JPS61271685A - Magnetic bubble memory - Google Patents

Abstract

PURPOSE:To make the titled memory thin-walled and small-sized and to attain low power consumption by mounting a sense amplifier on a flexible board. CONSTITUTION:A magnetic bubble memory element CHI mounted on the flexible wiring board FPC is arranged on a space formed by a framed core COR applying coils COI so as to make the faced winding pairs parallel. Further, the coil COI, the core COR and the element CHI are all clipped in a good conductor case RFS, a couple of magnets BIM are combined to the outer face of the case RFS and clipped in a case SHI, a sense amplifier detecting a magnetic bubble output is mounted on the board FPC and contained in a packaging case PKG. Thus, a magnetic bubble presence detection signal of TTL level with excellent S/N is obtained and the memory is miniaturized.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Application of the Invention] The present invention relates to a magnetic bubble memory, and particularly to a magnetic bubble memory suitable for reduction in thickness, size, and power consumption.

[Background of the invention]

Magnetic bubble memory devices, which have been put into practical use in recent years, consist of rectangular solenoid coils with an asymmetrical structure mounted on an E-shaped ceramic or synthetic resin wiring board on which a magnetic bubble memory chip is mounted. It has a structure in which an X coil and a Y coil are inserted and arranged orthogonally. The X coil and Y coil have a structure in which they wrap not only the magnetic bubble memory chip but also a wiring board that is much larger than the chip, so the length from one end of each coil to the other is long, and the driving voltage and power are It gets bigger. In addition, the X coil and Y coil require a uniform inductor balance in order to provide a uniform and stable in-plane rotating magnetic field to the magnetic bubble memory element, so the coil shapes are different from each other and have an asymmetric structure, resulting in a larger structure. I had no choice but to do so. Furthermore, a pair of permanent magnet plates that apply a perpendicular bias magnetic field to the magnetic bubble memory element and a magnetic shunt plate are arranged on the outer surfaces of these X coils and Y coils, and their peripheral parts are covered with a resin mold. Because of this structure, the stacking thickness in the vertical direction increases, which is an obstacle to the demand for thinner and smaller magnetic bubble memory devices.

The closest prior art to the present invention known to the applicant is Patent Application Publication No. 55129 of 1974. This publication describes the structure of a frame-shaped core that surrounds a chip and a conductive magnetic field reflection box that completely surrounds them. However, no further specific structure is shown, and it is theoretically impossible to make an electrical connection to a chip completely surrounded by a conductor case from outside the conductor case without shorting it. Although it is possible, the description is clearly insufficient for people to think of putting it into practical use, including the fact that the method of attaching permanent magnets, magnetic shunt plates, bias coils, etc. is unknown. In other words, the embodiment of the present invention merely coincidentally coincides with the description in the above-mentioned publication in that a frame-shaped core is used as a result.

[Object of the Invention] An object of the present invention is to provide a magnetic bubble memory that can be made thinner.

Another object of the present invention is to provide a magnetic bubble memory that can be miniaturized by reducing the overall volume.

Another object of the present invention is to provide a magnetic bubble memory with reduced power consumption.

Another object of the present invention is to provide a magnetic bubble memory in which the VI product is reduced by reducing the inductance of the rotating magnetic field generating coil.

Another object of the present invention is to provide a magnetic bubble memory that allows or facilitates automation of assembly of component parts.

Another object of the present invention is to provide a magnetic bubble memory capable of increasing the number of connection terminals for input/output, etc., such as increasing capacity.

Another object of the present invention is to provide a magnetic bubble memory in which the inclination angle of the magnetic bubble memory element with respect to the direction of the bias magnetic field can be set easily and with high precision.

Another object of the present invention is to provide a magnetic bubble memory whose cassette can be made smaller.

Another object of the present invention is to provide a magnetic bubble memory whose peripheral circuitry can be manufactured at low cost.

Still another object of the present invention is to provide a magnetic bubble memory in which a magnetic bubble output from a magnetic bubble memory device can be obtained as a TT level signal with less noise superimposition.

[Summary of the invention]

According to one embodiment of the present invention, a drive magnetic circuit using a frame-shaped core COR is provided (FIG. 8).

The magnetic bubble memory chip CHI is surrounded by the frame-shaped core C0R and arranged on the flexible wiring board FPC so as to be substantially flush with the frame-shaped core C0R (FIG. 13). The drive magnetic circuit COR and the magnetic bubble memory chip CHI are housed in a rotating magnetic field confinement case RFS made of a non-magnetic and highly conductive material (FIG. 13).

A pair of magnets are assembled on the outer surface of the case and held within the highly permeable case (Fig. 20). The flexible wiring board and the terminal board on which the external connection terminals are implanted are electrically and mechanically connected (FIG. 34).

Mounting the sense amplifier on the flexible wiring board (
32nd).

According to such a configuration, the magnetic bubble output analog signal output from the magnetic bubble memory element is converted into a TT level signal and output, so that an output signal with extremely low noise can be obtained. Furthermore, since the sense amplifier is mounted on the flexible substrate, the overall shape of the magnetic bubble memory can be made smaller.

[Embodiments of the invention]

Next, the present invention will be explained in detail using the drawings.

(Overview of overall structure Figures 1 and 2) Figures 1 and 2 (a) and (b) are diagrams for explaining an embodiment of the magnetic bubble memory device according to the present invention. FIG. 2(a) is a partially broken perspective view, FIG. 2(a) is a bottom view thereof, and FIG. 2(b) is a sectional view taken along line 2B-2B of FIG. 2(a). In these figures, CHI is a magnetic bubble memory chip (hereinafter referred to as a chip). In these figures, the chip CHI is omitted and only one chip is shown, but in this example, two chips are arranged side by side. shall be.

(The chip yield is better with a multi-divided chip configuration in which the total storage capacity of 5 is matched than with one large-capacity chip.) F
The PC is equipped with two chips CHI and a chip C in the four corners.
This is a flexible wiring board (hereinafter referred to as a board) having a wire group extension for connecting the HI and external connection terminals. The CO design is a drive coil (hereinafter referred to as a coil) that surrounds two chips CHI on almost the same plane and is arranged so that the opposing sides are parallel to each other, and the COR is a rectangular coil assembly CO.
It is a frame-shaped core (hereinafter referred to as the core) made of a fixedly arranged soft magnetic material that is provided so as to penetrate through the hollow part of I, and this core COR and each coil COI form a chip CH.
A magnetic circuit PFC that applies an in-plane rotating magnetic field to I is configured. The RFS is a rotating magnetic field confinement case (hereinafter referred to as the case) that houses the central rectangular portion of the substrate FPC, two chip CHs, and the entire magnetic circuit PFC.

Case RFS is formed by processing two independent plates,
The upper and lower plates are electrically connected on the side of the case.

A converging portion is formed in the peripheral portion so that the gap in the central portion is narrowed in a slightly wider range than the portion where the chip CHI is arranged. This constriction can also be used to position the magnet. Case PFS uses magnetic field confinement and soft substrate FP
It has the effect of killing two birds with one stone by mechanically supporting C.

In particular, there is a chip C between the case PFS and the chip CHI.
There is a gap SIR on the side surface of the chip CHI, and this gap SIR including the flat surface of the chip CHI is coated or filled with silicone resin.

The passivation effect is intended to reduce the adhesion of foreign matter to the main surface of the chip during assembly and the intrusion of moisture into the main surface or side surfaces of the chip after assembly. If a complete airtight seal can be achieved on the outside of the case RFS,
Filling of resin SIR may be omitted. INM is case R
A pair of inclined plates made of magnetic material are placed on the outside of the FS. In Fig. 2, the upper inclined plate INM becomes thicker as it moves to the left, and the lower inclined plate INM becomes thicker as it moves to the right. Both have an inclined surface formed on the case RFS side. As the material for the inclined plate INM, soft ferrite or permalloy having a high magnetic permeability μ and a small coercive force Hc may be used. In this embodiment, soft ferrite was selected because it is easy to process the inclined surface. MAG is a pair of inclined plates I
The ROM is a pair of permanent magnet plates (hereinafter referred to as magnet plates) arranged inside the NM and overlapped with it, and the ROM is made of a magnetic material such as soft ferrite arranged inside each of the magnet plates MAG and overlapped with it. They are a pair of magnetic shunt plates. The magnet plate MAG is formed to have a uniform thickness over the entire surface. The INN is a pair of inclined plates made of a non-magnetic material with good thermal conductivity such as copper, which are placed on the inner facing surfaces of a pair of magnetic shunt plates ROM and overlapped therewith. These inclined plates I
NN is formed with an inclined surface having an inclination angle substantially equal to that of the inclined plate INM and in an opposite direction. Inclined plate INM, magnetic plate MAG, II magnetic plate ROM, and inclined plate INN.

