JPS6271294A - 多層セラミツク配線基板 - Google Patents
多層セラミツク配線基板Info
- Publication number
- JPS6271294A JPS6271294A JP21152985A JP21152985A JPS6271294A JP S6271294 A JPS6271294 A JP S6271294A JP 21152985 A JP21152985 A JP 21152985A JP 21152985 A JP21152985 A JP 21152985A JP S6271294 A JPS6271294 A JP S6271294A
- Authority
- JP
- Japan
- Prior art keywords
- multilayer ceramic
- substrate
- aluminum nitride
- conductor
- circuit substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000919 ceramic Substances 0.000 title claims description 32
- 239000000758 substrate Substances 0.000 title description 39
- 239000004020 conductor Substances 0.000 claims description 15
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 13
- ZVWKZXLXHLZXLS-UHFFFAOYSA-N zirconium nitride Chemical compound [Zr]#N ZVWKZXLXHLZXLS-UHFFFAOYSA-N 0.000 claims description 5
- 239000010410 layer Substances 0.000 description 18
- 238000000034 method Methods 0.000 description 10
- 239000000463 material Substances 0.000 description 8
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 6
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 5
- 229910010271 silicon carbide Inorganic materials 0.000 description 5
- 239000000654 additive Substances 0.000 description 4
- 239000012298 atmosphere Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 239000011230 binding agent Substances 0.000 description 3
- 238000010292 electrical insulation Methods 0.000 description 3
- 238000005245 sintering Methods 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- LTPBRCUWZOMYOC-UHFFFAOYSA-N beryllium oxide Inorganic materials O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 description 2
- 229910010293 ceramic material Inorganic materials 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000007935 neutral effect Effects 0.000 description 2
- 230000001603 reducing effect Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- FRWYFWZENXDZMU-UHFFFAOYSA-N 2-iodoquinoline Chemical compound C1=CC=CC2=NC(I)=CC=C21 FRWYFWZENXDZMU-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- 229910007998 ZrF4 Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000011812 mixed powder Substances 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920001610 polycaprolactone Polymers 0.000 description 1
- 239000004632 polycaprolactone Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 210000002966 serum Anatomy 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 230000001988 toxicity Effects 0.000 description 1
- 231100000419 toxicity Toxicity 0.000 description 1
- 150000003755 zirconium compounds Chemical class 0.000 description 1
- OMQSJNWFFJOIMO-UHFFFAOYSA-J zirconium tetrafluoride Chemical compound F[Zr](F)(F)F OMQSJNWFFJOIMO-UHFFFAOYSA-J 0.000 description 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21152985A JPS6271294A (ja) | 1985-09-24 | 1985-09-24 | 多層セラミツク配線基板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21152985A JPS6271294A (ja) | 1985-09-24 | 1985-09-24 | 多層セラミツク配線基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6271294A true JPS6271294A (ja) | 1987-04-01 |
| JPH0413879B2 JPH0413879B2 (enrdf_load_stackoverflow) | 1992-03-11 |
Family
ID=16607389
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21152985A Granted JPS6271294A (ja) | 1985-09-24 | 1985-09-24 | 多層セラミツク配線基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6271294A (enrdf_load_stackoverflow) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57180006A (en) * | 1981-04-30 | 1982-11-05 | Hitachi Ltd | High thermally conductive electric insulator |
| JPS6077186A (ja) * | 1983-09-30 | 1985-05-01 | 株式会社東芝 | 金属化表面を有するセラミツクス焼結体 |
| JPS6077177A (ja) * | 1983-09-30 | 1985-05-01 | 株式会社東芝 | セラミツクス接合体 |
| JPS60173900A (ja) * | 1984-02-20 | 1985-09-07 | 株式会社東芝 | セラミツクス回路基板 |
-
1985
- 1985-09-24 JP JP21152985A patent/JPS6271294A/ja active Granted
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57180006A (en) * | 1981-04-30 | 1982-11-05 | Hitachi Ltd | High thermally conductive electric insulator |
| JPS6077186A (ja) * | 1983-09-30 | 1985-05-01 | 株式会社東芝 | 金属化表面を有するセラミツクス焼結体 |
| JPS6077177A (ja) * | 1983-09-30 | 1985-05-01 | 株式会社東芝 | セラミツクス接合体 |
| JPS60173900A (ja) * | 1984-02-20 | 1985-09-07 | 株式会社東芝 | セラミツクス回路基板 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0413879B2 (enrdf_load_stackoverflow) | 1992-03-11 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |