JPS6255387U - - Google Patents
Info
- Publication number
- JPS6255387U JPS6255387U JP14788485U JP14788485U JPS6255387U JP S6255387 U JPS6255387 U JP S6255387U JP 14788485 U JP14788485 U JP 14788485U JP 14788485 U JP14788485 U JP 14788485U JP S6255387 U JPS6255387 U JP S6255387U
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- wiring board
- printed wiring
- engagement hole
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
図面は本考案の実施態様を示すものであつて、
第１図は本考案によるものの分解状態を示した斜
面図、第２図はその組立状態についての断面図、
第３図はその機器形成状態の斜面図、第４図は従
来におけるヒートシンク取付機構の分解状態を示
した斜面図、第５図はその機器組立状態の斜面図
である。
然してこれらの図面において、１はヒートシン
ク、２はプリント配線基板、３はパワーＩＣ、４
は取付部、５は止子、１０は下部ケース、１８は
係止部、４１は係合孔、４２は段部を示すもので
ある。
The drawings show embodiments of the invention,
Fig. 1 is a perspective view showing the disassembled state of the device according to the present invention, and Fig. 2 is a sectional view of the assembled state.
FIG. 3 is a perspective view of the device in its assembled state, FIG. 4 is a perspective view showing an exploded state of the conventional heat sink mounting mechanism, and FIG. 5 is a perspective view of the device in its assembled state. However, in these drawings, 1 is a heat sink, 2 is a printed wiring board, 3 is a power IC, and 4 is a heat sink.
1 is a mounting portion, 5 is a stopper, 10 is a lower case, 18 is a locking portion, 41 is an engagement hole, and 42 is a stepped portion.
Claims (1)
孔と段部を形成し、上記段部に支持せしめてプリ
ント配線基板を設定し、該プリント配線基板に接
合してヒートシンクを設け、該ヒートシンクに形
成した係止部を前記係合孔に係止させたことを特
徴とするヒートシンク取付機構。 ２ 平面的にＬ字状に屈曲されたヒートシンクを
用い、その一辺を機器外面に露出させた実用新案
登録請求の範囲第１項に記載のヒートシンク取付
機構。[Scope of Claim for Utility Model Registration] 1. An engagement hole and a step are formed in a mounting portion cut out from a case body of a device, a printed wiring board is supported by the step, and a printed wiring board is mounted on the printed wiring board. A heat sink attachment mechanism, characterized in that a heat sink is provided by joining, and a locking portion formed on the heat sink is locked in the engagement hole. 2. The heat sink mounting mechanism according to claim 1, which uses a heat sink bent into an L-shape in plan view, with one side exposed to the outside of the device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14788485U JPS6255387U (en) | 1985-09-27 | 1985-09-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14788485U JPS6255387U (en) | 1985-09-27 | 1985-09-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6255387U true JPS6255387U (en) | 1987-04-06 |
Family
ID=31061657
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14788485U Pending JPS6255387U (en) | 1985-09-27 | 1985-09-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6255387U (en) |
-
1985
- 1985-09-27 JP JP14788485U patent/JPS6255387U/ja active Pending