When stacked and arranged and integrated to form a bias magnetic field generating magnet body BIM (hereinafter referred to as magnet body), the thickness of the entire laminated plate magnet body is formed to be uniform over almost the entire surface.

A pair of magnet bodies BIM are adhered to a central flat part surrounded by the constriction part of the case RFS.

BIG is a bias magnetic field generating coil (
The bias coil BIC (hereinafter referred to as bias coil) is used to adjust the magnetic force of the magnet plate MAG to match the characteristics of the chip CHI, or to test for the presence or absence of unnecessary bubble generation defects. erase)
It is driven when SHI includes a case RFS that houses the board FPC on which the chip CHI is mounted and the magnetic circuit PFC, and a pair of magnet bodies BIMa and BI on the outside.
This is an external magnetic shield case (hereinafter referred to as shield case) made of a magnetic material that houses Mb and bias coil BIC. The materials for the shield case SHH are as follows:
A magnetic material with a high magnetic permeability μ, a large saturation magnetic flux density Bs, and a small Hc is preferable, and permalloy and ferrite have such characteristics, but in this example, they are suitable for bending and are resistant to external mechanical forces. Permalloy iron is strong against
A nickel alloy was chosen. PKG is a packaging case made of a material such as AQ that has high thermal conductivity and is easy to process, and is attached to the outer peripheral surface of the shield case SHI by adhesive or fitting. GNP are contact pads extending from the four corners of the substrate FPC and arranged to contact external connection terminals folded back on the back surface of the shield case SHI. TEF is a terminal fixing plate made of an insulating material that supports and fixes each contact pad GNP at a stepped portion of an opening. REG is sealed in the four inner corners of packaging case PKG, and the shield case RFS assembly is sealed in packaging case PKG.
This is a resin molding agent that is fixed inside G.

(Features of the overall structure, FIGS. 1 and 2) The features of the overall structure of the magnetic bubble memory device shown in FIGS. 1 and 2 are enumerated as follows. However, the features of this embodiment are not limited to these, and other features will become clear from the explanations that follow from Figure 3, but here we will focus on the relationship between each component. The features are described below.

(1) Make the rotating magnetic field generating coil PFC into a picture frame shape.

Since the bubble memory chip CHI is arranged on the same plane within the frame, the thickness of the entire bubble device can be reduced. With current mainstream technology, the top and bottom surfaces of the chip are
This is because the thickness of the entire device is a function of the sum of the chip thickness, the X coil thickness, and the Y coil thickness since the device is wound around the coil.

(2) Since the X coil and the X coil are arranged on almost the same plane, there are the following effects compared to the conventional structure in which the X coil is wound on top of the X coil.

■The total winding length of the coil does not become long. Therefore, the inductance L can be reduced, making it possible to drive at low voltage and reduce power consumption.

(2) The distance between the X coil and the X coil and the chip CHI can be made equal, and the magnetic field distribution can be made balanced.

(3) Since the rotating magnetic field generating coil PFC is surrounded by the conductor case RFS, leakage of magnetic flux is reduced and drive efficiency for the chip CHI can be increased.

(4) The conductor case PFS is a rotating magnetic field Hr generating coil P
Prevents the alternating current magnetic field generated from the FC from leaking into the BIM magnet, which has a large magnetic permeability μ.

On the other hand, there is selectivity in that the direct current magnetic field of the bias magnetic field Hb to be applied from the magnet body BIM to the chip CHI does not substantially prevent its passage.

(5) Since the conductor case PFS is made of a material such as copper, which is harder than epoxy glass or the like conventionally used for wiring boards, it can mechanically support the chip CHI firmly.

Therefore, when a multiple-chip mounting configuration is used to increase manufacturing yields, variations in the inclination angle between chips have a large effect on magnetic properties, but according to this embodiment, variations in the inclination angle between chips can be reduced. It can be held small.

(6) Flexible film board FPC as a wiring board
By using , the following effects can be obtained.

■The board thickness can be reduced.

■Since the lead bonding method can be used, the thickness occupied by the bonding part can be reduced compared to the conventional wire bonding method.

■The effects of ■ and ■ above are due to the magnetic circuit gap (magnetic permeability μ
A bias magnet MAG having a small thickness or a small planar area can be used, which leads to a thinner overall device or a smaller planar area.

■Wiring from the chip CHI can be bent freely. Therefore, it is possible to turn over the terminal portion by 180@, and it is possible to limit the planar area of the entire device.

■The width of the opening for wiring out of the rotating magnetic field confinement case RFS can be made smaller. Therefore, leakage of the rotating magnetic field can be kept to a minimum.

(7) Since the external wiring of the wiring board FPC is concentrated at the corners of the rectangle, the opening of the one-rotation magnetic field confinement case RFS can be provided at the corner where the influence is least.

(8) Since the function of the gradient mrNN is not combined with the magnet or magnetic shunt function, the following effects are obtained.

■Materials with good workability, such as copper, can be used to form the slope.

■Materials such as copper with a good thermal temperature coefficient can be used, and the heat generated by the rotating magnetic field generating coil COI can be efficiently dissipated.

■ By using non-magnetic material, magnetic shunt plate RO
It is possible to avoid disturbing the magnetic field passing through M.

(9) It is preferable for the inclined plate INN to be as thin as possible in order to reduce the magnetic gap.Compared to the magnet MAG and magnetic shunt plate HOM, the inclined plate INN can be made thinner by limiting its width to the area necessary and sufficient for forming the inclined angle. This makes it easy to form an inclined angle in the thickness.

(10) Since a plate INM made of soft ferrite having a large magnetic permeability μ is inserted between the magnet MAG and the shield case SHI, the magnetic gap therebetween can be filled. The plate INM also contributes to heat radiation. Board I
Since a material having a smaller coercive force He than that of the magnet MAG is selected as the NM, the effective thickness of the permanent magnet can be kept uniform.

(11) Since the shield case SHI is made of a magnetic material such as permalloy with a high magnetic permeability μ, the magnetic resistance of the magnetic circuit using the magnet MAG as the magnetic field source can be reduced.
The thickness and planar area of the magnet MAG can be reduced.

(I2) Since the shield case SHI is made of a magnetic material such as permalloy with a high saturation magnetic flux density Bs, it bypasses external magnetic field noise.

There is a function that does not inform the chip CHI.

(13) The above (11) and (12) each lead to reducing the thickness of the shield case SHI.

(14) Since the shield case SHE uses an iron-nickel alloy such as permalloy, it is suitable for bending and protects the parts incorporated therein against external mechanical forces.

(15) Rotating magnetic field generating coil PFC and bias coil B
Since both ICs are core-type, the storage efficiency or packaging density within the packaging case SHI or PKG can be increased.

(16) Since the case RFS is inserted between the core 〇OR and the magnetic shunt plate HOM, the interval between them can be finely adjusted by the thickness of the rotating magnetic field confinement case RFS and the bending angle in addition to the thickness of the coil COI. can. The shorter this distance is, the smaller the overall planar size can be, leading to lower power consumption by reducing the coil length.

However, if the distance is too short, the DC bias magnetic field Hb from the magnet MAG will leak to the core 0OR having high magnetic permeability, and the uniformity of the bias magnetic field in the chip peripheral portion will deteriorate. Therefore, this distance is very critical due to the above-mentioned characteristics, and according to the present structure, it can be precisely adjusted.

