JPS6256660B2 - - Google Patents

Info

Publication number
JPS6256660B2
JPS6256660B2 JP56188627A JP18862781A JPS6256660B2 JP S6256660 B2 JPS6256660 B2 JP S6256660B2 JP 56188627 A JP56188627 A JP 56188627A JP 18862781 A JP18862781 A JP 18862781A JP S6256660 B2 JPS6256660 B2 JP S6256660B2
Authority
JP
Japan
Prior art keywords
bonding
lower limit
bonding arm
arm
fixed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56188627A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5889834A (ja
Inventor
Yoji Enomoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP56188627A priority Critical patent/JPS5889834A/ja
Publication of JPS5889834A publication Critical patent/JPS5889834A/ja
Publication of JPS6256660B2 publication Critical patent/JPS6256660B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP56188627A 1981-11-25 1981-11-25 ボンデイングヘツドの組立調整方法 Granted JPS5889834A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56188627A JPS5889834A (ja) 1981-11-25 1981-11-25 ボンデイングヘツドの組立調整方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56188627A JPS5889834A (ja) 1981-11-25 1981-11-25 ボンデイングヘツドの組立調整方法

Publications (2)

Publication Number Publication Date
JPS5889834A JPS5889834A (ja) 1983-05-28
JPS6256660B2 true JPS6256660B2 (enrdf_load_html_response) 1987-11-26

Family

ID=16226996

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56188627A Granted JPS5889834A (ja) 1981-11-25 1981-11-25 ボンデイングヘツドの組立調整方法

Country Status (1)

Country Link
JP (1) JPS5889834A (enrdf_load_html_response)

Also Published As

Publication number Publication date
JPS5889834A (ja) 1983-05-28

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