JPS6254890A - Magnetic bubble memory - Google Patents

Abstract

PURPOSE:To make the entire body of the titled memory smaller and thinner and to make the packaging of it on a board equipped with an external drive circuit easy by connecting the external-connection terminals of a flexible board with the connection terminals of terminal plate by using a frame-type core. CONSTITUTION:A drive magnetic circuit using the frame-type core COR is formed. A magnetic bubble memory chip CHI is surrounded by the core COR, and is so disposed on the flexible printed circuit board FPC that is makes an approximately the same plane with the core COR. The drive magnetic circuit, the COR, and the chip CHI are stored in a rotary magnetic-field enclosing case RFS made of good conductive non-magnetic material. As the external- connection terminals of the magnetic bubble memory device constituted in such way as above-mentioned, pins arrayed in grid-form (204 and 310) are used. As the result of such a constitution, the flexible printed circuit board can be made smaller, and the entire body of the titled memory can be made smaller and thinner as well as a high-density packaging is made possible because of the easy board-packaging.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a magnetic bubble memory, and particularly to a magnetic bubble memory suitable for thinning, miniaturization, and low power consumption.

[Prior art]

Magnetic bubble memory devices, which have been put into practical use in recent years, are used to generate a rotating magnetic field, and are composed of rectangular solenoid coils with an asymmetrical structure mounted on a double-shaped ceramic or synthetic resin wiring board on which a magnetic bubble memory chip is mounted. It has a structure in which an X coil and a Y coil are inserted and arranged orthogonally.

[Problem that the invention seeks to solve]

The X coil and Y coil have a structure in which they wrap not only the magnetic bubble memory chip but also a wiring board that is much larger than the chip, so each coil is long from end to end.
Drive voltage and power consumption will increase. In addition, the X coil and Y coil require a uniform inductor balance in order to provide a uniform and stable in-plane rotating magnetic field to the magnetic bubble memory element, so the coil shapes are different from each other and have an asymmetric structure, resulting in a larger structure. I had no choice but to do so. Furthermore, a pair of permanent magnet plates that apply a perpendicular bias magnetic field to the magnetic bubble memory element and a magnetic shunt plate are arranged on the outer surfaces of these X coils and Y coils, and their peripheral parts are covered with a resin mold. Because of this structure, the stacking thickness in the vertical direction increases, which is an obstacle to the demand for thinner and smaller magnetic bubble memory devices.

The closest prior art to the present invention known to the applicant is Patent Application Publication No. 55129 of 1974. This publication describes the structure of a frame-shaped core that surrounds a chip and a conductive magnetic field reflection box that completely surrounds them. However, no further specific structure is shown, and it is theoretically impossible to make an electrical connection to a chip completely surrounded by a conductor case from outside the conductor case without shorting it. Although it is possible, the description is clearly insufficient for people to think of putting it into practical use, including the fact that the method of attaching permanent magnets, magnetic shunt plates, bias coils, etc. is unknown. In other words, the embodiment of the present invention merely coincidentally coincides with the description in the above-mentioned publication in that a frame-shaped core is used as a result.

An object of the present invention is to provide a magnetic bubble memory that can be made thinner.

Another object of the present invention is to provide a magnetic bubble memory that can be miniaturized by reducing the overall volume.

Another object of the present invention is to provide a magnetic bubble memory with reduced power consumption.

Another object of the present invention is to provide a magnetic bubble memory in which the VI product is reduced by reducing the inductance of the rotating magnetic field generating coil.

Another object of the present invention is to provide a magnetic bubble memory that allows or facilitates automation of assembly of component parts.

Another object of the present invention is to provide a magnetic bubble memory capable of increasing the number of connection terminals for input/output, etc., such as increasing capacity.

Another object of the present invention is to provide a magnetic bubble memory in which the inclination angle of the magnetic bubble memory element with respect to the direction of the bias magnetic field can be set easily and with high precision.

Another object of the present invention is to provide a magnetic bubble memory whose cassette can be made smaller.

Another object of the present invention is to provide a magnetic bubble memory whose peripheral circuitry can be manufactured at low cost.

Another object of the present invention is to provide a magnetic bubble memory that can be easily mounted on a board.

Still another object of the present invention is to provide a magnetic bubble memory that enables high-density packaging.

[Means for solving problems]

According to one embodiment of the present invention, a drive magnetic circuit using a frame-shaped core COR is provided (FIG. 8).

The magnetic bubble memory chip CHI is surrounded by the frame-shaped core C○R and arranged on the flexible wiring board FPC so as to be substantially flush with it (FIG. 13). The drive magnetic circuit COR and the magnetic bubble memory chip CHI are housed in a rotating magnetic field confinement case RFS made of a non-magnetic and highly conductive material (FIG. 13).

As the external connection terminals of this configured magnetic bubble memory device, pins (204, 31
0) is used (Figures 45 and 52).

[Effect]

According to such a configuration, the flexible wiring board can be made smaller, the overall shape can be made smaller and thinner, and board mounting is easy and high-density mounting is possible.

〔Example〕

Next, the present invention will be explained in detail using the drawings.

(Overview of overall structure Figures 1 and 2) Figures 1 and 2 (a) and (b) are diagrams for explaining an embodiment of the magnetic bubble memory device according to the present invention. A partially cutaway perspective view, FIG. 2(a) is a bottom view thereof, and FIG. 2(b) is a sectional view taken along line 2B-2B of FIG. 2(a). In these figures, CHI is a magnetic bubble memory chip (hereinafter referred to as a chip). In these figures, the chip CHI is omitted and only one chip is shown, but in this example, two chips are arranged side by side. shall be.

(The chip yield is better with a multi-divided chip configuration that matches the total storage capacity than with one large-capacity chip.) F
The PC is equipped with two chips CHI and a chip C in the four corners.
COI, which is a flexible wiring board (hereinafter referred to as the board) having a wire group extension for connection between the H workpiece and the external connection terminal.
is a drive coil (hereinafter referred to as a coil) that surrounds two chips CHI on almost the same plane and is arranged so that opposing sides are parallel to each other, and COR is a rectangular coil assembly CO.
It is a frame-shaped core (hereinafter referred to as the core) made of a fixedly arranged soft magnetic material that is provided so as to penetrate through the hollow part of I, and this core COR and each coil COI form a chip CH.
A magnetic circuit PFC that applies an in-plane rotating magnetic field to I is configured. The RFS is a rotating magnetic field confinement case (hereinafter referred to as the case) that houses the central rectangular portion of the substrate FPC, two chip CHs, and the entire magnetic circuit PFC.

Case RFS is formed by processing two independent plates,
The upper and lower plates are electrically connected on the side of the case.

A converging portion is formed in the peripheral portion so that the gap in the central portion is narrowed in a slightly wider range than the portion where the chip CHI is arranged. This constriction can also be used to position the magnet. Case PFS uses magnetic field confinement and soft substrate FP
It has the effect of killing two birds with one stone by mechanically supporting C.

In particular, there is a chip C between the case PFS and the chip CHI.
There is a gap SIR on the side surface of the HI, but this gap SIR, including the flat surface of the chip CHI, is coated or filled with silicone resin to prevent foreign matter from adhering to the main surface of the chip during assembly or moisture from entering after assembly. A passivation effect is intended to reduce intrusion into the main surface or side surfaces of the chip. If complete airtight sealing can be achieved on the outside of the case RFS, filling of the resin SIR may be omitted. INM is a pair of inclined plates made of magnetic material placed outside the case RFS, and in Fig. 2, the thickness of the upper inclined plate INM decreases as it moves to the left, and the thickness of the lower inclined plate INM decreases as it moves to the right. Both have an inclined surface formed on the case RFS side. As the material for the inclined plate INM, soft ferrite, permalloy, or the like, which has a high magnetic permeability μ and a small coercive force Hc, may be used, and in this embodiment, soft ferrite was selected because it is easy to process the inclined surface. MAG is a pair of permanent magnet plates (hereinafter referred to as magnet plates) arranged inside the pair of inclined plates INM and overlapping them. The ROM is a pair of magnetic shunt plates made of a magnetic material such as soft ferrite and arranged inside each magnet plate MAG and overlapping with it. The magnet plate MAG is formed to have a uniform thickness over the entire surface. The INN is a pair of inclined plates made of a non-magnetic material with good thermal conductivity such as copper, which are placed on the inner facing surfaces of the pair of magnetic shunt plates HOM and overlapped therewith. These inclined plates INN are formed to have substantially the same inclination angle as the inclined plate INM, and have inclined surfaces in opposite directions. The inclined plate INM, magnet plate MAG, magnetic shunt plate HOM, and inclined plate INN are arranged in a stacked manner and integrated to form a bias magnetic field generating magnet body BIM (hereinafter referred to as magnet body), when the entire laminated plate magnet body is formed. The thickness is uniform over almost the entire surface.

A pair of magnet bodies BIM are adhered to a central flat part surrounded by the constriction part of the case RFS.

BIC is a bias magnetic field generating coil (
(hereinafter referred to as bias coil). The bias coil BIC adjusts the magnetic force of the magnet plate MAG to match the characteristics of the chip CHI, and when testing for the presence or absence of unnecessary bubble generation, it clears all bubbles on the chip CHI.
It is driven when SHI includes a case RFS that houses the board FPC on which the chip CHI is mounted and the magnetic circuit PFC, and a pair of magnet bodies BIMa and BI on the outside.
This is an external magnetic shield case (hereinafter referred to as shield case) made of a magnetic material that houses Mb and bias coil BIC. The materials for shield case SHI are as follows:
A magnetic material with a high magnetic permeability μ, a large saturation magnetic flux density Bs, and a small He is preferable, and permalloy and ferrite have such characteristics, but in this example, they are suitable for bending and are resistant to external mechanical forces. A strong permalloy iron-nickel alloy was selected. PKG is a packaging case made of a material such as AQ that has high thermal conductivity and is easy to process, and is attached to the outer circumferential surface of the shield case SHI by adhesion or fitting. GNP are contact pads extending from the four corners of the substrate FPC and arranged to contact external connection terminals folded back on the back surface of the shield case SHI. TEF is a terminal fixing plate made of an insulating material that supports and fixes each contact pad GNP at a stepped portion of an opening. REG is a resin molding agent that is sealed in the four inner corners of the packaging case PKG and fixes the shield case RFS assembly inside the packaging case PKG.

(Features of the overall structure Figures 1 and 2) ``Figures 1 and 2
The features of the overall structure of the magnetic bubble memory device shown in the figure are listed below. However, the features of this embodiment are not limited to these, and other features will become clear from the explanations that follow from Figure 3, but here we will focus on the relationships between each component. The features are described below.

(1) Since the rotating magnetic field generating coil PFC is shaped like a picture frame and the bubble memory chips C) are arranged on the same plane, the thickness of the entire bubble device can be reduced. This is because in the current mainstream technology, the upper and lower surfaces of the chip are wrapped around the X and Y coils, so the thickness of the entire device is a function of the sum of the chip thickness, the X coil thickness, and the Y coil thickness.

(2) Since the X coil and Y coil are arranged on almost the same plane, the following effects are achieved compared to the conventional structure in which the Y coil is wound on top of the X coil.

■The edge winding length of the coil does not become long. Therefore, the inductance L can be reduced, making it possible to drive at low voltage and reduce power consumption.

(2) The distances between the X coil and Y coil and the chip CHI can be made equal, and the magnetic field distribution can be made balanced.

(3) Since the rotating magnetic field generating coil PFC is surrounded by the conductor case RFS, leakage of magnetic flux is reduced and drive efficiency for the chip CHI can be increased.