(17) Since the constriction portion is provided around the rotating magnetic field and the confinement case RFS, alignment of the magnet body BIM is easy.

(18) The inclined plate INN is made by arranging two plates made under the same manufacturing conditions so that there is a rotation angle difference of 180° between the top and bottom surfaces of the chip, so that the two plates are made under the same manufacturing conditions. A pair of magnetic shunt plates ROM and a pair of magnets M
AG can be aligned almost parallel.

(19) Since the bias coils B G and BICI are provided on the side wall of the rotating magnetic field confinement case RFS, it is possible to test whether or not unnecessary magnetic bubbles are generated while the element CH is housed in the case RFS. In addition, all bubbles in the element CH process can be cleared.

Furthermore, it is also possible to remove the bias coil BMCI after use. In this case, the number of partial points in the bubble memory is reduced, making it possible to reduce manufacturing costs.

(Overview of assembly Fig. 3) Fig. 3 is an assembly perspective view for explaining the procedure for stacking and assembling each component constituting the above-mentioned magnetic bubble memory device, and the same reference numerals as above indicate the same members. . In the same figure, first, a board F has connection parts for input/output wiring protruding from the four corners and an element mounting part in the center.
Board assembly END with two elements CHI mounted on the PC
is placed inside the outer case RFSa, which has an insulating sheet glued at the position indicated by the dotted line on the bottom surface, and this board F
After incorporating the magnetic circuit PFC on the PC, silicone resin SIR (not shown) is filled and the inner case R is placed on top of it.
FSb is assembled into the outer case RFSa, and the side contact portions of the outer case RF Sa and the inner case RFS b are electrically connected by soldering or the like. Next, the upper magnet body B I M
After arranging the upper magnet body BIMb and the lower magnet body BIMb, a bias coil BIC wound in alignment is arranged in a gap (not shown) formed between the outer edge of the upper magnet body BIMa and the inside of the inner case RFSb. The outer case S
Ia, the inner case 5HIb is further incorporated, and the side surface contact portions of the outer case 5HIa and the inner case 5HIb are magnetically connected by welding or the like. The external connection terminal connection parts of the board FPC are folded back on the back side of this inner case SHIb as shown in FIG. A terminal fixing plate TEF with a contact pad COP (not shown) mounted in each opening is placed in contact with each external connection terminal coated with the like, and each external connection terminal and contact pad C○P are soldered by thermocompression bonding or the like. Then, these assembled bodies are housed in a packaging case PKG, and a hermetic seal or the like is applied to the contact portion between the terminal fixing plate TEF and the packaging case PKG to assemble them.

Next, the structure of each component mentioned above will be explained.

(Flexible wiring board Fig. 4) Fig. 4 is a diagram showing a board FPC, where A is a plan view thereof and B is a layout in which the connection parts of external connection terminals protruding from the four corners are folded back and combined. The plan view is a 4G-4G enlarged sectional view of the same figure A, and the same figure is 4D- of the same figure A.
It is a 4D enlarged sectional view. In the same figure, the board FPC is
There is a square element protection part 1 in the center, small bent parts 2 (2a, 2b, 2c, 2d) at the four corners, and a square external connection terminal connection part (hereinafter referred to as connection part) at the tip. ) 3 (3a, 3b, 3c, 3d), and the overall shape is approximately windmill-shaped and is integrally formed. A rectangular opening 4 (4a, 4b) with a double-frame structure for mounting two elements CHI and connecting their terminals, and three perforations 5 (5a, 6b, 5c) for positioning are provided. A substrate protrusion 6 for positioning is provided at the tip of each connecting portion 3c.

In addition, as shown in FIG. C, this FPC board is made by forming a copper thin film on a base film 7 made of a polyimide resin film with a thickness of about 50 μm, for example, via an epoxy adhesive 8, and then applying the copper thin film to the desired shape. By etching into a pattern shape, wiring leads 9a as shown in FIG.
Circular external terminal 9b, oval coil lead connection end +9c.

Patterns such as symbols 9d and index marks 9e are formed, and a transparent or semi-transparent cover film 10 is adhered to the upper surface of these through an adhesive 8 made of the same material as described above. And this board FP
In the opening 4 of C, an opening with highly accurate dimensions is formed in the base film 7 on the side where the element CHI (not shown) is mounted, and an opening with relatively large dimensions is formed in the cover film 1o on the upper surface side. Further, a wiring lead 9a is exposed between the space film 7 and the cover film 10, and a tin plating layer 1 is formed on the surface of the wiring lead 9a.
1 is formed, and the opening shape is formed to have a two-layer structure and a double frame structure. On the other hand, in the connecting portion 3, as shown in the figure, a circular opening 12 is formed at a portion of the cover film 10 corresponding to the circular external terminal 9b and the oval external terminal 9c (not shown).
A solder layer 13 is formed by plating or dipping on the copper thin film patterns of the external terminals 9b and 9c exposed from the external terminals 9b and 9c. The external terminals 9b, 9c provided on these connecting portions 3 are the respective connecting portions 3a3b, 3c, 3d and the bent portions 2a, 2b.

2c, 2d and each wiring lead 9a formed continuously on the element protection part 1. Each connection portion 3a is partially provided.

They are gathered in blocks 3b, 3c, and 3d, and their tips are exposed in the respective openings 4a and 4b.

That is, as shown in FIG. A, the wiring lead 9a of the connecting part 3a is located at the upper left of the opening 4a, the wiring lead 9a of the connecting part 3b is located at the lower left of the opening 4b, and the wiring lead 9a of the connecting part 3c is located at the lower left of the opening 4b. is wired to the upper right corner of the opening 4a, and the wiring lead 9a of the connecting portion 3d is wired to the lower right corner of the opening 4b. Then, this board FPC is connected to each connecting portion 3a in a later process.

3b, 3c, 3d are the respective bent portions 2a, 2b, 2c, 2
d and assembled as shown in Figure B,
The external terminals 9b and 9c on which the solder layer 13 is formed are exposed on the surface, and the surfaces of the wiring leads 9a, symbols 9d and index marks 9e are covered with the cover film 1o, so these patterns are covered with the cover film. 10 is constructed so that it can be easily read through.

In such a configuration, the substrate FPC uses a polyimide resin film, and each bent portion 2 is provided at the four corners of the element protection portion 1.
Each connection 3a, 3b, 3 via a, 2b, 2c, 2d
c, 3d, and each of these connecting parts 3
By folding and combining a, 3b, 3ct 3d to form the external terminal part, the element protection part 1 and the connection part form a two-layer wiring structure, so the element protection part 1 can be connected without reducing the area of the connection part 3. 1, it is possible to increase the number of external terminals, and the overall shape can be made smaller.

In addition, in such a configuration, the wiring leads 9a from each external terminal 9b to each opening 4a, 4b of the element protection part 1
Since the time can be significantly shortened, the influence of external noise etc. can be significantly reduced. That is, signals with a high S/N ratio can be input and output. Furthermore, a board protrusion 6 is provided at one end of the connecting part 3C, and an index mark 9e is provided on this protrusion 6, so that when the board is folded back and assembled, it can be used for displaying the central part of the board.
I (see Figure 2) can be used for positioning when assembling, distinguishing the type of wiring lead 9a, or displaying the product model. It can be streamlined. Additionally, holes 5a, 5b, 5c are provided at both ends of the element protection portion 1 of the FPC board.
By providing a
The positioning of the HI becomes easy, and the ease of assembly can also be streamlined.

(Substrate Assembly Figures 5.6.7) Figure 5 is a plan view showing the element CHI mounted on the aforementioned substrate FPC. In the figure, two elements CHI are mounted in the element mounting part 1 of the FPC board through openings 4a and 4b.
A board assembly BND is constructed by being mounted in parallel between them, and one of the elements CH is constructed by integrating two blocks of IMb chips, as shown in an enlarged plan view in FIG.

