02-06 1976-08-10
JPS54146168U (enrdf_load_stackoverflow) * 1978-03-31 1979-10-11
JPS55130136A (en) * 1979-03-30 1980-10-08 Toshiba Corp Bonding repair tool
JPS58169919A (ja) * 1982-03-30 1983-10-06 Kyocera Corp 圧着用キヤピラリチツプ
JPS6049634U (ja) * 1983-09-14 1985-04-08 日本電気株式会社 ボンデイング装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04144962A (ja) * 1990-10-05 1992-05-19 Toshiba Corp ボンディングキャピラリおよび光コネクタ用部品
JPH04149065A (ja) * 1990-10-12 1992-05-22 Toshiba Corp ボンディングキャピラリおよび光コネクタ用部品
KR100334242B1 (ko) * 2000-04-17 2002-05-03 이강열 와이어 본딩용 캐필러리 소결제, 이를 이용한 와이어본딩용 캐필러리 소결체의 제조 방법 및 이를 적용한 와이어 본딩용 캐필러리 제조 방법
KR100400263B1 (ko) * 2001-07-04 2003-10-01 주식회사 코스마 와이어 본딩용 알루미나-지르코니아 복합체 캐필러리소결체 및 그의 제조 방법

Also Published As

Publication number Publication date
JPH0471336B2 (enrdf_load_stackoverflow) 1992-11-13

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