(4) The conductor case PFS is a rotating magnetic field Hr generating coil P
The alternating current magnetic field generated from the FC is prevented from leaking to the magnet body B'IM with a large magnetic permeability μ, while the direct current magnetic field of the bias magnetic field Hb to be applied from the magnet body BIM to the chip CHI is substantially prevented from leaking. There is an option of not blocking passage.

(5) Since the conductor case PFS is made of a material such as copper, which is harder than epoxy glass or the like conventionally used for wiring boards, it can mechanically support the chip CHI firmly.

Therefore, when a multiple-chip mounting configuration is used to increase manufacturing yields, variations in the inclination angle between chips have a large effect on magnetic properties, but according to this embodiment, variations in the inclination angle between chips can be reduced. It can be held small.

(6) Flexible film board FPC as a wiring board
By using , the following effects can be obtained.

■ Board thickness can be reduced6 ■ Lead bonding method can be adopted, so the thickness occupied by the bonding part can be reduced compared to the conventional wire bonding method.

■The effects of ■ and ■ above are due to the magnetic circuit gap (magnetic permeability μ
A bias magnet MAG having a small thickness or a small planar area can be used, which leads to a thinner overall device or a smaller planar area.

■Wiring from the chip CHI can be bent freely. Therefore, the terminal portion 180' can be turned over, and the planar area of the entire device can be limited.

■The width of the opening for wiring out of the rotating magnetic field confinement case RFS can be made smaller. Therefore, leakage of the rotating magnetic field can be kept to a minimum.

(7) Since the external protruding wiring of the wiring board FPC is concentrated at the corners of the rectangle, the opening of the rotating magnetic field confinement case RFS can be provided at the corner where the influence is least.

(8) Since the function of the inclined plate INN is not combined with the magnet or magnetization function, the following effects are obtained.

■Materials with good workability, such as copper, can be used to form the slope.

■Materials such as copper, which have a high heating rate, can be used to efficiently dissipate the heat generated by the rotating magnetic field generating coil COI.6 ■By using non-magnetic materials, the magnetic field shunt plate HO
It is possible to avoid disturbing the magnetic field passing through M.

(9) It is preferable that the inclined plate INN be as thin as possible in order to reduce the magnetic gap.Compared to the magnet MAG and the magnetic shunt plate ROM, the inclined plate INN can be made thinner by limiting its width to the area necessary and sufficient for forming the inclined angle. This makes it easy to form an inclined angle in the thickness.

(10) Between magnet MAG and shield case SHI.

Since a plate INM made of soft ferrite having a large magnetic permeability μ is inserted, the magnetic gap therebetween can be filled. Also.

The plate INM also contributes to heat radiation. Magnet M as plate INM
Since we have selected a material with a smaller holding force He than AG,
The effective thickness of the permanent magnet can remain uniform.

(11) Since the shield case SHI is made of a magnetic material such as permalloy with a high magnetic permeability μ, the magnetic resistance of the magnetic circuit using the magnet MAG as the magnetic field source can be reduced.
The thickness and planar area of the magnet MAG can be reduced.

(12) Since the shield case SHI is made of a magnetic material such as permalloy with a high saturation magnetic flux density Bs, it bypasses external magnetic field noise.

There is a function that does not inform the chip CHI. .

(13) The above (11) and (12) each lead to reducing the thickness of the shield case SHI.

(14) Since the shield case SHI uses an iron-nickel alloy such as permalloy, it is suitable for bending and protects the parts incorporated therein against external mechanical forces.

(15) Rotating magnetic field generating coil PFC and bias coil B
Since both ICs are core-type, the storage efficiency or packaging density within the packaging case SHI or PKG can be increased.

(16) Since the case RFS is inserted between the core 〇OR and the magnetic shunt plate HOM, the interval between them can be finely adjusted by the thickness of the rotating magnetic field confinement case RFS and the bending angle in addition to the thickness of the coil COI. can. The shorter this distance is, the smaller the overall planar size can be, leading to lower power consumption due to the lower coil length.

However, if the distance is too short, the DC bias magnetic field Hb from the magnet MAG will leak to the core COR having high magnetic permeability, and the uniformity of the bias magnetic field in the chip peripheral portion will deteriorate. Therefore, this distance is very critical due to the above-mentioned characteristics, and according to the present structure, it can be precisely adjusted.

(I7) Since the constriction portion is provided around the rotating magnetic field confinement case RFS, alignment of the magnet body BIM is easy.

(18) The inclined plate INN is made by arranging two plates manufactured under the same manufacturing conditions so that there is a rotation angle difference of 1801 in plane between the upper and lower surfaces of the chip, so that they are placed on the upper and lower surfaces with the chip sandwiched between them. A pair of magnetic shunt plates HOM and a pair of magnets M
AG can be aligned almost parallel.

(Overview of assembly Fig. 3) Fig. 3 is an assembly perspective view for explaining the procedure for stacking and assembling each component constituting the above-mentioned magnetic bubble memory device, and the same reference numerals as above indicate the same members. . In the same figure, first, a board F has connection parts for input/output wiring protruding from the four corners and an element mounting part in the center.
Board assembly BND with two CHI elements mounted on a PC
is placed inside the outer case RFSa, which has an insulating sheet glued at the position indicated by the dotted line on the bottom surface, and this board F
After incorporating the magnetic circuit PFC on the PC, silicone resin SIR (not shown) is filled and the inner case R is placed on top of it.
FSb is assembled into the outer case RFSa IC, and the side contact portions of the outer case RFSa and the inner case RFSb are electrically connected by soldering or the like. Next, the upper magnet body B I M
After arranging the upper magnet body BIMb and the lower magnet body BIMb, a bias coil BIC wound in alignment is arranged in a gap (not shown) formed between the outer edge of the upper magnet body BIMa and the inside of the inner case RFSb. The outer case 5H
Store it in Ia, and further incorporate the inner case 5HIb,
The side surface contact portions of the outer case SHIa and the inner case 5HIb are magnetically connected by welding or the like. As shown in FIG. 4B, the connectors are folded back and arranged in combination to have a certain shape, and contact pads (not shown) are attached to each external connection terminal covered with solder or the like provided at each of these connection parts. A terminal fixing plate TEF with a CoP mounted in each opening is arranged in contact with each other, and each external connection terminal and contact pad C○P are electrically connected by soldering or the like by thermocompression bonding or the like. Next, these assembled bodies are housed in a packaging case PKG, and sealed with a hermetic seal or the like at the contact portion between the terminal fixing plate TEF and the packaging case PKG, and then assembled.

Next, the structure of each component mentioned above will be explained.

(Flexible wiring board Fig. 4) Fig. 4 is a diagram showing a board FPC, where A is a plan view thereof and B is a layout in which the connection parts of external connection terminals protruding from the four corners are folded back and combined. The plan view C is an enlarged sectional view of 4G-4CC of the same figure A, and the same figure is the 40-4CC of the same figure A.
40 is an enlarged sectional view. In the same figure, the board FPC is
There is a square element protection part 1 in the center, small bent parts 2 (2a, 2b, 2c, 2d) at the four corners, and a square external connection terminal connection part (hereinafter referred to as connection part) at the tip. ) 3 (3a, 3b, 3c, 3d), and the overall shape is approximately windmill-shaped and is integrally formed. A rectangular opening 4 (4a, 4b) with a double-frame structure for mounting two elements CHI and connecting their terminals, and three perforations 5 (5a, 5b, 5c) for positioning are provided. A substrate protrusion 6 for positioning is provided at the tip of each connecting portion 3c.

In addition, as shown in FIG. C, this FPC board is made by forming a copper thin film on a base film 7 made of a polyimide resin film with a thickness of about 50 μm, for example, via an epoxy adhesive 8, and then applying the copper thin film to the desired shape. By etching into a pattern shape, wiring leads 9a as shown in FIG.
A circular external terminal 9b and an oval coil lead connection terminal 9c.

Patterns such as symbols 9d and index marks 9e are formed, and a transparent or semi-transparent cover film 10 is adhered to the upper surface of these through an adhesive 8 made of the same material as described above. And this board FP
In the opening 4 of C, an opening with highly accurate dimensions is formed in the base film 7 on which the cable CHI (not shown) is mounted, and an opening with relatively large dimensions is formed in the cover film 10 on the upper side thereof. , and further base film 7
A wiring lead 9a is exposed between the wiring lead 9a and the cover film 10, and a tin plating layer 11 is formed on the surface of the wiring lead 9a.
is formed, and the opening shape is formed to have a two-layer structure and a double frame structure. On the other hand, in the connecting portion 3, as shown in the figure, a circular opening 12 is formed at a portion of the cover film 10 corresponding to the circular external terminal 9b and the oval external terminal 9c (not shown). A solder layer 13 is formed by plating or dipping on the copper thin film patterns of the external terminals 9b and 9c exposed from the external terminals 9b and 9c. Each of the external terminals 9b and 9c provided in these connection parts 3 is each connection part 3a.

3b, 3c, 3d and bent portions 2a, 2b.

2c, 2d and each wiring lead 9a formed continuously on the element protection part 1. Each connection portion 3a is partially provided.

They are gathered in blocks 3b, 3c, and 3d, and their tips are exposed in the respective openings 4a and 4b.

That is, as shown in FIG. A, the wiring lead 9a of the connecting part 3a is located at the upper left of the opening 4a, the wiring lead 9a of the connecting part 3b is located at the lower left of the opening 4b, and the wiring lead 9a of the connecting part 3c is located at the lower left of the opening 4b. is wired to the upper right corner of the opening 4a, and the wiring lead 9a of the connecting portion 3d is wired to the lower right corner of the opening 4b. Then, this board FPC is connected to each connecting portion 3a in a later process.

3b, 3c, 3d are the respective bent portions 2a, 2b, 2c, 2
d and assembled as shown in Figure B,
The external terminals 9b and 9c on which the solder layer 13 is formed are exposed on the surface, and the surfaces of the wiring leads 9a, symbols 9d and index marks 9e are covered with the cover film 10, so these patterns are covered with the cover film. 10 is constructed so that it can be easily read through.

In such a configuration, the substrate FPC uses a polyimide resin film, and each bent portion 2 is provided at the four corners of the element protection portion 1.
Each connection 3a, 3b, 3 via a, 2b, 2c, 2d
c, 3d, and each of these connecting parts 3
By folding and combining a, 3b, 3c, and 3d to form the external terminal section, the element protection section 1 and the connection section are separated into two parts.
Since it has a layered wiring structure, the area of the element protection part 1 can be increased without reducing the area of the connection part 3, and at the same time, it is possible to increase the number of external terminals, and the overall shape can be made smaller. .

In addition, in such a configuration, the wiring leads 9a from each external terminal 9b to each opening 4a, 4b of the element protection part 1
Since the time can be significantly shortened, the influence of external noise etc. can be significantly reduced. That is, signals with a high S/N ratio can be input and output. Furthermore, a board protrusion 6 is provided at one end of the connecting part 3c, and an index mark 9e is provided on this protrusion 6, so that when the board is folded back and assembled, it can be used for displaying the central part of the board.
I (see Figure 2) can be used for positioning when assembling, distinguishing the type of wiring lead 9a, or displaying the product model. It can be streamlined. Additionally, holes 5a, 5b, 5c are provided at both ends of the element protection portion 1 of the FPC board.
By providing a
The positioning of the HI becomes easy, and the ease of assembly can also be streamlined.

