JPS61134039U - - Google Patents

Info

Publication number
JPS61134039U
JPS61134039U JP1986004131U JP413186U JPS61134039U JP S61134039 U JPS61134039 U JP S61134039U JP 1986004131 U JP1986004131 U JP 1986004131U JP 413186 U JP413186 U JP 413186U JP S61134039 U JPS61134039 U JP S61134039U
Authority
JP
Japan
Prior art keywords
substrate
protrusion
solder
hole
reference numeral
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1986004131U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6211014Y2 (pt
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986004131U priority Critical patent/JPS6211014Y2/ja
Publication of JPS61134039U publication Critical patent/JPS61134039U/ja
Application granted granted Critical
Publication of JPS6211014Y2 publication Critical patent/JPS6211014Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
JP1986004131U 1986-01-16 1986-01-16 Expired JPS6211014Y2 (pt)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986004131U JPS6211014Y2 (pt) 1986-01-16 1986-01-16

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986004131U JPS6211014Y2 (pt) 1986-01-16 1986-01-16

Publications (2)

Publication Number Publication Date
JPS61134039U true JPS61134039U (pt) 1986-08-21
JPS6211014Y2 JPS6211014Y2 (pt) 1987-03-16

Family

ID=30479408

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986004131U Expired JPS6211014Y2 (pt) 1986-01-16 1986-01-16

Country Status (1)

Country Link
JP (1) JPS6211014Y2 (pt)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021059914A1 (ja) * 2019-09-25 2021-04-01 日立Astemo株式会社 電子回路装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4896447U (pt) * 1972-02-17 1973-11-16

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4896447U (pt) * 1972-02-17 1973-11-16

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021059914A1 (ja) * 2019-09-25 2021-04-01 日立Astemo株式会社 電子回路装置
JPWO2021059914A1 (pt) * 2019-09-25 2021-04-01

Also Published As

Publication number Publication date
JPS6211014Y2 (pt) 1987-03-16

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