Two elements CHI constitute 4 blocks, a total of 4 Mb chip. Note that 1 of the element CHI shown in FIG.
In the blocks, thick lines indicate conductor patterns and thin lines indicate chevron pattern transfer paths. Also, the fifth
The element CHI shown in the figure has respective bonding pads 14 provided by gold plating on the ends of the element CHI and a substrate FP, as shown in enlarged cross-sectional views in FIGS. 7A and 7B, respectively.
A gold bump 15 is interposed between the wiring lead 9a on which the tin plating layer 11 of the C opening 4 is formed, and lead bonding is carried out using Au-Sn eutectic by thermocompression bonding.

According to such a configuration, the openings 4a, 4 of the substrate FPC
The wiring lead 9a of b and the bonding pad 14 of the element CH are connected by lead bonding using Au-8n eutectic, and the element CHI can be supported and fixed, so the connection strength can be greatly improved and the thickness can be reduced. It becomes possible. In addition, the surface of the element CHI is the element mounting part 1 of the substrate FPC.
Since the surface of the element CHI is covered with
Handling properties can be improved, and the mechanical strength of the FPC board can be maintained. Also,
According to such a configuration, each element CHI is composed of two blocks, and two elements CHI are composed of four blocks, so that each block is connected to the nearest connecting portion 3.
a, 3b, 3c.

Wiring can be distributed over 3D, symmetrical element CHI arrangement can be obtained, and testing, inspection, etc. can be extremely facilitated.

Furthermore, there are four connection parts 3a, 3b, 3Q, 3 on the board FPC.
d, the wires for the magnetic bubble detector DET and pine pull of each element CHI are distinguished from other functional wires and gathered at one connection point, and this connection point is selected to be away from the noise source. By placing
It is possible to exchange input/output signals with extremely low noise.

(Drive Magnetic Circuit FIGS. 8 and 9) FIG. 8 is a diagram showing the magnetic circuit PFC, and FIG. 8A is a perspective view, and FIG. 8B is a plan view showing the drive magnetic circuit. In the figure, the magnetic circuit PFC includes four sets of coils 20a, 20b, 20, which are wound in the direction of the arrows on mutually parallel opposing sides of a frame-shaped core COR made of a soft magnetic material.
A coil COI consisting of coils COI c and 20d is wound, and coils 20a and 20b on opposite sides are wound in series via a connection point 21b to form an X coil 22a and a coil 20c.
and 20d are wound in series via the connection point 21a to form the Y coil 22b.

Then, currents Ix and Iy (for example, triangular non-current) whose phases are different by 90 degrees are applied to the X coil 22a and the Y coil 22b.
As shown in Figure B, a leakage magnetic field Hx is generated in the X-axis direction and a leakage magnetic field Hy is generated in the y-axis direction.
It is supplied as a rotating magnetic field to the two elements CHI mentioned above.

In addition, the magnetic circuit PFC configured in this manner has windings arranged around a rectangular parallelepiped magnetic core 23 made of one soft magnetic material with taps 24 for each block, as shown in a perspective view in FIG.
are provided and wound in series to form a pair of coils, for example coil 20.
After forming a pair of X coils 22a consisting of coils 20a and 20b, a wide groove 25 having a constant width and a narrower groove 26 are formed by cutting between each coil 20a and 20b. Thereafter, the wide grooves 25 which are cut from the narrow grooves 26 and divided into the intermediate grooves are combined and glued in mutually orthogonal directions to form a picture frame shape as shown in FIG. Alternatively, the pair of X coils 22a may be formed by winding the coils 20a and 20b through the taps 24 around the rectangular parallelepiped core 23 in which the wide groove 25 and the narrow groove 26 described above are formed in advance. . Furthermore, the pair of Y coils 22b described above are formed in exactly the same manner.

In such a configuration, the coils 20a and 20b are wound in series around the rectangular parallelepiped magnetic core 23 with taps 24 provided, so when assembled as shown in FIG. 8, the wires are connected by crossing each other ( connection points), and the winding routing can be simplified.

According to such a configuration, the X coil 22a and the Y coil 2
2b has a symmetrical structure, resulting in a rough coupling,
The inductance balance is improved, and magnetic interference between magnetic bodies due to leakage magnetic fields can be prevented. Furthermore, since the magnetic circuit PFC has a frame layer structure in which it is not disposed on the upper or lower surface of the element CHI, the thickness in the stacking direction is reduced, making it possible to reduce the thickness.

(Rotating magnetic field confinement case Fig. 10.11.12) 1st
Figure 0 is a diagram showing the case RFS, and Figure A is a plan view.
Figure B is a sectional view taken along the line 10B-10B. In the figure, the inner case RFSb has a frame-shaped constriction part 30 whose central part is concave, and whose opposing end sides extend upward by approximately 90 degrees.
The case RFSb is made of a good conductive material,
For example, it is formed by pressing an oxygen-free copper plate. In this case, the constricted portion 30 and the bent portion 31 can improve the mechanical strength of the inner case RFSb in the torsion direction, and can appropriately limit the outer diameter dimensions in the longitudinal and lateral directions between the bent portions 31 facing each other. Further, the aperture portion 3o can appropriately adjust the distance between the magnet body BIMb arranged on the outer surface side of this case RFSb and the element CHI arranged on the inner surface side. Note that the cutout portions 32 provided at the four corners are each bent portion 2a of the board FPC disposed within this case RFSb.

2b, 2c, and 2cl drawer portions are formed.

According to such a configuration, the inner case RFS b can be formed by a press working method, so it can be manufactured with high precision dimensions and at low cost.

Note that, although oxygen-free copper is used for the inner case RFSb, a plate material made of copper, silver, gold plate, or an alloy plate thereof may be used.

FIG. 11 is a diagram showing an outer case RFSa corresponding to the above-described inner case RFSb, with FIG. 11A being a plan view and FIG. 11B being a sectional view taken along line IIB-11B. In the same figure,
This outer case RFSa is similar to the inner case RFS described above.
It is formed using the same material and manufacturing method as b, and its structure is almost the same as described above, with a frame-shaped constriction part 33 whose central part is concave, and the opposite end thereof is bent upward at approximately 90 degrees. It is configured to include a bent portion 34 and a notch portion 35 cut diagonally at each of its four corners.

In this case, the mutually opposing bent portions 34 are formed so that the inner dimensions thereof are approximately the same as the outer dimensions between the bent portions 31 of the inner case RFSb described above, and the height H is increased. has been done. Note that this aperture part 3
3 and the notch 35 are the inner case RFSb described above.
It is formed to have approximately the same dimensions as.

The outer case RFSa and the inner case RFSb configured in this way are shown in a plan view in FIG. 12A and in FIG. 12B.
As shown in the cross-sectional views 12B-12B, the inner case RFSb is inserted into the outer case RFSa, and the outer surfaces of the bent portions 31 of the outer case RFSa are brought into contact with each other and connected, thereby integrating the case RFS and assembling the case RFS. It will be done.

(Case assembly Figure 13) Figure 13 shows the board assembly BND inside the case RFS mentioned above.
This figure shows a cross-sectional view of the storage arrangement. In the figure, a polyimide film 36 with a thickness of about 0.1 m, for example, is adhesively arranged as an electrically insulating sheet on the bottom surface of the outer case RFSa, and a board assembly BND is mounted on this film 36. At its periphery is a magnetic circuit FPC.
are arranged respectively, and after applying an epoxy adhesive 37 to the upper surface of the board assembly BND, an inner case RFSb is inserted and bonded to the upper part of these. In this case, the bent portion 3 of this outer case RFSa
The inner surface of the inner case 4 and the outer surface of the bent portion 31 of the inner case RFSb are electrically and mechanically joined by metal flow, soldering, etc. at the portion indicated by the X mark. In addition, the gap between the outer case RFSa and the inner case RFSb is filled with silicone resin SIR to form the board assembly BND.
and a magnetic circuit PFC are fixedly arranged. In this case, each notch 3 (not shown) provided at the four corners of these outer case RFSa and inner case RFSb
2.35 is the bent part 2 of the board FPC (2a, 2b
t 2ct 2d) is pulled out. 38 is the connection between the coil COIs or the coil COI and the board FPC
This is a lead wire for connecting the external terminal 9c provided above.