(Substrate Assembly Figures 5.6.7) Figure 5 is a plan view showing the element CHI mounted on the aforementioned substrate FPC. In the figure, two elements CHI are mounted in the element mounting part 1 of the FPC board through openings 4a and 4b.
A board assembly BND is constructed by being mounted in parallel between the two blocks, and one of the elements CH is constructed by integrating two blocks of IMb chips, as shown in an enlarged plan view in FIG. 4 blocks for 2 elements CHI, 4M in total
It constitutes the b chip. Note that the element C shown in FIG.
In one block of HI, thick lines indicate conductor patterns and thin lines indicate chevron pattern transfer paths. In addition, the element CHI shown in FIG. 5 is shown in FIG. 7A and FIG. 7B.
As shown in the enlarged cross-sectional views in FIG.
A gold bump 15 is interposed between the tin plated layer 11 of the substrate FPC opening 4 and the wiring lead 9a formed thereon, and lead bonding is carried out using Au-Sn eutectic using a thermocompression bonding method. .

According to such a configuration, the openings 4a, 4 of the substrate FPC
The wiring lead 9a of b and the bonding pad 14 of the element CHI are connected by lead bonding using Au-Sn eutectic, and the element CHI can be supported and fixed, so the connection strength can be greatly improved and the thickness can be reduced. becomes possible. In addition, since the surface of the element CHI is covered with the element mounting part 1 of the FPC board, the surface of the element CHI is protected, the handling property can be improved, and the mechanical strength of the FPC board can be maintained. .

Further, according to such a configuration, since each element CHI is composed of two blocks, and two elements CHI are composed of four blocks, each block is connected to the respective connecting parts 3a, 3b, and 3c closest to each other.

Wiring can be distributed over 3D, symmetrical element CHI arrangement can be obtained, and testing, inspection, etc. can be extremely facilitated.

Furthermore, four connection parts 3a, 3b, 3c, 3 are attached to the board FPC.
d, the wires for the magnetic bubble detector DET and pine pull of each element CHI are distinguished from other functional wires and gathered at one connection point, and this connection point is selected to be away from the noise source. By placing
It is possible to exchange input/output signals with extremely low noise.

(Drive Magnetic Circuit FIGS. 8 and 9) FIG. 8 is a diagram showing the magnetic circuit PFC, and FIG. 8A is a perspective view, and FIG. 8B is a plan view showing the drive magnetic circuit. In the figure, the magnetic circuit PFC includes four sets of coils 20a, 20b, 20, which are wound in the direction of the arrows on mutually parallel opposing sides of a frame-shaped core COR made of a soft magnetic material.
A coil COI consisting of coils COI c and 20d is wound, and coils 20a and 20b on opposite sides are wound in series via a connection point 21b to form an X coil 22a and a coil 20c.
and 20d are wound in series through connection points 2 and 2 to form Y coils 22b.

Then, currents Ix and Iy (for example, triangular non-current) whose phases are different by 90 degrees are applied to the X coil 22a and the Y coil 22b.
As shown in Figure B, a leakage magnetic field Hx is generated in the X-axis direction and a leakage magnetic field Hy is generated in the y-axis direction.
It is supplied as a rotating magnetic field to the two elements CHI mentioned above.

Moreover, the magnetic circuit PFC configured in this way is as follows.

[As shown in a perspective view in FIG. 9] A rectangular parallelepiped magnetic core 23 made of a soft magnetic material is wound with a tap 24 for each block, and wound in series to form a pair of coils, for example coils 20a and 20b. After forming a pair of X coils 22a consisting of a pair of The wide grooves 25, which are cut from the narrow groove 26 and divided into two parts, are combined and glued together in directions perpendicular to each other to form a picture frame shape as shown in FIG. Moreover, on the contrary, the wide groove 25 described above
and a rectangular parallelepiped core 23 with a small width groove 26 formed in advance.
The coils 20a and 20b are wound through the tap 24,
A pair of X coils 22a may be formed. Furthermore, the pair of Y coils 22b described above are formed in exactly the same manner.

In such a configuration, the coils 20a and 20b are wound in series around the rectangular parallelepiped magnetic core 23 with taps 24 provided, so when assembled as shown in FIG. 8, the wires are connected by crossing each other ( connection points), and the winding routing can be simplified.

According to such a configuration, the X coil "22a" and the Y coil 22b have a symmetrical structure, resulting in coarse coupling, improving the inductance balance, and preventing magnetic interference between magnetic bodies with respect to leakage magnetic fields. You can.Also,
Since the magnetic circuit PFC has a frame-shaped structure that is not disposed on the upper or lower surface of the element CHI, the thickness in the stacking direction is reduced, making it possible to reduce the thickness.

(Rotating magnetic field confinement case Fig. 10.11.12) 1st
Figure 0 is a diagram showing the case RFS, and Figure A is a plan view.
Figure B is a cross-sectional view taken along line 1.0B-10B. In the figure, the inner case RFSb has a frame-shaped aperture part 30 whose central part is concave, a bent part 31 whose opposite end side is bent upward by approximately 90 degrees, and each of the four corners of which are bent in an oblique direction. The case RFSb is formed by pressing a highly conductive material such as an oxygen-free copper plate.

In this case, the constricted portion 30 and the bent portion 31 can improve the mechanical strength of the inner case RFSb in the torsion direction, and can appropriately limit the outer diameter dimensions in the longitudinal and lateral directions between the bent portions 31 facing each other. . Also,
The aperture section 30 can appropriately adjust the distance between the magnet body BIMb arranged on the outer surface side of this case RFSb and the element CHI arranged on the inner surface side. Note that the cutout portions 32 provided at the four corners are each bent portion 2a of the board FPC disposed within this case RFSb.

It forms the drawer parts 2b, 2c, and 2d.

According to such a configuration, the inner case RFSb can be formed by a press working method, and therefore can be manufactured with high precision dimensions and at low cost.

Although the inner case RFSb is made of oxygen-free steel, it may also be made of copper, silver, gold plate, or a plated alloy plate thereof.

FIG. 11 is a diagram showing an outer case RFSa corresponding to the above-described inner case RFSb, with FIG. 11A being a plan view and FIG. 11B being a sectional view taken along line IIB-11B. In the same figure,
This outer case RFS a.

It is formed using the same material and manufacturing method as the inner case RFSb described above, and its structure is almost the same as described above, with a frame-shaped constriction part 33 whose center part is concave, and the opposite end of the constriction part 33 upwardly extending at an angle of approximately 90 degrees. It has a bent part 34 which is bent in a direction, and a notch part 35 which is cut diagonally at each of its four corners. In this case, the mutually opposing bent portions 34 are formed so that the inner dimensions thereof are approximately the same as the outer dimensions between the bent portions 31 of the inner case RFSb described above, and the height H is increased. has been done. Note that the aperture 33 and the notch 35 are formed to have substantially the same dimensions as the aforementioned inner case RFSb.

The outer case RFSa and the inner case RFSb configured in this way are shown in a plan view in FIG. 12A and in FIG. 12B.
As shown in the cross-sectional views 12B-12B, the inner case RFSb is inserted into the outer case RFSa, and the outer surfaces of the bent portions 31 of the outer case RFSa are brought into contact with each other and connected, thereby integrating the case RFS. is assembled.

(Case assembly Figure 13) Figure 13 shows the board assembly BND inside the case RFS mentioned above.
This figure shows a cross-sectional view of the storage arrangement. In the figure, a polyimide film 36 with a thickness of about 0.1 m, for example, is adhesively arranged as an electrically insulating sheet on the bottom surface of the outer case RFSa, and a board assembly BND is mounted on this film 36. At its periphery is a magnetic circuit FPC.
are arranged respectively, and after applying an epoxy adhesive 37 to the upper surface of the board assembly BND, an inner case RFSb is inserted and bonded to the upper part of these. In this case, the bent portion 3 of this outer case RFSa
The inner surface of the inner case 4 and the outer surface of the bent portion 31 of the inner case RFSb are electrically and Ia mechanically joined by metal flow, soldering, etc. at the portion indicated by the x mark. Furthermore, the gap between the outer case RFSa and the inner case RFSb is filled with silicone resin SIR to form the board assembly BN.
D and magnetic circuit PFC are fixedly arranged. In addition,
In this case, the bent portions 2 (2a, 2
b, 2c, 2d) are drawn out. 38 is a lead wire for connecting the coil COI or connecting the coil COI to the external terminal 9c provided on the FPC board.

In such a configuration, when a leakage magnetic field is generated by driving the magnetic circuit FPC, an induced current flows through the case RFS to form a closed loop, and this induced current confines the rotating magnetic field within the case RFS, so that the element CHI is applied with a uniform rotating magnetic field.

According to such a configuration, the element CHI mounted on the board FPC is sandwiched between the outer case RF S a and the inner case RFS b in the concave part of the central part, and the magnetic circuit PFC is held in the convex part of the peripheral part. Since they are arranged in parallel, the packaging effect can be improved and the ease of assembly can be greatly improved.

Furthermore, by reducing the volume covered by the outer case RFSa and the inner case RFsb, the VI product (volume) can be reduced, and the magnetic circuits PF and C that generate the rotating magnetic field can be made smaller. Furthermore, by providing concave portions formed by constricted portions 30 and 33 in the outer case RF S a and the inner case RFS b and reducing the gap between the opposing concave portions, the rotating magnetic field has a component perpendicular to the plane of the element CHI ( Z component) is close to zero and there is only a horizontal component, and uniformity can be improved.

(Magnet Figure 14) Figure 14 is a diagram showing the magnet body BIM, in which Figure A is a plan view, Figure B is a side view, and Figure C is a front view.

In the figure, the magnetic body BIM includes an inclined plate IN made of a non-magnetic material, such as copper, and one of the opposing surfaces has a predetermined inclined surface.
N, a first magnetic shunt plate HOM of uniform plate thickness disposed on the slope side of this inclined drawing NN, this first magnetic shunt plate HOM
A magnet plate MAG having a uniform thickness and placed on the upper surface of the first magnet plate MAG and a second magnetic shunt plate HOM having an inclined surface on the upper surface of this magnet plate MAG are sequentially laminated and integrated with an epoxy adhesive. The laminated plate thickness is uniform over almost the entire surface. A uniform magnetic field for generating a bias magnetic field is emitted from the upper and lower surfaces of this magnet body BIM over almost the entire surface.

(Bias Coil FIG. 15) FIG. 15 is a diagram showing the bias coil BIC, where A is a perspective view and FIG. B is a cross-sectional view taken along line 15B-15B. In the same figure, the bias coil BIC has a winding 40 whose outer surface is coated with an insulating member such as a thermosetting resin, and is wound in an array with a cross section of 5 x 4 wires so that the overall shape has a picture frame shape. After that, it is crimped by heat welding, cooled, and formed into a frame shape of a predetermined value. In this case, the thermosetting resin coated on the outer surface of each winding 40 is thermally welded to each other, and each winding 40 is clogged and formed by pressure bonding, and by cooling, each winding 40 is hardened in a bundled state. Therefore, it is formed into a predetermined picture frame shape.

(Mounting the magnet and bias coil on the case assembly
(FIG. 16) FIG. 16 is a sectional view of the case RFS assembly described in FIG. 13 incorporating the magnet body BIM and bias coil BIC. In the same figure,
An upper magnet body B I M a and a lower magnet body BIM b are adhesively arranged on the upper and lower surfaces of the case RFS assembly that houses the board assembly END and the magnetic circuit PFC inside, respectively.
Further, a bias coil BIC is housed in a frame-shaped groove formed by being surrounded by the peripheral edge of the upper magnet B I Ma and the bent portion 31 of the inner case RFSb. In this case, the upper magnet body BIMa and the lower magnet body BIMb are made of the same material and 9 dimensions, and the inclined plate INN side of these magnet bodies BIMa and BIMb is connected to the constriction part of the inner case RFSb. 30 and the concave portion surrounded by the constriction portion 33 of the outer case RFSa in close contact with each other.

