JPS6258054U - - Google Patents
Info
- Publication number
- JPS6258054U JPS6258054U JP14911485U JP14911485U JPS6258054U JP S6258054 U JPS6258054 U JP S6258054U JP 14911485 U JP14911485 U JP 14911485U JP 14911485 U JP14911485 U JP 14911485U JP S6258054 U JPS6258054 U JP S6258054U
- Authority
- JP
- Japan
- Prior art keywords
- pressure
- chip
- diaphragm
- diffusion type
- tactile sensor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 4
- 238000009792 diffusion process Methods 0.000 claims description 4
- 229910052710 silicon Inorganic materials 0.000 claims description 4
- 239000010703 silicon Substances 0.000 claims description 4
- 229920002050 silicone resin Polymers 0.000 claims description 2
- 239000000284 extract Substances 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Description
第１図は本考案の一実施例の断面図、第２図は
同底面図、第３図は同要部の拡大図、第４図は同
シリコンチツプの平面図、第５図は同電気回路図
、第６図は本考案の他の実施例の断面図、第７図
は本考案の更に異なる実施例のチツプ平面図、第
８図は第７図のＡ―Ａ線に沿う断面図、第９図は
従来のセンサの断面図、第１０図は同底面図であ
る。
２１……ダイヤフラム部、２２……シリコンチ
ツプ、２３……基板、２４……接着剤、２５……
圧力導入穴、２６……シリコン系樹脂、２７……
拡散抵抗。
Fig. 1 is a sectional view of one embodiment of the present invention, Fig. 2 is a bottom view of the same, Fig. 3 is an enlarged view of the main parts, Fig. 4 is a plan view of the silicon chip, and Fig. 5 is the electrical A circuit diagram, FIG. 6 is a sectional view of another embodiment of the present invention, FIG. 7 is a chip plan view of still another embodiment of the present invention, and FIG. 8 is a sectional view taken along the line AA in FIG. 7. 9 is a sectional view of a conventional sensor, and FIG. 10 is a bottom view thereof. 21...Diaphragm portion, 22...Silicon chip, 23...Substrate, 24...Adhesive, 25...
Pressure introduction hole, 26... Silicone resin, 27...
Diffusion resistance.
Claims (1)
ツプでなるシリコン拡散型圧力センサを、圧力導
入穴を設けた基体に接着し、前記チツプ裏面ある
いはチツプ表面に圧力伝達可能な弾性体を配置し
てなり、この配置された弾性体の一方あるいは両
方に触れることで前記ダイヤフラム状の薄肉部に
圧力が加わり、前記シリコン拡散型圧力センサの
拡散抵抗部を介して前記圧力に応じた電気信号を
取り出すようにしたことを特徴とする触覚センサ
。 (2) 前記弾性体はシリコン系樹脂であることを
特徴とする実用新案登録請求の範囲第１項に記載
の触覚センサ。[Claims for Utility Model Registration] (1) A silicon diffusion type pressure sensor made of a semiconductor chip having a diaphragm-like thin wall portion is bonded to a base having a pressure introduction hole, and pressure can be transmitted to the back surface of the chip or the front surface of the chip. By touching one or both of the arranged elastic bodies, pressure is applied to the diaphragm-like thin part, and the pressure is applied to the silicon diffusion type pressure sensor via the diffusion resistance part. A tactile sensor characterized in that it extracts a corresponding electrical signal. (2) The tactile sensor according to claim 1, wherein the elastic body is made of silicone resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14911485U JPS6258054U (en) | 1985-09-30 | 1985-09-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14911485U JPS6258054U (en) | 1985-09-30 | 1985-09-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6258054U true JPS6258054U (en) | 1987-04-10 |
Family
ID=31064016
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14911485U Pending JPS6258054U (en) | 1985-09-30 | 1985-09-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6258054U (en) |
-
1985
- 1985-09-30 JP JP14911485U patent/JPS6258054U/ja active Pending