In such a configuration, when a leakage magnetic field is generated by driving the magnetic circuit FPC, an induced current flows through the case RFS to form a closed loop, and this induced current confines the rotating magnetic field within the case RFS, so that the element CHI is applied with a uniform rotating magnetic field.

According to such a configuration, the element CHI mounted on the board FPC is sandwiched between the outer case RF S a and the inner case RFS b in the concave part of the central part, and the magnetic circuit PFC is held in the convex part of the peripheral part. Since they are arranged in parallel, the packaging effect can be improved and the ease of assembly can be greatly improved.

Further, by reducing the volume covered by the outer case RFSa and the inner case RFsb, the VI product (volume) can be reduced, and the magnetic circuit PFC that generates the rotating magnetic field can be downsized. Furthermore, the outer case RFSa and the inner case RFSb are provided with concave portions formed by the constricted portions 30 and 33 to reduce the gap between the opposing concave portions.

In the rotating magnetic field, the component (Z component) perpendicular to the plane of the element CHI approaches zero and becomes only a horizontal component, making it possible to improve the -sacrifice.

(Magnet Figure 14) Figure 14 is a diagram showing the magnet body BIM, in which Figure A is a plan view, Figure B is a side view, and Figure C is a front view.

In the same figure, the magnet body BIM is.

An inclined plate I'NN made of a non-magnetic material, such as copper, with one of its opposing surfaces having a predetermined inclined surface, and a first magnetic shunt plate HOM having a uniform plate thickness disposed on the inclined surface side of this inclined cutting NN. Yoto,
A magnet plate MAG having a uniform plate thickness disposed on the upper surface side of the first magnet plate HOM1 and a second magnet plate HOM having an inclined surface on the upper surface side of this magnet plate MAG are sequentially laminated, They are integrally formed using an epoxy adhesive, and are constructed so that the overall thickness of the laminated plate is uniform over almost the entire surface. A uniform magnetic field for generating a bias magnetic field is emitted from the upper and lower surfaces of this magnet body BIM over almost the entire surface.

(Bias Coil FIG. 15) FIG. 15 is a diagram showing the bias coil BIC, where A is a perspective view and FIG. B is a cross-sectional view taken along line 15B-15B. In the same figure, the bias coil BIC has a winding 40 whose outer surface is coated with an insulating member such as a thermosetting resin, and is wound in an array with a cross section of 5 x 4 wires so that the overall shape has a picture frame shape. After that, it is crimped by heat welding, cooled, and formed into a frame shape of a predetermined value. In this case, the thermosetting resin coated on the outer surface of each winding 40 is thermally welded to each other, and each winding 40 is clogged and formed by pressure bonding, and by cooling, each winding 4o is hardened in a bundled state. Therefore, it is formed into a predetermined picture frame shape.

(Mounting the magnet and bias coil on the case assembly
(FIG. 16) FIG. 16 is a sectional view of the case RFS assembly described in FIG. 13 incorporating the magnet body BIM and bias coil BIC. In the same figure,
An upper magnet body BI Ma and a lower magnet body B IMb are adhesively arranged on the upper and lower surfaces of the case RFS assembly that houses the board assembly BND and the magnetic circuit PFC inside, respectively. A bias coil BIC is housed in a frame-shaped groove formed by being surrounded by the peripheral edge of the inner case RFSb and the bent portion 31 of the inner case RFSb. In this case, the upper magnet body BIMa and the lower magnet body BIMb are made of the same material and two dimensions, and the inclined plate INN side of these magnet bodies BIMa and BIMb is connected to the throttle part 30 of the inner case RFSb. and the concave portion surrounded by the constriction portion 33 of the outer case RFSa, respectively, in close contact with each other.

In such a configuration, a pair of magnet bodies BIMa,
Since the BIMb is placed and the bias coil BIC can be placed in the frame-shaped groove formed on the periphery of the BIMb,
The overall thickness of each component in the stacking direction is reduced, making it possible to make the device compact and into an 'f4 shape. In addition, the outer case RF S
Since a frame-shaped space groove is formed between a and the outer edge portion of the lower magnet BIMb, the bias coil BIC may be placed in this portion, or a new bias coil may be provided. can also be wound as a coil bobbin to form a bias coil.

(Magnetic shield case Fig. 17, 18, 19) Fig. 17
The figures show the shield case SHI, with figure A being a plan view and figure B being a 17B-17B cross-sectional view thereof. In the figure, the outer shield case 5HIa has a flat portion 51.
A bent part 52 is formed on the opposite end of the flat part 51 by folding upward at approximately 90 degrees, a recessed part 53 is partially cut out in the center of the bent part 52, and each of its four corners is diagonally shaped. This shield case S HI a is made of a material having high magnetic permeability and high saturation magnetic flux density, and preferably high thermal conductivity, such as a permalloy plate. It is formed by pressing.

FIG. 18 is a diagram showing an inner shield case 5HIb corresponding to the above-mentioned outer shield case 5HIa, with FIG. 18A being a plan view and FIG. 18B being a 18B-18B sectional view thereof. In the figure, this inner shield case 5HIb is
It is formed using the same material and manufacturing method as the outer shield case 5HIa described above, and its structure is almost the same as described above, including a flat part 55 and a bent part bent upward at approximately 90 degrees on the opposite end of the flat part 55. 56, a recessed portion 57 partially cut out in the center of the bent portion 56, and a notched portion 58 in which each of the bent portions 41114 is cut diagonally. In this case, the mutually opposing bent portions 56 are formed so that the outer dimensions thereof are approximately the same as the inner dimensions between the bent portions 52 of the outer shield case 5HIa described above, and the height H is reduced. has been done.

The outer shield case 5HIa and the inner shield case 5HIb configured in this way are arranged inside the outer shield case SHIa as shown in FIG. 19A as a plan view and as shown in FIG. Insert shield case 5HIb and remove outer shield case S.
Spot welding or solder welding is applied to the recess 59 formed by the recess 53 of the HI a and the recess 57 of the inner shield case 5HIb, and the outer shield case S HI a is assembled by magnetically and mechanically fixing the recess 59. It will be done. In such a configuration, by setting the bent portion 52 of the outer shield case 5HIa and the bent portion S6 of the inner shield case 5HIb in the lateral direction, that is, in the direction intersecting the stacking direction, but aligned in the stacking direction, By reducing the lateral dimension, it is possible to achieve compactness and high integration of component parts.

(Magnetic shield case assembly FIG. 20) FIG. 20 shows the case RFS assembly, which incorporates the board assembly BND and magnetic circuit FPC inside the shield case SHI assembly described in FIG. magnetic plate BIM
Fig. 3a shows a cross-sectional view incorporating an assembly consisting of BIMb and bias coil BIC. In the same figure.

Inside the outer shield case S HI a, there is an upper magnet body B I M a in the center from the bottom side, a bias coil BIC in the peripheral part, and a case RFS assembly (board assembly BND, magnetic circuit PFC, etc. inside). After sequentially stacking and arranging the lower magnet bodies BIMb (incorporated), the inner shield case 5HIb is inserted, and the recess 53 of the outer shield case SH engineering a and the inner shield case 5
It is fixed and sealed by welding in a recess 59 (see FIG. 19) formed with the recess 57 of HIb. In this case, by filling the shield case SHI with grease or the like, the internal components will come into close contact with each other, and the heat generated from the case RFS will be transferred through the shield case SHI. Can be released to the outside. Also,
The heat dissipation effect can be improved by making the case RFS and the shield case SHI contact each other at their sides by press-fitting.

In such a configuration, the outer shield case SHI
Place the case RFS assembly on the bottom side of
By arranging them in a stacked manner so that 1.34 faces each other, each component stacked between the outer shield case S HI a and the inner shield case S HI b can be placed in close contact with each other, making it possible to downsize and make it Wt-shaped. At the same time, a heat dissipation effect can be obtained at the same time.