In such a configuration, a pair of magnet bodies BIMa,
Since the BIMb is placed and the bias coil BIC can be placed in the frame-shaped groove formed on the periphery of the BIMb,
The overall thickness of each component in the stacking direction is reduced, allowing for a compact 9gI shape. In addition, the outer case RF S
Since a frame-shaped space groove is formed between a and the outer edge portion of the lower magnet body BIMb, the bias coil BI
C may be arranged, a bias coil may be newly provided, and furthermore, a bias coil may be formed by winding a wire as a coil bobbin.

(Magnetic shield case Fig. 17, 18, 19) Fig. 17
The figures show the shield case SHI, with figure A being a plan view and figure B being a 17B-17B cross-sectional view thereof. In the figure, the outer shield case 5HIa has a flat portion 51.
A bent part 52 is formed on the opposite end of the flat part 51 by folding upward at approximately 90 degrees, a recessed part 53 is partially cut out in the center of the bent part 52, and each of its four corners is diagonally shaped. This shield case S HI a is made of a material having high magnetic permeability and high saturation magnetic flux density, and preferably high thermal conductivity, such as a permalloy plate. It is formed by pressing.

FIG. 18 is a diagram showing an inner shield case 5HIb corresponding to the above-mentioned outer shield case 5HIa, with FIG. 18A being a plan view and FIG. 18B being a 18B-18B sectional view thereof. In the figure, this inner shield case 5HIb is
It is formed using the same material and manufacturing method as the above-mentioned outer shield case S HI a, and its structure is almost the same as above, with a flat part 55 and an opposite end of the flat part 55 folded upward at approximately 90 degrees. a bent portion 56; a recessed portion 57 partially cut out in the center of the bent portion 56;
Each of its four corners has a notch 58 cut diagonally. In this case, the mutually opposing bent portions 56 have an outer dimension approximately equal to the inner dimension between the bent portions 52 of the outer shield case SHIa described above, and have a reduced height H. It is formed by

The outer shield case 5HIa and the inner shield case 5HIb configured in this manner are shown in a plan view in FIG. 19A and in a sectional view taken along 19B-49B in FIG. 19B. By inserting the inner shield case 5HIb and performing spot welding or solder welding to the recess 59 formed by the recess 53 of the outer shield case 5HIa and the recess 57 of the inner shield case SHIb, and fixing it magnetically and mechanically. The integrated outer shield case SHIa is assembled.

In such a configuration, the outer shield case 5HIa
By setting the bent portion 52 of the inner shield case 5HIb and the bent portion 56 of the inner shield case 5HIb in the lateral direction, that is, in the direction that intersects with the laminating direction, by aligning them with the laminating direction, the lateral dimension - can be reduced and the size can be reduced. It also enables high integration of component parts.

(Magnetic shield case assembly FIG. 20) FIG. 20 shows the case RFS assembly, which incorporates the board assembly BND and magnetic circuit FPC inside the shield case SHI assembly described in FIG. magnetic plate BIM
Fig. 3a shows a cross-sectional view incorporating an assembly consisting of BIMb and bias coil BIC. In the figure, inside the outer shield case SHI a, there is an upper magnet body B I M a from the bottom side to the center, a bias coil BIC at the periphery, and a case RFS assembly (board assembly BND inside, magnetic After sequentially stacking and arranging the lower magnet body BIMb (in which the circuit PFC, etc. is incorporated), the inner shield case 5HIb is inserted, and the recess 53 of the outer shield case SHIa and the recess 57 of the inner shield case 5HIb described above are inserted. recess 59 (19th
(see figure) is welded and sealed. In this case, by filling the shield case SHI with grease or the like, the internal components will come into close contact with each other, and the heat generated from the case RFS will be transferred to the outside through the shield case SHI. can be released to Furthermore, the heat dissipation effect can be improved by making the case RFS and the shield case SHI contact each other at their sides by press-fitting.

In such a configuration, the outer shield case S HI
By stacking the case RFS assembly on the bottom side of the case RFS a so that the bent parts 31 and 34 thereof face each other, each component stacked between the outer shield case S HI a and the inner shield case 5 HI b is brought into close contact with each other. Since it can be arranged, it can be made smaller and thinner, and a heat dissipation effect can be obtained at the same time.

(Packaging case FIG. 21) FIG. 21 is a diagram showing a packaging case PKG, in which FIG. 21A is a plan view and FIG. 21B is a 21B-21B sectional view thereof. In the same figure, the packaging case PKG is formed by drawing a material with good thermal conductivity, for example, an aluminum plate with a thickness of about 0.51 mm.Although not shown, the packaging case PKG has a black coating on its outer surface. There is. This packaging case PKG is the outer shield case 5H.
It is possible to improve the shape of Ia and use it for both purposes.

In such a configuration, this packaging case P
The KG serves as the outer case after the magnetic bubble memory device is completed and also functions as a heat sink, and its inner corner also functions as a mold during resin molding using the botting method described below. .

(Terminal fixing plate and contact pad Fig. 22.23)
FIG. 22 is a diagram showing the terminal fixing plate TEF, in which FIG. 22A is a plan view, FIG. 22B is a sectional view taken along line 22B-228, and FIG. 22C is a rear view thereof. In the figure, the terminal fixing plate TEF is made of an electrically insulating material, for example, a glass epoxy resin plate 6o, and its external shape is such that it can be inserted and removed freely into the opening of the packaging case PKG. The resin plate 6 is formed to have dimensions in the direction.
A large number of through holes 61 are formed in a matrix arrangement at predetermined intervals in the vertical and horizontal directions except for the peripheral area of 0, and the corners of these through holes have cross sections that are not rotationally symmetrical. A concave non-through hole 62 is provided, and a mark 63 made of, for example, a white coating film for locating directionality or features is attached inside the non-through hole 62. In addition, a large number of through holes 6 are formed in this resin plate 60.
As shown in FIG. 1B, large-diameter openings 64 are coaxially communicated with each other on the back side of the plate, and all of these openings 64 have a depth of about 60% of the plate thickness. In addition, it communicates with the through hole 61 with a step in the middle. Also,
As shown in Figure C, the back side of this resin plate 60 has a depth approximately equal to the depth of the opening 64 along its peripheral portion, and has a different width in the plane direction and a concave cross section. A groove 65 is formed, and the above-mentioned coil CO is placed inside this groove 65.
It constitutes a passage section and a connection section for the winding of I and the winding of bias coil BIC. In addition, the corner portion 6 of this resin plate 60
6 does not have a concave shape, but has a predetermined plate thickness, and forms a contact surface with the inner surface of the packaging case PKG described above. In this way, the back side of the resin plate 60 is formed to have a two-tiered structure with different plate thicknesses.

FIG. 23 is a diagram showing the contact pad GNP, with FIG. 23A being a plan view and FIG. 23B being a sectional view taken along line 23B-23B. In the figure, the contact pad GNP is made of a highly conductive material, for example, with a plate thickness of 0°5fiI! A nickel plating layer 71. is formed on the surface of a blank piece 70, which is made by punching out a copper plate of about 1.5 mm in size by press working. It is constructed by forming a gold plating layer 72.

(Final assembly FIG. 20.4.2) For each component configured in this way, first, the shield case assembly described in FIG. 20 is inserted into the packaging case PKG described above. In this state, the connection parts 3a, 3b, 3c, and 3d of the board assembly BND are connected from the four corners of this packaging case PKG (Fig. 4A).
(see) is about 9 from each bending part 2a, 2b, 2c, 2d.
It bends at 0 degrees and protrudes. Next, resin molding is performed at the four corners of this packaging case PKG by a potting method, and each individual component is fixedly arranged inside this packaging case PKG. Subsequently, these connecting portions 3a, 3b, 3c, and 3d are connected to the corresponding bent portions 2a,
2b, 2c, and 2d are further bent at about 90 degrees and attached to the outer surface of the inner shield case 5HIb with adhesive.
After combining as shown in Figure B, the terminal fixing plate TE
A contact pad GNP is mounted in each opening 64 on the back side of F, or the side surface of the contact pad GNP is further fixed with an adhesive, and inserted into the packaging case PKG, and each connection portion 3a, 3b, 3c is formed.

Place it in contact with 3d. In this case, each connection part 3a.

Since the arrangement pitch of each external terminal 9b provided in 3b, 3c, and 3d matches the arrangement pitch of each contact pad GNP, each external terminal 9b and contact pad GNP are in electrical contact.

Next, from the back side of the terminal fixing plate TEF placed, each through hole 61
For example, by inserting a heating element with a thin tip into the contact pad GNP and thermocompressing the contact pad GNP, each external terminal 9b and the corresponding contact pad GNP are electrically connected, and the terminal fixing plate TEF is also mechanically connected at the same time. After fixing, the magnetic bubble memory device shown in FIG. 2 is completed.

(Magnetic bubble memory element No. 24, 25, 26, 27,
Figure 213) Figure 24 shows the above-mentioned magnetic bubble memory element C.
It shows a cross-sectional view of the vicinity of the pounding pad PAD of the H construction. In the same figure, GGG is gadoliniu
m-gallium-garnet substrate, L
PE is a bubble magnetic film formed by liquid phase epitaxial growth, and an example of its composition is shown in Table 1 on the next page.

(This page, the following margins) Table 1 1ON indicates an ion implantation layer formed on the surface of the LPE film to suppress hard bubbles. SPI is the first spacer, for example 3000 N thick Sio2 is formed by gas phase chemical reaction.

GND1 and CND2 indicate two conductor layers, which have the function of controlling bubble generation, copying (splitting) and exchange, which will be described later, and the lower first conductor layer CND1 is M o
, and the upper second conductor layers CND2 are each formed of a material such as AU. SF3 and SF3 are interlayer insulating films (second and third spacers) made of polyimide resin, etc., which electrically insulate the conductor layer CND and the transfer pattern layer P, such as permalloy, formed thereon. This is a passivation film made of a 5-inch film or the like formed by a vapor phase chemical reaction method. PAD indicates a bonding pad of the element CHI, and a thin connector wire such as Aim is bonded here by thermocompression bonding or ultrasonic bonding. This bonding pad PAD has a lower first layer PADi of C
r, second layer PAD in the center, Au layer, third layer PAD above
, are each made of a material such as an Au plating layer,
The second MPAD and the third layer PAD may be formed of a material such as Cr or Cu. P represents a layer used for a bubble transfer path, a bubble division 9 generation, replacement, and detection section, and a guardrail section. In the following explanation, this layer will be referred to as a transfer pattern layer for convenience.

In the example of FIG. 24, this transfer pattern layer P is transferred to the lower layer P1.
Although e-Ni is used for the upper layer P2 and Fa-Ni is used for the upper layer P2, it is also possible to interchange the materials of the two above and below, as described above.

Hereinafter, the transfer pattern layer consisting of the plurality of layers described above will be transferred to the element C.
An example of application to each part of the HI will be explained using the plan views from Figure 25 onwards. In these plan views, each layer of the transfer pattern layer is formed with self-aligned lines, so they are represented by the same outline. Please be careful. Figure 25 shows the bubble detector part, where MEM is the main magnetoresistive element, which uses the change in resistance value when bubbles stretched in a strip shape in the horizontal direction pass through it to detect the presence or absence of bubbles. Detect. MED is a dummy magnetoresistive element having a pattern similar to that of the main magnetoresistive element MEM, and is used to detect noise components due to the influence of a rotating magnetic field. Above the main magnetoresistive element MEM, several ten stages of bubble stretchers ST are formed, although only two stages are shown, which stretch the bubbles laterally and transfer them downward. Note that PR indicates the bubble transfer direction.

