JPS6255296B2 - - Google Patents

Info

Publication number
JPS6255296B2
JPS6255296B2 JP57218689A JP21868982A JPS6255296B2 JP S6255296 B2 JPS6255296 B2 JP S6255296B2 JP 57218689 A JP57218689 A JP 57218689A JP 21868982 A JP21868982 A JP 21868982A JP S6255296 B2 JPS6255296 B2 JP S6255296B2
Authority
JP
Japan
Prior art keywords
resin composition
semiconductor device
semiconductor element
resin
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57218689A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59108333A (ja
Inventor
Hiroshi Narita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP57218689A priority Critical patent/JPS59108333A/ja
Publication of JPS59108333A publication Critical patent/JPS59108333A/ja
Publication of JPS6255296B2 publication Critical patent/JPS6255296B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01515—Forming coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Epoxy Resins (AREA)
  • Led Device Packages (AREA)
JP57218689A 1982-12-14 1982-12-14 樹脂封止型半導体装置の製造方法 Granted JPS59108333A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57218689A JPS59108333A (ja) 1982-12-14 1982-12-14 樹脂封止型半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57218689A JPS59108333A (ja) 1982-12-14 1982-12-14 樹脂封止型半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS59108333A JPS59108333A (ja) 1984-06-22
JPS6255296B2 true JPS6255296B2 (https=) 1987-11-19

Family

ID=16723867

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57218689A Granted JPS59108333A (ja) 1982-12-14 1982-12-14 樹脂封止型半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS59108333A (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0178036U (https=) * 1987-11-12 1989-05-25
JP2001196642A (ja) 2000-01-11 2001-07-19 Toyoda Gosei Co Ltd 発光装置
JP2005244259A (ja) * 2005-05-23 2005-09-08 Nichia Chem Ind Ltd 発光ダイオード

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS522267B2 (https=) * 1973-03-28 1977-01-20

Also Published As

Publication number Publication date
JPS59108333A (ja) 1984-06-22

Similar Documents

Publication Publication Date Title
KR940008334B1 (ko) 다중몰드형 반도체장치 및 그 제조방법
US4707722A (en) Laser marking method and ablative coating for use therein
JPS6255296B2 (https=)
JPH0332912B2 (https=)
US4540603A (en) Resin-molded semiconductor device and a process for manufacturing the same
JPH01100930A (ja) 半導体プラスチックパッケイジのための銅メッキリードフレーム取り扱い方法
JPH05102374A (ja) 半導体装置
JP2919178B2 (ja) モールドチップ型固体電解コンデンサ
JPH06151653A (ja) 温度センサの封止構造及び封止方法
JP2505868B2 (ja) 半導体装置
JPH0360085B2 (https=)
JPH0452999Y2 (https=)
JPS6144436Y2 (https=)
JP2871716B2 (ja) 樹脂モールド型半導体装置の製造方法
JPH0722559A (ja) リードフレーム
JPH06101487B2 (ja) 半導体装置の製造方法
JPH02209740A (ja) 半導体装置の製造方法
JPS5858806B2 (ja) 電子部品の外装方法
JPH0689478B2 (ja) 樹脂封止半導体装置の製造方法
JPH02155245A (ja) 電子部品の製造方法
JP2547083B2 (ja) 溶剤型マスチックシーラの加工方法
JPS59218759A (ja) 半導体装置
JPH0263145A (ja) 樹脂封止型半導体装置
JPS6328772B2 (https=)
JPS59107543A (ja) 樹脂封止型集積回路装置の製造方法