(Packaging case FIG. 21) FIG. 21 is a diagram showing the packaging case PKG, where A is a plan view and B is a sectional view taken along line 21B-21B. In the figure, the packaging case PKG is formed by drawing a material with good thermal conductivity, such as an aluminum plate with a thickness of about 0.5 mm, and has a black coating on its outer surface (not shown). ing. This packaging case PKG is the outer shield case 5H.
It is possible to improve the shape of Ia and use it for both purposes.

In such a configuration, this packaging case P
The KG serves as the outer case after the magnetic bubble memory device is completed and also functions as a heat sink, and its inner corner also functions as a mold during resin molding using the botting method described below. .

(Terminal fixing plate and contact pad Fig. 22.23)
FIG. 22 is a diagram showing the terminal fixing plate TEF, in which FIG. 22A is a plan view, FIG. 22B is a sectional view taken along line 22B-22B, and FIG. 22C is a rear view thereof. In the figure, the terminal fixing plate TEF is made of an electrically insulating material.

For example, it is made of a glass epoxy resin plate 60, and its outer shape is formed to have vertical and horizontal dimensions that allow it to be inserted into and removed from the opening of the packaging case PKG. A large number of through holes 61 are formed in a matrix arrangement at predetermined intervals in the vertical and horizontal directions in areas other than the peripheral area, and furthermore, the corners of these through holes have concave cross sections that are not rotationally symmetrical. A non-through hole 62 is provided, and a mark 63 made of, for example, a white coating film for locating directionality or features is attached inside this non-through hole 62. In addition, as shown in FIG. B, a large number of through holes 61 formed in the resin plate 60 are provided with large diameter openings 64 coaxially communicating with each other on the back side thereof, as shown in FIG. All of the openings 64 are approximately 60 mm thick of the plate.
%, and communicates with the through hole 61 with a step in the middle. Further, as shown in FIG. C, the back side of the resin plate 60 has a depth approximately equal to the depth of the opening 64 along its peripheral portion, and has a different width in the plane direction and a concave cross section. A groove 65 is formed, and this groove 65
Inside are the coil CO windings and bias coil BI mentioned above.
It constitutes the passage section and connection section of the winding C. Also,
The corners 66 of this resin plate 60 do not have a concave shape, but have a predetermined thickness dimension, and are
The contact surface is obtained by touching the inner surface of the In this way, the back side of the resin plate 60 is formed to have a two-tiered structure with different plate thicknesses.

FIG. 23 is a diagram showing the contact pad GNP, with FIG. 23A being a plan view and FIG. 23B being a sectional view taken along line 23B-23B. In the figure, the contact pad GNP is formed by forming a nickel plating layer 71 on the surface of a piece 70 punched out of a highly conductive material, for example, a copper plate with a thickness of about 0°51111 by press working. It is constructed by forming a gold plating layer 72.

(Final assembly FIG. 20.4.2) For each component configured in this way, first, the shield case assembly described in FIG. 20 is inserted into the packaging case PKG described above. In this state, the connection parts 3a, 3b, 3c, and 3d of the board assembly BND are connected from the four corners of this packaging case PKG (Fig. 4A).
) is bent at about 90 degrees and protrudes from each bent portion 2a, 2b+2c, 2d. Next, resin molding is performed at the four corners of this packaging case PKG by a botting method, and each individual component is fixedly arranged inside this packaging case PKG. Subsequently, each of these connecting portions 3a, 3b, 3c, and 3d is connected to each of the corresponding bent portions 2a.
, 2b, 2at and 2d at about 90 degrees and assembled to the outer surface of the inner shield case 5HIb with adhesive as shown in FIG. contact pad GN
Packaging case PKG is mounted by mounting P or further fixing the side surface of contact pad GNP with adhesive.
and each connection part 3a, 3b, 3c.

Place it in contact with 3d. In this case, each connection part 3a.

Since the arrangement pitch of each external terminal 9b provided in 3b, 3c, and 3d matches the arrangement pitch of each contact pad GNP, each external terminal 9b and contact pad GNP are in electrical contact.

Next, from the back side of the terminal fixing plate TEF placed, each through hole 61
For example, by inserting a heating element with a thin tip into the contact pad GNP and thermocompressing the contact pad GNP, each external terminal 9b and the corresponding contact pad GNP are electrically connected, and the terminal fixing plate TEF is also mechanically connected at the same time. After fixing, the magnetic bubble memory device shown in FIG. 2 is completed.

(Magnetic bubble memory element No. 24.25, 26.27.
Figure 28) Figure 24 shows the above-mentioned magnetic bubble memory element CH.
1 shows a cross-sectional view of the vicinity of the bonding pad PAD of I. In the same figure, GGG is gadolinium
-Gallium-garnet substrate, LPE is a bubble magnetic film formed by liquid phase epitaxial growth method, and an example of its composition is as shown in Table 1 on the next page.

(This page, the following margins) Table 1 1ON indicates an ion implantation layer formed on the surface of the LPE film to suppress hard bubbles. SPY is the first spacer, for example 3000 thick Sio2 is formed by gas phase chemical reaction.

CNDl and CND2 indicate two conductor layers, which have the function of controlling bubble generation, copying (splitting) and exchange, which will be described later, and the lower first conductor layer CND1 is the second conductor layer on Mo2. Each layer CND2 is formed of a material such as AU. SF3 and SF3 are interlayer insulating films (second and third spacers) made of polyimide resin, etc., which electrically insulate the conductor layer CND and the transfer pattern layer P, such as permalloy, formed thereon. This is a passivation film made of a 5i02 film or the like formed by a vapor phase chemical reaction method. PAD indicates a bonding pad of the element CHI, and a thin connector wire such as AQa is bonded here by thermocompression bonding or ultrasonic bonding. This bonding pad PAD has a lower first layer PAD made of Cr.
, the second layer PAD in the center is the Au layer, and the third layer PAD3 above
are formed of a material such as an Au plating layer, and the second layer PAD and third layer PAD3 may be formed of a material such as Cr or Cu. P indicates a layer used for a bubble transfer path, a bubble division 2 generation, exchange and detection section, and a guardrail section, and in the following description, it will be expressed as a transfer pattern layer for convenience.

In the example of FIG. 24, this transfer pattern layer P is transferred to the lower layer P1.
Although a-Ni is used for the upper layer P2 and F a -Ni is used for the upper layer P2, as described above, it is also possible to interchange the two materials vertically.

Hereinafter, the transfer pattern layer consisting of the plurality of layers described above will be transferred to the element C.
An example of application to each part of the HI will be explained using the plan views from Figure 25 onwards. In these plan views, each layer of the transfer pattern layer is formed with self-aligned lines, so they are represented by the same outline. Please note that Figure 25 shows the bubble detector part, and MEM is the main magnetoresistive element, which utilizes the fact that the resistance value changes when a bubble stretched horizontally in a band shape passes through it. to detect the presence or absence of bubbles. MED is a dummy magnetoresistive element having a pattern similar to that of the main magnetoresistive element MEM, and is used to detect noise components due to the influence of a rotating magnetic field. Above the main magnetoresistive element MEM, several ten stages of bubble stretchers ST are formed, although only two stages are shown, which stretch the bubbles laterally and transfer them downward. Note that PR indicates the bubble transfer direction.

ER is a bubble eraser, and when a bubble reaches the conductor layer CHD, it is erased. A guardrail GR consisting of three rows of pattern groups is provided around this detector and between the dummy and main detection.
It is designed to expel unnecessary bubbles generated inside the guardrail GR to the outside thereof, and prevent unnecessary bubbles generated outside the guardrail GR from entering inside it. In addition,
In the plane pattern diagrams shown in FIG. 25 and subsequent figures, patterns other than the conductor layer CHD indicate the transfer pattern layer P explained in FIG. 24. In the figure, the signal-to-noise ratio (S
/N ratio) was improved. For example, when using a three-layer permalloy layer with a SiO film interposed between each layer as a transfer pattern, the following table 2
As shown in the figure, the S/N ratio can be improved by more than twice.

Table 2 Furthermore, the performance of the guardrail OR is also improved, such as by increasing the removal rate of unnecessary bubbles due to the reduction of the holding force He.

