JPS6258045U - - Google Patents

Info

Publication number
JPS6258045U
JPS6258045U JP1985150095U JP15009585U JPS6258045U JP S6258045 U JPS6258045 U JP S6258045U JP 1985150095 U JP1985150095 U JP 1985150095U JP 15009585 U JP15009585 U JP 15009585U JP S6258045 U JPS6258045 U JP S6258045U
Authority
JP
Japan
Prior art keywords
insulating substrate
slide rail
chip
conductor pattern
connection terminal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1985150095U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985150095U priority Critical patent/JPS6258045U/ja
Publication of JPS6258045U publication Critical patent/JPS6258045U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の一実施例を示す断面図である
。 １……ヒートシンク付集積回路ケース、２……
接続端子、３……絶縁基板、４……導体パターン
、５……チツプ接続端子、６……接続線、７……
保護キヤツプ、８……放熱フイン、９……ヒート
シンク、１０……スライドレール、１１……クラ
ンプ、１２……突起、１３……ＩＣチツプ。 FIG. 1 is a sectional view showing an embodiment of the present invention. 1... Integrated circuit case with heat sink, 2...
Connection terminal, 3... Insulating board, 4... Conductor pattern, 5... Chip connection terminal, 6... Connection wire, 7...
Protective cap, 8...Radiation fin, 9...Heat sink, 10...Slide rail, 11...Clamp, 12...Protrusion, 13...IC chip.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 絶縁基板と、前記絶縁基板に合着された電導体
よりなる導体パターンと、前記導体パターンの一
端に取り付けられた信号入出力用接続端子と、前
記絶縁基板の周囲に設けられた接続用パターンと
、前記導体パターンの他の一端に取り付けられ論
理回路等よりなる半導体ＩＣチツプを接続するた
めのチツプ接続端子と、前記ＩＣチツプを保護し
前記絶縁基板に固定された保護キヤツプと、前記
絶縁基板の一面に取り付けられたスライドレール
と、前記スライドレールをクランプするためのク
ランプと、前記スライドレールと密着する突起と
、熱放散用放熱フインを有するヒートシンクとを
含むことを特徴とするヒートシンク付集積回路ケ
ース。 an insulating substrate, a conductor pattern made of a conductor bonded to the insulating substrate, a signal input/output connection terminal attached to one end of the conductor pattern, and a connection pattern provided around the insulating substrate; , a chip connection terminal attached to the other end of the conductor pattern for connecting a semiconductor IC chip consisting of a logic circuit, etc.; a protective cap that protects the IC chip and is fixed to the insulating substrate; An integrated circuit case with a heat sink, characterized in that it includes a slide rail attached to one side, a clamp for clamping the slide rail, a protrusion that comes into close contact with the slide rail, and a heat sink having heat dissipation fins for heat dissipation. .
JP1985150095U 1985-09-30 1985-09-30 Pending JPS6258045U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985150095U JPS6258045U (en) 1985-09-30 1985-09-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985150095U JPS6258045U (en) 1985-09-30 1985-09-30

Publications (1)

Publication Number Publication Date
JPS6258045U true JPS6258045U (en) 1987-04-10

Family

ID=31065917

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985150095U Pending JPS6258045U (en) 1985-09-30 1985-09-30

Country Status (1)

Country Link
JP (1) JPS6258045U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03194957A (en) * 1989-12-21 1991-08-26 Internatl Business Mach Corp <Ibm> Plastic-chip circuit package, method of reinforcing heat dissipation of electronic part and method of mounting heat-sink-element

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03194957A (en) * 1989-12-21 1991-08-26 Internatl Business Mach Corp <Ibm> Plastic-chip circuit package, method of reinforcing heat dissipation of electronic part and method of mounting heat-sink-element

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