JPS6258045U - - Google Patents
Info
- Publication number
- JPS6258045U JPS6258045U JP1985150095U JP15009585U JPS6258045U JP S6258045 U JPS6258045 U JP S6258045U JP 1985150095 U JP1985150095 U JP 1985150095U JP 15009585 U JP15009585 U JP 15009585U JP S6258045 U JPS6258045 U JP S6258045U
- Authority
- JP
- Japan
- Prior art keywords
- insulating substrate
- slide rail
- chip
- conductor pattern
- connection terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 5
- 230000001681 protective effect Effects 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 4
- 230000017525 heat dissipation Effects 0.000 claims 2
- 239000004065 semiconductor Substances 0.000 claims 1
- 230000005855 radiation Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985150095U JPS6258045U (pt) | 1985-09-30 | 1985-09-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985150095U JPS6258045U (pt) | 1985-09-30 | 1985-09-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6258045U true JPS6258045U (pt) | 1987-04-10 |
Family
ID=31065917
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985150095U Pending JPS6258045U (pt) | 1985-09-30 | 1985-09-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6258045U (pt) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03194957A (ja) * | 1989-12-21 | 1991-08-26 | Internatl Business Mach Corp <Ibm> | プラスチツク・チツプ回路パツケージ、電子部品の熱放散強化方法、ヒート・シンク・エレメントの取付方法 |
-
1985
- 1985-09-30 JP JP1985150095U patent/JPS6258045U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03194957A (ja) * | 1989-12-21 | 1991-08-26 | Internatl Business Mach Corp <Ibm> | プラスチツク・チツプ回路パツケージ、電子部品の熱放散強化方法、ヒート・シンク・エレメントの取付方法 |
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