ER is a bubble eraser, and when a bubble reaches the conductor layer CND, it is erased. A guardrail GR consisting of three rows of pattern groups is provided around this detector and between the dummy and main detection.
It is designed to expel unnecessary bubbles generated inside the guardrail GR to the outside thereof, and prevent unnecessary bubbles generated outside the guardrail GR from entering inside it. In addition,
In the plane pattern diagrams shown in FIG. 25 and subsequent figures, patterns other than the conductor layer CND indicate the transfer pattern layer P explained in FIG. 24. In the figure, the signal-to-noise ratio (S/
N ratio) was improved. For example, when using a three-layer permalloy layer with a 5in2 film interposed between each layer as a transfer pattern, the S/N ratio can be improved by more than twice as compared to a single-layer permalloy layer, as shown in Table 2 below. I can do it.

Table 2 Furthermore, the performance of the guardrail GR is also improved, such as by increasing the removal rate of unnecessary bubbles due to the reduction in the holding force Hc.

FIG. 26 shows the magnetic bubble generator GEN, and by making the transfer pattern layer P multilayer, the current generated by the magnetic bubble can be reduced, and the life of the conductor layer CND of the magnetic bubble generator can be extended. It became possible. Therefore, a semiconductor element with a small current capacity value can be used for the drive circuit of the conductor layer CND, and the cost can be reduced.

FIG. 27 shows a write major line WML formed by transfer pattern rows such as minor loops m, Pw, to Pw3 formed by transfer patterns such as P a "P h, and a swap gate section formed by a hairpin-shaped conductor layer CND. In the same figure.

P7 is the same as the transfer pattern P7 in the bubble generator GEN in FIG. 26. In other words, the bubble generated in the bubble generator GEN is transferred to the write major line WML through the transfer path P1 to P7. . When a current is passed through the swap conductor layer CND, the magnetic bubble of the transfer pattern Pd of the minor loop m1 becomes the transfer pattern P.
The magnetic bubble is transferred to transfer pattern Pw3 of major line WML through Q and Pm, and the magnetic bubble from major line Pw1 is transferred to transfer pattern Pa of minor loop via transfer patterns Pk, Pj, and Pi, and the bubble is exchanged.
That is, information is rewritten. Note that the rightmost minor loop md is not provided with a swap gate, but this is a dummy loop in which no magnetic bubble is injected to reduce the peripheral effect. By multilayering the transfer pattern layer P i '' P m at the exchange position in this way, magnetic bubbles can be exchanged with a small current value.

In addition, as shown in FIG. 28, a magnetic bubble copier, an IP
- Similarly, the divider can also be driven with a small current value.

In the same figure, the normal magnetic bubbles are Pn~Pg, Ps”P
The bubble is transferred along the normal path of x, and when a current is passed through the conductor layer CHD, the bubble is split at the position of the transfer pattern Pg,
One divided magnetic bubble is transferred to the read major line RML via P')'yPs to P1°.

(Holding magnetic field and rotating magnetic field FIG. 29) Magnet plate MAG is arranged at an angle of about 2 degrees with respect to element CHI. This is so that the bias magnetic field Hb is applied to the element CHI with a slight deviation from the perpendicular direction, thereby creating a holding magnetic field Hde that improves the start and stop margins of bubble transfer by about 6 (Oe) (No. 29 Figure A).

As shown in FIG. 29A, due to the inclination of the angle θ between the magnet body BIM and the element CHI, the DC magnetic field Hz is as follows.

It has a component Hdc in the xy plane. The magnitude of this in-plane component Hdc is HdC-8 in θ, and the inclination angle θ is usually selected so that Hdc-sin θ=5 (Os) to 6 (Oe). Further, the direction of this in-plane component Hdc is inclined so as to coincide with the start/stop (St/Sp) direction (+x-axis direction) of the rotating magnetic field Hr.

This xy-plane component Hdc is a known magnetic field called a holding field, which functions effectively for the start/stop (St/Sp) operation of the rotating magnetic field Hr. Note that the magnitude of the bias magnetic field Hb acting perpendicularly to the element CHI surface is H2-cos θ.

Now, since the above-mentioned holding field HdC always acts on the xy plane of the element CH1, the rotating magnetic field Hr' acting on the element CH1 is eccentric as illustrated in FIG. 29. In the figure, Hr is a rotating magnetic field applied from the outside, and Hr' is a rotating magnetic field acting on the element CHI.

In this case, the rotating magnetic field Hr' acting on CHI is a combination of the rotating magnetic field Hr applied from the outside and the in-plane component Hdc-, and the center 0' of the rotating magnetic field Hr' is the start/stop (St/Sp). It is translated by an in-plane component Hdc in the +x-axis direction. Therefore, as is clear from the results in the same figure, the rotating magnetic field H applied from the outside
Even if the strength of r is 1 Hrl, the strength IHr'l of the rotating magnetic field that effectively acts on the blocking CHI varies depending on the phase of the rotating magnetic field Hr. That is, IHr' in the St/Sp direction
1 is IHrl+1Hdcl, which is stronger than 1Hrl by the strength of the holding field Hdc, IHdcl. Conversely, lHr'l in the opposite direction to the S t / S p direction is 1Hrl IHdcl, which is weaker than IHrl by 1Hdcl.

(Peripheral Circuit FIG. 30) Finally, the peripheral circuit of element CHI will be explained with reference to FIG. 30. R
F is a circuit for causing a current with a phase difference of 90' to flow through the X and Y coils of the element CHI to generate a rotating magnetic field Hr. S.A.
is a sense amplifier that samples, senses, and amplifies the minute bubble detection signal from the magnetoresistive element of element CHI in synchronization with the timing of the rotating magnetic field. The DR is a drive circuit that applies current at predetermined timing to each functional conductor of a replicate that is related to bubble generation and swap and read related to writing of the MBM device.

The above circuit is synchronized by a timing generation circuit TG so as to operate in synchronization with the cycle and phase angle of the rotating magnetic field Hr.

(Rotating magnetic field distribution characteristics FIG. 31) FIG. 31 shows the rotating magnetic field distribution characteristics of the magnetic circuit PFC described above. That is, in the figure, the horizontal axis represents the length in the X-axis direction with the center of the magnetic circuit PFC shown in FIG. 8B as O, and the vertical axis represents the rotating magnetic field strength Hx in the X-axis direction.
When the rotating magnetic field strength H'x in the X-axis direction when =O is shown, rotating magnetic field distribution characteristics as shown by curved lines were obtained.

As is clear from the figure, a substantially uniform rotating magnetic field strength Hx is obtained within the range of distance -Xc to +XC between the opposing cores COR of the magnetic circuit PF-C, and
Effective area of HI (minimum range to which rotating magnetic field should be applied)
In the range of -Xs to 10Xe, a magnetic field strength uniformity of ±2% was obtained. Note that the curve (2) indicated by a broken line is the rotating magnetic field distribution characteristic due to the magnetic circuit of the conventional configuration.

(Modification 1) Next, a modification of the series of embodiments shown in FIGS. 1 to 23 will be described with reference to FIGS. 32 to 4.5.

Note that the configuration (materials, structure,
method) and effects will be omitted.

(Flexible wiring board modification 1, FIG. 32) FIG. 32 shows a modification of the flexible wiring board. The flexible wiring board FPC2 in the figure differs from that in FIG. 4 in the following points.

■ The wiring 100 is drawn out in four directions in the parts 102a to 102d led out from inside the rotating magnetic field confinement case. In the section 104jil, section 104), it is concentrated in two directions, left and right.

(2) The flexible substrate FPC2 is electrically connected to an external terminal (pin grid explained in FIG. 42) without being bent.

- An extended portion 100d of the wiring 100 is provided on the flexible board FPC2 so that characteristics can be inspected during the assembly process. The terminal 109b is a terminal that can be contacted with a probe needle or the like.

■ The width (vertical length in the figure) of the film substrate 101 (FPC2) is set to 35 mm in order to facilitate automatic assembly, etc., or to use industry standard film substrates and manufacturing equipment.
m+ (one of the reasons for consolidating the wiring in two directions as mentioned in ■). In addition, the film 101 has a sprocket hole 1.
05a is provided.

During assembly, this film 101 is cut along the dashed line in the figure, and parts unnecessary for the finished product are cut away. The board FPC2 has a copper-based wiring pattern obtained by bonding a copper thin film with an epoxy adhesive onto a base film made of a polyimide resin film with a thickness of about 50 μs, and patterning the copper thin film using an etching technique. By electroplating method etc. on the copper underlying wiring layer.

A Ni plating layer and an Au plating layer are sequentially formed.

This Au plating layer is provided to prevent electrical migration of the copper layer and to facilitate thermocompression bonding with the bonding pad of the magnetic bubble memory chip CH process. The Ni layer is used to improve the adhesion between the copper layer and the gold layer. At this stage, the wiring patterns 100 of each frame are connected by frame-shaped patterns and extensions 100e provided on the outer periphery in the figure, but this is due to electroplating.

As described above, in the one-frame film board FPC2, the external connection portions 100c of the wiring 100 are concentrated in two directions, left and right. One reason for consolidating them horizontally rather than vertically is compatibility with the aforementioned 35m film. Another reason is as follows. Film substrate FP
The memory chip CHI is face-up bonded to the bottom of C2, but as will be described later, the substrate FPC2 and the chips C and HI are tilted in the left-right direction in the figure (second
Under the same bias conditions as in Figure B, the slope is downward to the right so that the left side is high and the right side is low with respect to the magnet body.)
. Therefore, since the film board FPC2 cannot be tilted in the vertical direction, the chip CHI is bonded to the conductor case described later, and then the film board FPC and the chip CHI are bonded.
When making an electrical connection with the chip, uniform pressure is applied to all the connection parts on the left side, and uniform bonding is also applied to the right side when bonding the connection part 100c with the chip of the film substrate FPC2 and the pad of the chip CHI. I can do it. This also applies to the connection between the film substrate FPC and a printed circuit board, which will be described later.

(Rotating magnetic field confinement case modification example 1, No. 33.34°35
FIG. 33 is a diagram showing the inner case RFS2b, in which FIG. 33A is a plan view and FIG. 33B is a 33B-33B sectional view thereof. This case RFS2b is compared with that in Fig. 10,
The difference is that the drawing part is omitted and the thickness of the bottom part increases as it approaches the right side. As shown in the figure, the lower surface is inclined downwardly to the right at an angle of approximately 1.7° with respect to the upper surface of the bottom. As can be seen from FIG. 388, a magnet body including a magnetization plate and a permanent magnet is attached to the upper side, and a chip CHI is arranged on the lower side.

That is, the uneven thickness in this case is provided to apply a holding magnetic field Hdc to the chip CHI due to the inclination of the magnet body and the chip CHI. The inclined surface of the conductor case described above is formed by press working (uneven thickness ribbon processing) under a load of about 300 tons. Alternatively, this inclined surface can be formed by cutting, or by tilting a roller during rolling.

By eliminating the constriction part as shown in FIG. 10, the film substrate is no longer bent along the constriction part, so that the stress applied to the film substrate is alleviated. Further, since the conductor case RFS2b itself is provided with an inclined surface, the inclined plates INM and INN as shown in FIG. 14 are not required (to four in total), and the number of parts can be reduced. Reducing the number of parts leads to savings in material and assembly costs.

FIG. 34 is a diagram showing the outer case RF S 2 a, with FIG. 34A being a plan view and FIG. 34B being a 34B-34B sectional view thereof. Outer case RFS2a is inner case RFS2b
The difference is that a constriction part 133 is provided for housing or fitting the magnetic core PFC. outer case RF
The upper surface of the bottom plate of S2a is provided with an inclined surface downward to the right, similar to the lower surface of the bottom plate of inner case RFS2b.

