JPS6274362U - - Google Patents

Info

Publication number
JPS6274362U
JPS6274362U JP16572185U JP16572185U JPS6274362U JP S6274362 U JPS6274362 U JP S6274362U JP 16572185 U JP16572185 U JP 16572185U JP 16572185 U JP16572185 U JP 16572185U JP S6274362 U JPS6274362 U JP S6274362U
Authority
JP
Japan
Prior art keywords
terminal portion
land
wiring board
printed wiring
shield case
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16572185U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP16572185U priority Critical patent/JPS6274362U/ja
Publication of JPS6274362U publication Critical patent/JPS6274362U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図乃至第5図は本考案の実施例を説明する
図であり、第3図は電子部品の取付部品の取付け
手順を示す斜視図、第1図は電子部品の高さ調節
がなされる前の状態を説明する第3図の―線
断面図、第2図は取付金具の斜視図、第4図は電
子部品の高さ調節がなされた状態を説明する第3
図の―線断面図、第5図は第4図の平面図で
ある。第6図乃至第11図は従来例を説明する図
であり、第6図は電子部品の取付け手順を示す斜
視図、第7図は取付金具の斜視図、第8図は第6
図の―線断面図、第9図は第6図の―
線断面図、第10図は電子部品の側面図、第1
1図は電子部品が適切な高さに取り付けられてい
ない状態を示す第6図の―線断面図であ
る。 20……電子部品、21……取付金具、22…
…印刷配線板、23……シールドケース、24…
…一方の面、25……他方の面、26……本体部
、31……穴部、32……端子部、33……ラン
ド、35……底面(所定の面)。
Figures 1 to 5 are diagrams explaining an embodiment of the present invention, Figure 3 is a perspective view showing the procedure for attaching parts for electronic components, and Figure 1 is a diagram showing how the height of the electronic component is adjusted. Figure 3 is a cross-sectional view taken along the line - - to explain the previous state, Figure 2 is a perspective view of the mounting bracket, and Figure 4 is the third diagram to explain the state in which the height of the electronic component has been adjusted.
5 is a plan view of FIG. 4. FIG. 6 to 11 are diagrams explaining the conventional example, in which FIG. 6 is a perspective view showing the procedure for installing electronic components, FIG. 7 is a perspective view of the mounting bracket, and FIG.
Figure 9 is a cross-sectional view of Figure 6.
Line sectional view, Figure 10 is a side view of the electronic component, Figure 1
FIG. 1 is a sectional view taken along the line -- in FIG. 6, showing a state in which the electronic components are not installed at an appropriate height. 20...Electronic component, 21...Mounting bracket, 22...
...Printed wiring board, 23...Shield case, 24...
... one surface, 25 ... other surface, 26 ... main body part, 31 ... hole part, 32 ... terminal part, 33 ... land, 35 ... bottom surface (predetermined surface).

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 電子部品の端子部が半田付けされるランドを有
し該ランド間に穴部が形成された印刷配線板と、
該印刷配線板が取り付けられるシールドケースと
、対向する一対の面の一方に前記電子部品の本体
部が半田付けされ他方が前記印刷配線板の穴部か
ら挿入されて前記シールドケースの所定の面に取
り付けられることにより、前記ランド面と対向す
る位置に前記端子部を位置づける取付金具とを具
備し、前記シールドケースの所定の面は、該所定
の面に対して前記取付金具の他方の面をスライド
させたときに前記ランドの面と交差する方向に前
記端子部が移動するように、前記ランドの面に対
して傾斜して形成されていることを特徴とする電
子部品の取付構造。
a printed wiring board having lands to which terminals of electronic components are soldered and holes formed between the lands;
A main body of the electronic component is soldered to one of a pair of opposing surfaces of a shield case to which the printed wiring board is attached, and the other is inserted through a hole in the printed wiring board to a predetermined surface of the shield case. and a mounting bracket that positions the terminal portion at a position facing the land surface when mounted, and a predetermined surface of the shield case slides the other surface of the mounting bracket against the predetermined surface. A mounting structure for an electronic component, characterized in that the terminal portion is formed to be inclined with respect to the surface of the land so that the terminal portion moves in a direction intersecting the surface of the land when the terminal portion is moved.
JP16572185U 1985-10-30 1985-10-30 Pending JPS6274362U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16572185U JPS6274362U (en) 1985-10-30 1985-10-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16572185U JPS6274362U (en) 1985-10-30 1985-10-30

Publications (1)

Publication Number Publication Date
JPS6274362U true JPS6274362U (en) 1987-05-13

Family

ID=31096015

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16572185U Pending JPS6274362U (en) 1985-10-30 1985-10-30

Country Status (1)

Country Link
JP (1) JPS6274362U (en)

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