JPS6273750A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS6273750A
JPS6273750A JP21372085A JP21372085A JPS6273750A JP S6273750 A JPS6273750 A JP S6273750A JP 21372085 A JP21372085 A JP 21372085A JP 21372085 A JP21372085 A JP 21372085A JP S6273750 A JPS6273750 A JP S6273750A
Authority
JP
Japan
Prior art keywords
contact
terminal
external
welding
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP21372085A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0461507B2 (enrdf_load_stackoverflow
Inventor
Naomasa Sugita
尚正 杉田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP21372085A priority Critical patent/JPS6273750A/ja
Publication of JPS6273750A publication Critical patent/JPS6273750A/ja
Publication of JPH0461507B2 publication Critical patent/JPH0461507B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49562—Geometry of the lead-frame for individual devices of subclass H10D
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
JP21372085A 1985-09-27 1985-09-27 半導体装置 Granted JPS6273750A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21372085A JPS6273750A (ja) 1985-09-27 1985-09-27 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21372085A JPS6273750A (ja) 1985-09-27 1985-09-27 半導体装置

Publications (2)

Publication Number Publication Date
JPS6273750A true JPS6273750A (ja) 1987-04-04
JPH0461507B2 JPH0461507B2 (enrdf_load_stackoverflow) 1992-10-01

Family

ID=16643877

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21372085A Granted JPS6273750A (ja) 1985-09-27 1985-09-27 半導体装置

Country Status (1)

Country Link
JP (1) JPS6273750A (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05251620A (ja) * 1992-03-09 1993-09-28 Mitsubishi Electric Corp 半導体装置
US7848112B2 (en) 2006-12-15 2010-12-07 Mitsubishi Electric Corporation Semiconductor device
JP2012124422A (ja) * 2010-12-10 2012-06-28 Denso Corp 半導体装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05251620A (ja) * 1992-03-09 1993-09-28 Mitsubishi Electric Corp 半導体装置
US7848112B2 (en) 2006-12-15 2010-12-07 Mitsubishi Electric Corporation Semiconductor device
US8004847B2 (en) 2006-12-15 2011-08-23 Mitsubishi Electric Corporation Semiconductor device
JP2012124422A (ja) * 2010-12-10 2012-06-28 Denso Corp 半導体装置

Also Published As

Publication number Publication date
JPH0461507B2 (enrdf_load_stackoverflow) 1992-10-01

Similar Documents

Publication Publication Date Title
JPH0318010A (ja) ヒューズ付きコンデンサ及びその組立に使用されるリードフレーム
JPS6273750A (ja) 半導体装置
JPH0750618B2 (ja) 樹脂封止プリント配線基板
JPH01232753A (ja) 半導体装置
JPH0440855B2 (enrdf_load_stackoverflow)
EP0335420A2 (en) Electrical and mechanical joint construction between a printed wiring board and a lead pin
JP2666988B2 (ja) リード接続方法
JPH0436105Y2 (enrdf_load_stackoverflow)
JPS6314357Y2 (enrdf_load_stackoverflow)
JPS6046038A (ja) 集積回路装置
JPH11150208A (ja) 半導体素子の実装方法
JP2590064Y2 (ja) 電気機器の回路基板
JP2673990B2 (ja) コンデンサ
JPH0626175B2 (ja) ヒューズ付きチップ状固体電解コンデンサおよび製造方法
JPH10126030A (ja) 電子部品の端子構造
JPH0438514Y2 (enrdf_load_stackoverflow)
JP2003007380A (ja) 電子部品
JP3317185B2 (ja) 半導体圧力センサの製造方法
JPH0229653Y2 (enrdf_load_stackoverflow)
JPH0331085Y2 (enrdf_load_stackoverflow)
JP2699557B2 (ja) Ｔａｂ形式半導体装置の製造方法
JPH06295656A (ja) 回路保護用素子
JPH0142347Y2 (enrdf_load_stackoverflow)
JPH01235171A (ja) 接続端子
JPS61160923A (ja) ヒユ−ズ付き固体電解コンデンサ