Figure 35 shows outer and inner cases RFS2a and RFS2
(Same as in FIG. 12, the chip CHI, the film substrate FPC2, and the magnetic core PFC are omitted from the diagram.) Figure A is a plan view, and Figure B is its 35B. -35B sectional view.

(Case assembly modification example 1, Fig. 36) Fig. 36 shows the chip CHI, flexible board FPC2,
It is a diagram showing the state in which the magnetic circuit PFC is mounted in the outer case RF S 2 a (the state before the lid is covered with the inner case RFS 2 b), where A is a top view and B is a 36th view of the top view.
It is a sectional view of B-36B.

The chip CHI is attached to the board FPC2 before being housed in the case RF S 2 a. Flexible board F
If the side of PC2 with the wiring 100 is named the front side, the chip CHI is placed on the back side of the flexible substrate FPC2 with the main surface with the bonding pads, wiring, and transfer paths facing up (face up). mounted on. Of course, the parts to be connected are the wiring part 100a of the board FPC2 and the pad part of the chip CHI, but both are connected to the lead part 10.
Bonding is performed by thermocompression bonding 0a to the pad from above using a jig such as a capillary.

After bonding, the film substrate 101 on which a plurality of substrates FPC2 are connected is separated into individual substrates FPC2, and unnecessary wiring portions and reinforcing portions used during surrounding plating are cut off as shown in FIG. 36A.

Adhesive such as epoxy resin is applied to the mandrel case RF S 2 a using a stamp method, and the back surface of the chip CHI bonded to the film substrate FPC2 is adhered to that part. Chip CH and case RF S at this time
2a, the notch portion 135 of the case RFS2a and the external lead-out path portion 10 of the film substrate FPC2.
2 It can be determined with high accuracy by a = d. If necessary, more fine positioning adjustments can be made using a jig or the like.

Subsequently, the magnetic circuit PFC is fitted into the groove formed by the constricted portion 133 and the outer wall 134 of the case RF S 2 a.

In this state, apply silicone resin R around the chip CHI.
EG2 is potted, and the silicone resin REG2 increases its fluidity through heat treatment.

It enters between the back surface of the flexible substrate FPC2 and the main surface of the chip CHI due to capillary action, and the chip CHI is protected from adhesion of dust and intrusion of moisture.

The height of the aperture part 133 of the case RFS2a is equal to the height of the magnetic circuit F.
Considering the thickness of the PC, the thickness of the chip CHH, etc., the 36th B
As shown in the figure, the flexible substrate FPC2 is designed to be flat throughout the entire inside of the case. Thereafter, the case RFS2b is welded at the surface contact portion with the case RFS2a by ultrasonic welding.

(Magnet modification example 1, Fig. 37) Fig. 37 is a diagram showing the magnet BIM2, in which figure A is a plan view, figure B is a side view, and figure C is its 37G-37
It is a sectional view of G. The magnet body BIM2 in the same figure differs from that (BIM) in FIG. 14 in that the oblique punching NM and INN are omitted.

(Modified example 1 of mounting the magnet body and bias coil on the case assembly, Fig. 38) Fig. 38 shows the case RFS explained in Fig. 36. The magnet body BIM2 of Fig. 37 and the bias coil of Fig. 15 are attached to the case RFS 2 assembly explained in Fig. 36. These are diagrams showing a state in which the coil BIC is installed, in which figure A is a top view and figure B is its 38B.

-38B sectional view.

Upper magnet body BIM2a and bias coil BIC
is attached to the dish-shaped inner case RFS2b, and the lower magnet body BIM2b is attached to a flat part surrounded by the constricted part 38 of the outer case RFS2a.

As can be seen from Figure B, the chip CHI and the magnetic circuit PF
C is inclined in the left-right direction with respect to the parallel plane formed by the upper and lower magnet bodies B I M 2 a and BIM2b. Also,
The conditions for arranging the magnetic circuit PFC and the chip CHI in parallel are the same as in the examples shown in FIGS. 13 and 16, but the chip CHI is , the thickness of the magnetic circuit PFC, the outer case RF, and the height of the constricted portion 38 of 82a are designed so that no stress is applied to the flexible substrate FPC2.

(Magnetic shield case modification example 1, Figure 39.40) 3rd
FIG. 9 shows the upper shield case S HI 2 a, in which A is a top view, B is a right side view, and C is a bottom view. As can be seen from Figure A, the planar shape of the upper shield case S HI 2 a is square, and it is difficult to determine which axis among the four horizontal, vertical, downward-sloping, and upward-rightward 45° center lines (not shown) passing through the same point. It is also considered to be an object form. In addition, the four corner notches 1 perpendicular to the 45° center line
Reference numeral 54 is provided to pass through the four corner lead-out portions 1.degree. 2a to 102d of the film substrate FPC shown in FIG. 15
1 is a flat part of the case, and 152 is a wall part standing vertically. The wall 152 is provided with protrusions 152a to 152d at the center of each side. The heights of the protrusions 152a and 152c on the left and right sides are h2, and the protrusion height itself (h2 hl) is the same as the thickness t of the lower shield case 5HI2b shown in FIG. Also,
The heights of the protrusions 152b and 152d on the upper and lower sides are set to 1, and the protrusion height itself (ha bt) is slightly larger than the thickness to of the lower shield case 5I (I2b. For example, h1=4. s, h, = s, o; h, = 5
．． 3. to=0.5, upper and lower shield cases S H
When I 2 a and 5HI2b are assembled, the upper and lower side protrusions 152b and 152d of the upper shield case S HI 2 a are slightly (h x h 1t @ = O-3 ) is made to protrude, and is devised to facilitate positioning with the ceramic printed wiring board shown in FIG. 42 (the unit of each numerical value is ■).

FIG. 40 shows the lower shield case 5HI2b, with FIG. 40A showing a plan view and FIG. 40B showing a bottom side view. The plate-shaped lower shield case 5HI2b has recesses corresponding to the thickness to of the wall 152 of the upper shield case 5HI2a on the left, right, upper and lower sides, and the protrusion 1 of the upper case
52a to 152d are fitted. The vertical and horizontal lengths LiO3 and LiO2 of each case shown in FIGS. 39 and 40 are designed to be the same, for example, 22.41[a].

The lower shield case 5HI2b is the same as that shown in Fig. 18 (S
Compared to HIb), there is no need for bending, which not only results in lower costs, but also allows the thickness of the finished device to be reduced.

(Magnetic shield case assembly modification 1, Fig. 41) 4th
Figure 1 shows the magnetic shield case 5H shown in Figures 39 and 40.
This figure shows the intermediate assembly shown in FIG. 38 mounted in I2a, 5HI2b, and FIG. 41A is a plan view thereof, and FIG. 41B is a sectional view taken along line 41B-41B.

The assembly shown in FIG. 41 includes terminals 109a, 109b and plating wiring extension part 100 that are unnecessary as a final assembly.
However, at this stage, the operation test of the intermediate assembly and selection of non-defective products can be performed, and the average assembly cost per unit can be reduced.

Note that the continuity check and short circuit check between the film substrate FPC2 and the chip CHI are performed after the aforementioned face-up bonding and at each stage when the conductor case RFS2- and the like are assembled.

Upper and lower shield cases RFS2a and RFS2b
are bonded by spot welding, laser welding, etc.

(Pin grid terminal wiring board, Fig. 42) Fig. 42 shows the following:
This is a wiring board for electrically connecting the shield case assembly shown in FIG. 41 to the pin grid external connection terminal, and FIG. 41A is a top view thereof, FIG. C is its bottom view.

201 is a ceramic substrate with wiring 205 on the top surface, and this substrate has through-hole connection terminals 206 on the top surface,
Through hole 207, bottom through hole connection terminal 208
has. The other end portion 205a of the wiring 205 indicates a portion to which the outer lead portion 100c of the flexible wiring board FPC2 is connected. External connection pins 204 arranged in a grid are electrically connected to top terminals 206 through an electric shock layer formed in through holes 207 .

The slightly thicker wires 205 are for connecting the X coil, Y coil, and bias coil (Ix, IY, Ib
Each end terminal.

202 is a ceramic plate, onto which the lower shield case SHI 2b is adhered with epoxy resin or the like. In other words, this ceramic plate 2o2 is protected by the lower shield case 5HI2b.

It plays the role of an insulating plate that prevents the wiring portion 205b located below from short-circuiting.

Further, the ceramic plate 202 has recesses 202b and 202d, and the above-mentioned upper shield case SHI
The protruding portions 152b and 152d of 2a are fitted into the shield case assembly, and also serve as positioning when bonding the shield case assembly. The ceramic substrate 201 and the ceramic plate 202 are stacked together in the state of green ceramics, and then sintered.

Reference numeral 203 denotes a frame-shaped sealing ring, which is bonded to the edge of the ceramic substrate 201 with silver brazing material or the like.
to the part that protrudes outward.

The rear packaging cap PKG2 is welded on. Frame 203 and grid pin 2
The material for 04 is F, which has a coefficient of thermal expansion close to that of ceramics.
e-N1-co alloy (commonly known as KOVAR) is selected.

Wiring 205. Terminals 206, 208. Through hole 207
A metallized layer of W is formed on the ceramic substrate 201 in a portion to which the frame 203 is brazed.

After the two ceramic materials 201 and 202 are sintered, the grid pin 204 and the frame 203 are brazed to the ceramic substrate 201 using silver solder. W
The metallized layer has the function of strengthening the adhesive force with silver solder.

In this state, for the pin grid wiring board TPT2,
That is, Ni and Au layers are sequentially electroplated on the exposed W metallized layer and the Kovar material.
This layer is provided to strengthen the adhesive force between the Au layer and the Au layer. Since the pin 204 is made of Kovar material and is plated with Au, the user can easily solder the pin 204 when mounting it on a printed circuit board or the like. Au at the end 205a of the wiring 205
The plating layer enables thermocompression bonding with the Au-plated outer lead 100c of the film substrate FPC2. The Au plating layer of the frame 203 is useful for hermetically sealing the packaging cap PKG2, which will be described later.

On the back surface of the ceramic substrate 201, a W metallized layer, that is, an Au plating layer, is formed wider than the bonding surface with the frame 203 and the pin 204, as shown by outlines 209 and 208, and a silver brazing material is applied to the bonding interface between them. By using a ceramic material and using a packaging cap PKG2, which will be described later, airtight sealing is achieved.

Although the Au plating layer is not formed on the portion 205b of the wiring 205 located below the ceramic board 202, there is no problem with electrical migration because the pitch of the wiring is wider than that of the film substrate FPC2 described above.

(Pin grid wiring board assembly, Fig. 43) Fig. 43 is a diagram showing the state in which the shield case assembly shown in Fig. 41 is mounted on the pin grid wiring board TEF2 shown in Fig. Top view, figure B is 43B-43B
FIG.

The method for making this assembly has been explained in connection with FIG. 42, so a description thereof will be omitted.

(Packaging cap modification example 2, Fig. 44) Fig. 44
The figure shows the sealing cap, and figure A is its plan view;
Figure B is a sectional view taken along line 44B-44B.

Kovar cap PKG2 has two wall sections 221.2
22, and the bend between the two wall portions 221 and 222 is provided to improve heat dissipation so that the wall 222 is almost in contact with the upper shield case SHI2a, as can be seen from FIG. It is being

The bottom portion 223 is welded to the portion of the Kovar frame 223 exposed from the ceramic substrate 201 by resistance welding or the like. Therefore, the level difference between the exposed portion of the frame 223 and the side surface of the ceramic substrate 201 is
Useful for positioning the KG2 inset.

(Completed device structure modification example 1, FIG. 45) FIG. 45 shows the completed structure of the series of modifications explained in FIGS. 32 to 44.
That is, the intermediate assembly shown in FIG. 43 is replaced with the cap P shown in FIG.
FIG. 2 is a diagram showing a structure sealed with KG2, in which FIG. A is a top view, B is a cross-sectional view taken along line 45B-45B, and C is a right side view.

