JPS6255302B2 - - Google Patents
Info
- Publication number
- JPS6255302B2 JPS6255302B2 JP56174302A JP17430281A JPS6255302B2 JP S6255302 B2 JPS6255302 B2 JP S6255302B2 JP 56174302 A JP56174302 A JP 56174302A JP 17430281 A JP17430281 A JP 17430281A JP S6255302 B2 JPS6255302 B2 JP S6255302B2
- Authority
- JP
- Japan
- Prior art keywords
- lead
- insulating substrate
- lead frame
- manufacturing
- dip type
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17430281A JPS5874061A (ja) | 1981-10-29 | 1981-10-29 | Ｄｉｐ型ケ−スの製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17430281A JPS5874061A (ja) | 1981-10-29 | 1981-10-29 | Ｄｉｐ型ケ−スの製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5874061A JPS5874061A (ja) | 1983-05-04 |
| JPS6255302B2 true JPS6255302B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1987-11-19 |
Family
ID=15976282
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17430281A Granted JPS5874061A (ja) | 1981-10-29 | 1981-10-29 | Ｄｉｐ型ケ−スの製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5874061A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0622266B2 (ja) * | 1986-09-17 | 1994-03-23 | 三菱電機株式会社 | 半導体装置及びその製造方法 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5230352B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1974-02-08 | 1977-08-08 | ||
| JPS5159269A (en) * | 1974-11-20 | 1976-05-24 | Nippon Electric Co | Handotaisochino seizohoho |
| JPS5386575A (en) * | 1977-01-10 | 1978-07-31 | Mitsubishi Electric Corp | Production of semiconductor device |
| JPS6024581B2 (ja) * | 1977-01-21 | 1985-06-13 | 株式会社日立製作所 | リ−ド線の気密封止方法 |
-
1981
- 1981-10-29 JP JP17430281A patent/JPS5874061A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5874061A (ja) | 1983-05-04 |