JPS6258045U - - Google Patents

Info

Publication number
JPS6258045U
JPS6258045U JP15009585U JP15009585U JPS6258045U JP S6258045 U JPS6258045 U JP S6258045U JP 15009585 U JP15009585 U JP 15009585U JP 15009585 U JP15009585 U JP 15009585U JP S6258045 U JPS6258045 U JP S6258045U
Authority
JP
Grant status
Application
Patent type
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15009585U
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

JP15009585U 1985-09-30 1985-09-30 Pending JPS6258045U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15009585U JPS6258045U (en) 1985-09-30 1985-09-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15009585U JPS6258045U (en) 1985-09-30 1985-09-30

Publications (1)

Publication Number Publication Date
JPS6258045U true true JPS6258045U (en) 1987-04-10

Family

ID=31065917

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15009585U Pending JPS6258045U (en) 1985-09-30 1985-09-30

Country Status (1)

Country Link
JP (1) JPS6258045U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03194957A (en) * 1989-12-21 1991-08-26 Internatl Business Mach Corp <Ibm> Plastic chip circuit package, method for increasing heat dissipation of electronic component, and method for mounting heat sink element

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03194957A (en) * 1989-12-21 1991-08-26 Internatl Business Mach Corp <Ibm> Plastic chip circuit package, method for increasing heat dissipation of electronic component, and method for mounting heat sink element

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