(Modification 2, FIGS. 46 and 47) This modification 2 is an improvement of the flexible wiring board FPC of the first embodiment explained using FIGS. 1 to 31. , a pin PIN that will serve as a connection terminal when mounted on the board is installed.

FIG. 46 is a perspective view of the FPC board used in Modification 2. The difference from the FPC board shown in FIGS. 3 and 4 is that the external connection terminal connecting portion 3 is A pin PIN for connection is installed. The other configurations are the same as the FPC board shown in FIGS. 3 and 4.

By using the substrate FPC shown in FIG. 46, the contact pad GNP shown in FIG. 23 becomes unnecessary.

This is because the pin PIN planted on the substrate FPC performs the electrical connection that the contact pad GNP has.

Now, the method of assembling the module using the substrate FPC shown in FIG. 46 is almost the same as the method explained in FIGS. 1 to 22. To explain the difference, first, in the connecting portion 3 of FIG. 4D, a pin PIN is planted on the circular external terminal 9b with a solder layer 13 interposed therebetween. and Figure 13, 1st
In the case assembly shown in FIGS. 6 and 20, case RF
A pin PIN protrudes upward from the connecting portion 3 of the board FPC extending from S. Then, as in the first embodiment, the assembly shown in FIG. 20 is assembled into a packaging case PKG.
After being inserted into the inner shield case 5HIb, the extending connecting portion 3 is bonded along the lower surface of the inner shield case 5HIb. Thereafter, the module shown in FIG. 47 is obtained by inserting the pin PIN into the opening of the terminal fixing plate TEF and fixing the terminal fixing plate TEF to the shield case SHI and the packaging case PKG.

According to this module, the module can be directly mounted on a board equipped with an external drive circuit.

(Modification 3, FIGS. 48 to 52) In this modification 3, connection terminals are planted on the terminal board in advance, and the external connection terminals of the board FPC and the above connection terminals are joined, and the terminal board is It is designed to be directly mounted on the board using connection terminals.

FIG. 48 shows a substrate FP for explaining modification 3 of the present invention.
It is a top view of C, and the same parts as in the above-mentioned figure are attached with the same reference numerals. In the figure, the board Fpc has a square chip mounting part 1 in the center and a frame-shaped external connection terminal connection part (hereinafter referred to as a connection part) 3'(3a') in the periphery.
. A rectangular opening 4 (4a, 4b) with a double frame structure for mounting the CHI and connecting its terminal portion, and three perforations 5 (5a, 5b, 5c) for positioning the chip CHI are provided. Furthermore, an outer case R is provided around the chip mounting portion 1.
FSa bending part 34 and outer shield case S
Two sets of trapezoidal openings 4'(4a',4b') pass through the bent portion 52 of HI a.

4c', 4d') are provided. On the other hand, the connection portion 3' has a plurality of cut-out connection terminals (hereinafter referred to as connection terminals) 9 in which an annular pattern 9f is formed in the peripheral portion and a circular opening 4# is bored in the center thereof. ' are arranged at a predetermined pitch, and these connection terminals 9' are connected to chips C.
A wiring lead 9a connected to HI is connected to form a board assembly BND.

FIG. 49 is a diagram showing the terminal plate PGA; FIG. 49A is a plan view, FIG. 49B is a sectional view taken along line 49B-49B, and FIG.

In the figure, the terminal plate PGA is made of an electrically insulating material 1, such as a glass epoxy resin plate 200, and has a square opening 201 in the center into which the shield case SHI assembly described above can be inserted. The external shape is formed to have dimensions in the vertical and horizontal directions that allow insertion of an opening of a packaging case PKG, which will be described later. Further, a plurality of metal pins 202 are implanted around the resin plate 200 at a pitch equivalent to the arrangement of the external connection terminals 9' provided on the FPC board.

FIG. 50 is a diagram showing the packaging case PKG, in which FIG. 50A is a plan view and FIG. 50B is a 50B-50B sectional view thereof. The packaging case PKG is made of a material with good thermal conductivity, such as an aluminum plate with a thickness of approximately 0°5, which is drawn and has a main body part 210, a flange part 211 that forms a space around the inside, and an opening. Locking part 2 that fixes the peripheral part of the end
Although not shown, a black film is formed on the outer surface of the magnetic bubble memory device, and it functions as an outer case and a heat sink after the magnetic bubble memory device is completed.

Each component configured in this way is first
The board assembly BND explained in the figure is sandwiched and joined between the outer case RFSa and the lower case RFSb together with the magnetic circuit PFC as shown in FIG. 13. In this case, four trapezoidal openings 4a', 4 formed in the substrate FPC
The bent portions 34 of the outer case RFSa penetrate b', 4c', and 4d', and the connecting portions 3' of the board FPC are projected in a frame shape from the periphery of the case RFS assembly.

Next, this case RFS assembly is connected to the above-mentioned pair of magnets B.
The IM and bias coil BIC are stacked and sandwiched between the outer shield case S HI a and the inner shield case 5 HI b for electrical connection.

Connect mechanically. Also in this case, four trapezoidal openings 4a', 4b', 4c' are formed in the substrate FPC.
Each bent portion 52 of the outer shield case 5HIa passes through H4d', and similarly, each connection portion 3' of the board FPC is projected in a frame shape from the periphery of the shield case SHI assembly.

Subsequently, this shield case SHI assembly is mounted on the terminal board PGA explained in FIG. Insert the solder 203 into the opening 4'' of each connection terminal 9' as shown in the enlarged cross-sectional view in FIG.
More electrical.

Mechanically connected and arranged. In this case, the terminal board PGA
There is a shield case S in the opening 201 provided in the
The HI assembly is inserted with dimensional allowance. Next, this shield case SHI assembly is inserted into the packaging case PKG (FIG. 52). In this state, the board assembly BN is inserted from the four corners of the packaging case PKG.
Each of the connecting portions 3a', 3b', 3c', and 3d' of D is bent at about 90 degrees, further bent at about 90 degrees in the opposite direction, and placed in the flange 211 of the packaging case PKG. Next, resin molding is performed inside this packaging case PKG by a potting method to securely arrange each component inside this packaging case PKG, and the locking part 212 of the packaging case PKG is
A magnetic bubble memory device is completed by locking the terminal plate to the peripheral portion of the bottom surface of the terminal plate PGA.

According to such a configuration, the connection terminals 9' connected to each wiring lead 9C of the chip CHI are provided at the periphery of the board FPC.
Since the connection part 3' is provided to gather and align the
It becomes possible to reduce the vertical and horizontal width dimensions of the PC, and it becomes possible to use a standard 35 mm film, thereby reducing material costs, production costs, etc. Furthermore, by providing the connecting portion 3' in the peripheral portion of the FPC board, it is possible to electrically and mechanically connect to the terminal plate PGA in which a plurality of pins 202 corresponding to the peripheral portion are implanted. As shown in FIG. 2, mounting on a board BOD equipped with an external drive circuit becomes easy, and wiring leads can be drawn out from four directions to the external drive circuit. Especially when the number of chips CHI increases, the effect is extremely large. In other words, the element CHI
High-density packaging is easily possible. Furthermore, by arranging the connecting portion 3' of the board FPC and the pins 202 of the terminal board PGA in a single layer structure at the periphery, it is possible to arrange the connecting terminals at high density, and even higher density mounting is possible with the chip CHI. .

As explained above, according to the third modification of the present invention, by joining the external connection terminals of the flexible board and the connection terminals of the terminal board, the shape of the flexible wiring board can be made smaller, and the overall shape can be made smaller. Extremely excellent effects can be obtained, such as making it possible to make it into a quadrilateral shape, making it easy to mount it on a board equipped with an external drive circuit, and making it easy to mount the magnetic bubble memory element at high density.

(Modification 4. Figures 53 to 57) In this modification 4, a terminal board with connection pins embedded in the side of the module is provided, and thereby the modules can be stacked on the board. be.

As the substrate of this modification 4, the substrate FPC shown in FIG. 48 described in modification 3 is used.

FIG. 53 is a diagram showing the terminal plate PGA, with FIG. 53A being a plan view and FIG. 53B being a 53B-53B sectional view thereof. In the figure, the terminal plate PGA is made of a material having electrical insulation properties,
For example, it is made of a glass epoxy resin plate 300, and its outer shape is a rectangle with vertical and horizontal dimensions that are approximately the same as the height and width dimensions of the shield case SHI assembly. Further, in the center of this resin plate 300, a plurality of conductive pins 31 are arranged at a pitch equivalent to the arrangement pitch of the connection terminals 9' provided on the FPC board shown in FIG.
0 is implanted and fixed. This conductive pin 310 has a function as an external connection terminal for electrically connecting to an external drive circuit.

FIG. 54 is a diagram showing the packaging case PKG, with FIG. 54A being a plan view and FIG. 54B being a 54B-54B sectional view thereof. In the figure, the packaging case PKG is formed by pressing a material with good thermal conductivity, for example, an aluminum plate with a thickness of about 0.5+s+, and a black coating is formed on the outer surface (not shown). It functions as an outer case and heat dissipation body after the magnetic bubble memory device is completed.

Each of the components configured in this way is first assembled into the outer case RFS together with the magnetic circuit PFC as shown in FIG.
A and the lower case RFSb are sandwiched and joined together.

In this case, four trapezoidal openings 4a', 4b' are formed in the substrate FPC.

4c' and 4d' are penetrated by the bent portions 34 of the outer case RFSa, and the board F is provided at the periphery of the case RFS assembly.
Each connection part 3' of the PC becomes a frame shape and protrudes.

Next, this case RFS assembly is connected to the above-mentioned pair of magnets B.
The IM and bias coil BIC are stacked and sandwiched between the outer shield case S HI a and the inner shield case 5 HI b for electrical connection.

Connect mechanically. Also in this case, four trapezoidal openings 4a', 4b', 4c' are formed in the substrate FPC.
.

4d', each bent part 52 of the outer shield case SHI a penetrates, and similarly, each connection part 3' of the board FPC becomes a frame shape and protrudes from the peripheral part of the shield case SHI assembly. .

Next, as shown in FIG. 56, each connection part 3' of the board FPC is placed on the tip side of the bottle 310 of the terminal board PGA,
Opening 4 of each connection terminal 9' provided in each connection part 3'
1 into the tip 310a of each pin 310 and solder 32.
0 electrically and mechanically connected and fixed.

Next, the four terminal plates PGA connected and fixed to each connection part 3' of the board FPC are connected to the board assembly BN as shown in FIG.
Bend approximately 180 degrees to D and attach the shield case SHI.
They are placed around the four peripheries of the assembly, and the plate-shaped packaging case PKG described above is adhered from above and below using an adhesive (not shown). In addition, this packaging case PK is made by performing resin molding inside it using the potting method.
By fixing each component between G, the 57th
As shown in the plan view in the figure, there are multiple connection pins 3 on the 4 side sides.
A magnetic bubble memory device having external connection terminals 10 arranged in an array is completed.

Magnetic bubble memory device D configured in this way
For example, three EVs are stacked in a predetermined arrangement as shown in FIG.
Then, the circuit board PCB on which the wiring pattern 320 is formed is connected and integrated by soldering, and inserted into the opening 330 of the board BOD on which the drive circuit is mounted, and the circuit board PCB (not shown) formed on the back side of the board BOD is inserted. conductor pattern,
It is mounted by connecting it to the wiring pattern formed on the circuit board PCB by soldering. In addition, in FIG. 58, two opposing two of three magnetic bubble memory devices DEV are shown.
Although the circuit board PCB is connected and arranged on one side, in reality, it is arranged similarly on two adjacent opposite sides.