FIG. 26 shows a magnetic bubble generator GEN in which the transfer pattern layer P is multilayered.

The current generated by magnetic bubbles can be reduced, and the life of the conductor layer CND of the magnetic bubble generator can be extended. Therefore, a semiconductor element with a small current capacity value can be used for the drive circuit of the conductor layer CND, and the cost can be reduced.

FIG. 27 shows a minor loop m formed by a transfer pattern such as P a ” P h, a write major line WML formed by a transfer pattern array such as Pw1 to Pw, and a swap gate portion formed by a hairpin-shaped conductor layer CND. In the figure, P7 is the same as the transfer pattern P7 in the bubble generator GEN in Fig. 26. In other words, the bubbles generated in the bubble generator GEN follow the transfer path from P to P7. When a current is passed through the swap conductor layer CND, the transfer pattern Pd of the minor loop m□ is transferred to the write major line WML.
The magnetic bubbles are transferred to the transfer pattern Pw3 of the major line WML through the transfer patterns PΩ and Pm, and the magnetic bubbles from the major line Pw are transferred to the transfer pattern P of the minor loop via the transfer patterns Pk, Pj, and Pi.
The data is transferred to A and the bubbles are exchanged, that is, the information is rewritten. Note that the rightmost minor loop md is not provided with a swap gate, but this is a dummy loop in which no magnetic bubble is injected to reduce the peripheral effect. In this way, the transfer pattern layer P at the exchange position
By multilayering i-Pm, magnetic bubbles can be exchanged with a small current value.

Further, as shown in FIG. 28, a magnetic bubble copying machine, that is, a divider, can be driven with a small current value as well. In the figure, a magnetic bubble is normally transferred along a path from Pn to Pg, Ps=Px, and when a current is passed through the conductor layer CND, the bubble is divided at the position of the transfer pattern Pg, and one divided magnetic bubble is generated. The bubble is transferred to the read major line RML via PyePs~P1°.

(Holding magnetic field and rotating magnetic field FIG. 29) Magnet plate MAG is arranged at an angle of about 2 degrees with respect to element CHI. This is so that the bias magnetic field Hb is applied to the element CHI with a slight deviation from the perpendicular direction, thereby creating a holding magnetic field Hdc that improves the start and stop margins of bubble transfer by about 6 (Oe) (No. 29 Figure A).

As shown in FIG. 29A, due to the inclination of the angle θ between the magnet body BIM and the element CHI, the DC magnetic field Hz has a component Hdc in the xy plane. And this in-plane component H
The size of dc is Hdc-8inθ, which is usually Hdc
The inclination angle 0 is selected so that −sinθ=5 (Oe) to 6 [:Oe), and this in-plane component Hdc
The direction of the rotation magnetic field Hr is the start/stop (St/
Sp) direction (+x-axis direction).

This xy-plane component Hdc functions effectively for the start/stop (St/Sp) operation of the 9-rotation magnetic field Hr, and is a known magnetic field called a holding field. Note that the magnitude of the bias magnetic field Hb acting perpendicularly to the element CHI surface is Hz-cosθ.

Now, since the above-mentioned holding field HdC always acts on the xy plane of the element CHI, the rotating magnetic field Hr' acting on the element CHI is eccentric, as illustrated in FIG. 29B. In the figure, Hr is a rotating magnetic field applied from the outside, and Hr' is a rotating magnetic field acting on the element CHI.

In this case, the rotating magnetic field Hr' acting on CHI is a combination of the rotating magnetic field Hr applied from the outside and the in-plane component Hdc, and the center 0' of the rotating magnetic field Hr' is the start/stop (S t/S p ) direction, which is the +X# direction, by an in-plane component Hdc. Therefore, as is clear from the results in the figure, even if the strength of the externally applied rotating magnetic field Hr is 1 Hrl, the strength IHr'l of the rotating magnetic field that effectively acts on the blocking CHI is the same as that of the rotating magnetic field Hr. Depends on the phase. That is, I in the S t/S p direction
Hr'l becomes I Hr l + I Hd a l, and compared to 1Hrl, the holding field Hdc
The strength of IHdel has become stronger. On the contrary, St/S
lHr'l in the opposite direction to the p direction is 1Hrl 1H
dcl, which is weaker by IHdcl than IHrl.

(Peripheral Circuit FIG. 30) Finally, the peripheral circuit of element CHI will be explained with reference to FIG. 30. R
F is a circuit for causing currents with a phase difference of 90° to flow through the X and Y coils of the element CHI to generate a rotating magnetic field Hr. S.A.
is a sense amplifier that samples, senses, and amplifies the minute bubble detection signal from the magnetoresistive element of element CHI in synchronization with the timing of the rotating magnetic field. The DR is a drive circuit that applies current at predetermined timing to each functional conductor of a replicate that is related to bubble generation and swap and read related to writing of the MBM device.

The above circuit is synchronized by a timing generation circuit TG so as to operate in synchronization with the cycle and phase angle of the rotating magnetic field Hr.

(Rotating magnetic field distribution characteristics FIG. 31) FIG. 31 shows the rotating magnetic field distribution characteristics of the magnetic circuit PFC described above. That is, in the figure, the horizontal axis represents the length in the X-axis direction with the center of the magnetic circuit PFC shown in FIG. 8B as O, and the vertical axis represents the rotating magnetic field strength Hx in the X-axis direction.
When the rotating magnetic field strength Hx in the X-axis direction when =O is shown, a rotating magnetic field distribution characteristic as shown by curve aI was obtained.

As is clear from the figure, an almost uniform rotating magnetic field strength Hz is obtained within the range of -Xc to +XC between the opposing cores COR of the magnetic circuit PFC, and
Effective area of I (minimum range to which a rotating magnetic field should be applied) -X
In the range of e to +Xe, a magnetic field strength-sacrifice of about ±2% was obtained. Note that the curve (2) indicated by a broken line is the rotating magnetic field distribution characteristic due to the magnetic circuit of the conventional configuration.

(Modifications) Although the details have been described above in relation to the overall structure of the magnetic bubble memory shown in FIGS. 1 and 2, the present invention can be implemented in the following modifications.

FIG. 32 shows a substrate F for explaining another embodiment of the present invention.
It is a plan view of the PC, and the same parts as in the previous figure are given the same reference numerals. In the figure, the board FPC has a square element protection part 1 in the center and a frame-shaped external connection terminal connection part (hereinafter referred to as connection part) 3'(3a'
, 3b', 3c', 3d'), and is integrally formed with an almost rectangular overall shape, and
On the opposite sides of the element protection part 1, there are rectangular openings 4 (4a, 4b) with a double frame structure in which two elements CHI are mounted and their terminals are connected, and three openings for positioning the elements CHI. Perforations 5 (5a, 5b, 5c) are provided, and two sets of trapezoidal openings are provided at the periphery of the element protection portion 1 to pass through the bent portion 34 of the outer case RFSa and the bent portion 52 of the outer shield case SHI a. Part 4' (
4a', 4b', 4c', 4d') are provided. On the other hand, external connection terminals (hereinafter referred to as connection terminals) 9', which have a circular conductor pattern 9f formed in the peripheral part and a circular opening 4' in the center of the connection part 3', are arranged at a predetermined pitch. Multiple pieces are arranged in a row. These connection terminals 9' are connected to the wiring leads 9a described above, and a conductor pattern is exposed on the surface of the connection terminals 9'. Furthermore, sense amplifiers SA (see FIG. 30) corresponding to the two elements CHI are arranged at two corners of this substrate FPC. In this case, this sense amplifier SA has a plurality of terminals on the side surface, while the corresponding board FP
The conductor pattern of the wiring lead 9a described above is exposed on C, and the terminal of the sense amplifier SA is connected to this conductor pattern by soldering, and a resin molding agent REG is applied to the upper surface and bonded and solidified to attach it. The substrate assembly BND is configured.

FIG. 33 is a diagram showing the terminal plate PGA; FIG. 33A is a plan view, FIG. 33B is a sectional view taken along line 33B-33B, and FIG.