According to such a configuration, the magnetic bubble memory device D
Since three EVs are stacked on the board BOD, parallel driving is possible and high-speed writing and reading are possible. In addition, three magnetic bubble memory devices DEV
Since the external connection pins 310 of the same function section are arranged in the same arrangement location, external connection wiring becomes extremely easy.

In addition, in the above-mentioned modification 4, the external connection pin 31
Although the case where the terminal board PGA provided with 0 is provided on the four sides of the module has been described, the present invention is not limited to this, and the same effect can be obtained even if the terminal board PGA is provided on two opposing sides. Needless to say.

As explained above, according to the fourth modification, the external connection terminal portion provided on the periphery of the flexible wiring board and the external connection pin of the terminal board are joined, and the terminal board is placed on the side surface of the case of a highly conductive material. By constructing a magnetic bubble memory device, and by stacking and electrically connecting a plurality of these devices on a drive circuit board, it is possible to mount and arrange a plurality of magnetic bubble memory devices with a small footprint per one magnetic bubble memory device. High-density packaging of magnetic bubble memory elements and devices can be easily realized, and extremely excellent effects such as serial and parallel driving are possible can be obtained.

〔Effect of the invention〕

As explained above, according to the present invention, by joining the external connection terminals of the flexible board and the connection terminals of the terminal board, the shape of the flexible wiring board can be reduced, and the overall shape can be made smaller and thinner. , extremely excellent effects such as ease of mounting on a board equipped with an external drive circuit and high-density mounting of magnetic bubble memory elements can be obtained.

[Brief explanation of drawings]

FIG. 1 is a partially cutaway perspective view showing the whole magnetic bubble memory device according to the present invention, FIG. 2A is a bottom view, FIG. 2B is a sectional view taken along line 2B-2B of FIG. 3, and FIG. 3 is a stacked structure. Figure 4 is a diagram explaining the board FPC, Figure 5 is an exploded perspective view showing the
The figure shows a board assembly BN in which the element CHI is mounted on the board FPC.
6 is a diagram showing the element CHI, FIG. 7 is a diagram illustrating lead bonding of the board assembly BND, FIG. 8 is a diagram illustrating the magnetic circuit PFC, and FIG. 9 is a diagram illustrating the magnetic circuit. A diagram explaining the manufacturing method of PFC, FIG. 10 is a diagram showing the inner case RFSb, and FIG. 11 is a diagram showing the outer case RFSa.
12 is an assembly diagram of the case RFS, and FIG. 13 is a diagram showing the board assembly BND and magnetic circuit F in the case RFS.
A cross-sectional view of the assembly containing the PC, Figure 14 is the magnet BI
FIG. 15 is a diagram explaining the configuration of M, FIG. 15 is a diagram explaining the bias coil, FIG. 16 is a cross-sectional view of an assembly in which a pair of magnets BIM and bias coil BIC are incorporated in the case RFS assembly, and FIG. 17 is a diagram explaining the structure of M. Outer shield case S HI
a, FIG. 18 is a diagram showing the inner shield case 5HIb, FIG. 19 is an assembly diagram of the shield case SHI, and FIG. 20 is an assembly diagram of the shield case SHI shown in FIG. 16.
Figure 21 is a cross-sectional view of the assembly assembled inside, Figure 21 is a diagram showing the packaging case PKG, Figure 22 is a diagram showing the terminal fixing plate TE.
FIG. 23 is a diagram illustrating the configuration of contact pad F, FIG. 24 is a cross-sectional view of element CHI, and FIG.
The figure shows the configuration of the magnetic bubble detector of element CHI,
FIG. 26 shows the configuration of the magnetic bubble generator GEN of element CHI, and FIG. 27 shows the swap gate SW of element CHI.
28 is a diagram showing the configuration of the replicate gate REP of element CHI, FIG. 29A is a diagram showing the relationship between bias magnetic field Hb and holding magnetic field Hdc,
Figure B shows the total rotating magnetic field Hr', Figure 30 shows the entire magnetic bubble memory board, and Figure 31 shows the entire magnetic bubble memory board.
The figure is a rotating magnetic field distribution characteristic diagram, Figure 32 is a diagram showing a modification of the flexible wiring board, and Figure 33 is an inner case RFS2.
Fig. 3A is a plan view of Fig. b, and Fig. B is a plan view thereof.
B-33B sectional view, FIG. 34 is a diagram showing the outer case RFS2a, the same figure A is a plan view, and the same figure B is the 34B-
34B sectional view, Figure 35 is the outer and inner case RFS2
It is a diagram showing a state in which only a and RFS2b are combined,
Figure A is a plan view, Figure B is a 35B-35B cross-sectional view,
Figure 36 shows chip CHI, flexible board FPC2,
Magnetic circuit PFC mounted inside outer case RFS2a (1 m before covering with inner case RFS2b)
Figure A is a top view, and Figure B is its 36B.
-36B sectional view, FIG. 37 is a diagram showing the magnet body BIM2, the figure A is a plan view, the figure B is its side view, the figure C is its 37C-37C sectional view, and FIG. The case RF52 assembly explained in the figure is attached to the magnet body BIM2 shown in Fig. 37.
15 is a diagram showing a state in which the bias coil B construction C shown in FIG. 15 is installed; FIG.
-38B sectional view, Figure 39 is upper shield case S H
40 shows the lower shield case 5HI2b, and FIG. 40 shows the lower shield case 5HI2b. FIG. 41 shows the intermediate assembly shown in FIG. 38 mounted in the magnetic shielding cases 5HI2a and 5HI2b shown in FIGS. 39 and 40. 41A
The figure is its plan view, and the figure B is its 41B-41B sectional view.
FIG. 42 shows a wiring board for electrically connecting the shield case assembly shown in FIG. 41 to the pin grid external connection terminal; FIG.
B-42B is a sectional view, C is a bottom view thereof, and FIG. 43 is a diagram showing the shield case assembly shown in FIG. 41 mounted on the bin grid wiring board TEF2 of FIG. 42, and FIG. 44 is a diagram showing a sealing cap, A is a plan view thereof, B is a 44B-44B sectional view thereof, and FIG.
5 is a diagram showing a completed structure of the series of modifications explained in FIGS. 32 to 44, that is, a structure in which the intermediate assembly in FIG. 43 is sealed with the cap PKG2 in FIG.
is a top view thereof, B is a sectional view taken along line 45B-45B, and C is a right side view thereof. FIG. 46 is a perspective view of the FPC board used in Modification 2, FIG. 47 is a sectional view of Modification 2, FIG. 48 is a plan view of the FPC board used in Modifications 3 and 4, and FIG. 49 is the terminal board PGA used in modification 3
50 is a plan view and a sectional view of the packaging case PKG used in Modification 3, and FIG.
Fig. 1 is an enlarged sectional view of the terminal portion of Modification 3, Fig. 52 is a sectional view of Modification 3, and Fig. 53 is a diagram showing the terminal plate PGA. 53B-53B sectional view, FIG. 54 is a diagram showing the pancasing case PKG, FIG. 54A is a plan view, FIG. FIG. 56 is a cross-sectional view showing the connection between the board FPC and the connection pin 310. FIG. 57 is a plan view of a device provided with connection pins on four sides, and FIG. 58 is a perspective view of the device mounted on a board. CHI...magnetic bubble memory chip (element), FPC
...Flexible wiring board (board), BND...board assembly, COI...drive coil (coil), COR
...Picture frame-shaped core (core). PFC...magnetic circuit, RFS...rotating magnetic field confinement case (case), RFSa...outer case, RFS
b...Inner case, SIR...Silicone resin, B
IM...Magnet for generating bias magnetic field (magnet), BI
Ma... Upper magnet body, B IMb... Lower magnet body,
INM... Inclined plate. MAG...Permanent magnet plate (magnet plate), HOM...Magnetic shunt plate, INN...Nonmagnetic gradient plate, BIC...Bias magnetic field generation coil (bias coil), SHI...External magnetic shield Case (shield case), 5HIa・
...Outer shield case, S HI b...Inner shield case, REG...Resin molding agent, PKG...
・Pan caging case, TEF...terminal fixing plate, G
NP...Contact pad, PGA...Terminal board, B
OD... Board, 1... Element Wr mounting part, 2, 2a,
2b. 2c, 2d... bending portion, 3.3', 3a. 3a', 3b, 3b', 3c, 3c', 3d, 3
d'...External connection terminal connection section, 4.4', 4a. 4a', 4b, 4b', 4c', 4d', 4'
... opening, 5.5a, 5b, 5c ... perforation,
6... Board protrusion, 7... Base film, 8...
・Adhesive, 9'... External connection terminal, 9a... Wiring lead, 9b... External terminal, 9c... Connection terminal, 9d... Symbol, 9e... Index mark, 9
f...Conductor pattern, 10...Cover film, 1
DESCRIPTION OF SYMBOLS 1...Tin plating layer, 12...Opening, 13...Solder plating layer, 14...Ponding pad, 15...
Gold bump, 20a, 20b, 20c, 20d... Helix coil, 21a, 21b... Connection point, 22a.
...X coil, 22b...Y coil, 23...magnetic core, 24...tap, 25...wide groove, 2
6...Small groove of the ring, 30...Aperture part, 31...
Bending part, 32... Notch part, 33... Squeezing part,
34...Bending portion, 35...Notch portion, 36...
・Polyimide film, 37... Adhesive, 38...
Coil winding, 40... Winding wire, 51... Flat part, 52
...Bent part, 53... Recessed part, 54... Notch part, 55... Flat part, 56... Bent part, 57...
... recess, 58 ... notch, 59 ... recess, 60
．． 200...Resin plate, 61...Through hole, 62...
non-through hole, 63... mark, 64... opening, 65.
... Groove, 66... Corner, 70... Piece, 71...
Nickel plating layer, 72...Gold plating layer, 201...
- Opening, 202... pin, 202a... tip,
203...Solder, 210...Main body, 211...
Flange, 212/Fig. 4C Fig. 4 Fig. 5 Fig. 6 Fig. Iy Fig. 8 B Fig. 9 Fig. 10 A Ni'') a Fig. 12 A Fig. 12 B Fig. 14 A Fig. 14 B Figure 14 C HOM INNNN 16 Figure 17 A Figure 18 A Figure 18 B Figure 19 A HI Figure 19 B Go to Figure 21 Figure 21 B ヱ Figure 22 A Figure 22 B OL Figure 26 Figure 28 RFS2a K52 Figure 37 A Figure 37 B Figure 37 C Hurin Figure 44 A PKG2 Figure 44 B Chozotsui PGA Figure 49 C Nagigomi Figure 54 A DanK] Figure 54 B Continuation of Hua Mu page Σ Claim for forfeiture 0 1985 (1985) April 26th [phase] Japan (JP) [phase] Patent application 1988-[phase] 1986 (
1985) May 17th [phase] Japan (JP) [phase] patent application 1986-[phase] May 27th [1985]
Japan (JP) [Co., Ltd.] Patent Application 1986-@1986 (1986)
985) May 27th 6 Japan (JP) @ special if 1986-5 Akira Nobuo Kijo 3 Hayano, Mobara City
No. 681 Inside the old company

Claims (1)

[Claims] 1. A magnetic bubble memory element mounted on a flexible substrate is disposed in a space formed by a frame-shaped core coiled so that sets of opposing windings are parallel to each other, and the coil, core and magnetic 1. A magnetic bubble memory characterized in that the entire bubble memory element is sandwiched within a case made of a highly conductive material, and the external connection terminals of the flexible substrate and the connection terminals of the terminal board are bonded.