In the figure, the terminal plate PGA is made of an electrically insulating material 1, such as a glass epoxy resin plate 60', and has a square opening 608 in the center into which the shield case SHI assembly described above can be inserted. ', and its outer shape has dimensions in the vertical and horizontal directions that allow insertion of an opening of a packaging case PKG, which will be described later, and the peripheral part of this resin plate 60' is provided with the board FPC. A plurality of metal pins 73 are implanted at the same pitch as the arrangement of the provided external connection terminals 9'.

Each of the components constructed in this way is first
The board assembly BND explained in the figure is sandwiched and joined between the outer case RFSa and the lower case RFSb together with the magnetic circuit PFC as shown in FIG. 13. In this case, four trapezoidal openings 4 a' formed in the substrate FPC,
Each bent part 34 of the outer case RFSa penetrates through 4 b', 4 c', and 4 d', and each connection part 3' of the board FPC is projected in a frame shape from the periphery of the case RFS assembly. .

Next, this case RFS assembly is connected to the above-mentioned pair of magnets B.
Four trapezoidal openings formed in the substrate FPC are used to stack and sandwich the IM and bias coil BIC between the outer shield case 5HIa and the inner shield case SHIb for electrical and mechanical connection. Part 4 a
', 4b', 4c'.

4d' are penetrated by the bent portions 52 of the outer shield case SHIa, and similarly, each connection portion 3' of the board FPC is projected in a frame shape from the periphery of the shield case SHI assembly. Subsequently, this shield case SHI assembly is mounted on the terminal plate PGA explained in FIG.
Then, insert the openings 4' of each connection terminal 9' provided in the connection part 3' of the FPC board, and connect them electrically and mechanically with solder 90, as shown in the enlarged cross-sectional view in FIG. Placed. In this case, the shield case SHI assembly is inserted into the opening 608' provided in the terminal plate PGA with a dimensional tolerance.

Next, the terminal board PGA assembly mounted with this shield case SHI assembly is inserted into the packaging case PKG as shown in Fig. 35, and resin molding is performed by the potting method to place each structure inside the packaging case PKG. Place parts in a fixed position.

According to such a configuration, the wiring lead 9a of the element CHI drawn out to the outside of the shield case SH assembly is
It is connected to the sense amplifier SA mounted on the board FPC, and the magnetic bubble output analog signal is converted to a TT level signal and amplified by the packaging case PKG and sent to pin 73.
Since the bubble detection signal can be extracted from the bubble detection signal, a bubble presence/absence detection signal without superimposed noise can be obtained. In addition, the magnetic bubble memory device configured in this way is equipped with a sense amplifier SA and can obtain a TT level signal with less noise.
It can be configured as a magnetic bubble cassette.

〔Effect of the invention〕

As explained above, according to the present invention, a magnetic bubble memory element mounted on a flexible wiring board is placed in a space formed by a frame-shaped core coiled so that sets of opposing windings are parallel to each other. The coil, the core, and the magnetic bubble memory element are all sandwiched within a case made of a highly conductive material, and a pair of magnets are combined with the outer surface of the case made of a highly conductive material, which is sandwiched within the case made of a highly permeable material. By mounting a sense amplifier for detecting magnetic bubble output on the flexible wiring board and storing it in a packaging case, a TT level magnetic bubble presence detection signal with a good S/N ratio can be obtained, and a magnetic bubble memory Extremely excellent effects such as being able to downsize the device can be obtained.

[Brief explanation of drawings]

FIG. 1 is a partially cutaway perspective view showing the entire magnetic bubble memory device according to the present invention, 2rxIA is a bottom view, FIG. 2B is a cross-sectional view taken along line 2B-2B of FIG. An exploded perspective view, FIG. 4 is a diagram explaining the board FPC,
FIG. 5 is a diagram illustrating bonding of a planar assembly END showing a board assembly BND in which an element CHI is mounted on a board FPC. FIG. 8 is a diagram for explaining the magnetic circuit PFC, FIG. 9 is a diagram for explaining the manufacturing method of the magnetic circuit PFC, FIG. 10 is a diagram for showing the inner case RFSb, FIG. 11 is a diagram for explaining the outer case RFSa, Figure 12 is an assembly diagram of the case RFS, and Figure 13 shows the board assembly BND and magnetic circuit FP inside the case RFS.
A cross-sectional view of the assembly containing C, Figure 14 is the magnet body BIM
15th cgi is a diagram explaining the bias coil, Figure 16 is a cross-sectional view of the assembly in which a pair of magnets BIM and bias coil BIC are incorporated in the case RFS assembly, and Figure 17 is the outer shield. Case 5HIa
FIG. 18 is a diagram showing the inner shield case 5HIb, FIG. 19 is an assembly diagram of the shield case SHI, and FIG.
Figure 0 is a sectional view of the assembly shown in Figure 16 incorporated into the shield case SHI, Figure 21 is a diagram showing the packaging case PKG, and Figure 22 is the terminal fixing plate TEF.
23 is a diagram showing the configuration of the contact pad, FIG. 24 is a sectional view of the element CHI, FIG. 25 is a diagram showing the configuration of the magnetic bubble detector of the element CHI, and FIG. 26 is a diagram illustrating the configuration of the element CHI. 27 shows the configuration of the magnetic bubble generator GEH of the element CHI, and FIG. 27 shows the swap gate SWP of the element CHI.
FIG. 28 is a diagram showing the configuration of the replicate gate REP of element CHI, FIG. 29A is a diagram showing the relationship between the bias magnetic field Hb and the holding magnetic field Hdc, and FIG. 30 is a diagram showing the entire circuit of the magnetic bubble memory board, FIG. 31 is a rotating magnetic field distribution characteristic diagram, and FIGS. 32 to 35 are diagrams explaining the present invention in detail. CHI...magnetic bubble memory chip (element), FPC
...Flexible wiring board (board), BND...board assembly, COI...drive coil (coil), COR
...Picture frame-shaped core (core), PFC...magnetic circuit, R
FS...Rotating magnetic field confinement case (case), RFS
a...Outer case, RFSb...Inner case, SI
R...Silicone resin, BIM...Magnet for generating bias magnetic field (magnet), BIMa...Upper magnet, B
IMb...lower magnet body, INM...inclined plate. MAG...Permanent magnet plate (magnet plate), HOM...Magnetic shunt plate, INN...Nonmagnetic gradient plate, BIC...Coil for bias magnetic field generation (bias coil). SHI...External magnetic shield case (shield case), 5HIa...Outer shield case, 5HIb...
・Inner shield case, REG...resin molding agent,
PKG...Packaging case, TEF...Terminal fixing plate, GNP...Contact pad, SA...Sense amplifier, 1...Element mounting section, 2, 2a, 2b, 2
c, 2d...Bending portion, 3.3', 3a, 3a
', 3b, 3b', 3c, 3c', 3d, 3d'
...External connection terminal connection part, 4, 4', 4a, 4
a', 4b. 4b', 4c', 4d', 4'...opening, 5°5
a, 5b, 5c...perforation, 6...board protrusion, 7.
...Base film, 8...Adhesive, 9'...External connection terminal, 9a...Wiring lead, 9b...External terminal, 9c...Connection terminal. 9d...Symbol, 9e...Index mark, 9f
...Conductor pattern, 10...Cover film, 11
...Tin plating layer, 12...Opening, 13...Solder plating layer, 14...Ponding pad, 15---Gold bump, 20a, 20b. 20c, 20d... Heritutus coil, 21a. 21b...Connection point, 22a...X coil, 22b...
・・Y coil, 23・φ・Magnetic core, 24...Tap, 25...Wide groove, 26...Small width groove,
30... Squeezed part, 31... Bent part, 32...
Notch part, 33... constricted part, 34... bent part,
35... Notch portion, 36... Polyimide film,
37...Adhesive, 38...Coil winding, 40...
Winding wire, 51... Flat part, 52... Bent part, 53
... recessed part, 54... notch part, 55... flat part,
56...Bent part, 57...Concave part, 58...Notch part, 59...Concave part, 60, 60'...Resin plate, 60a'...Opening part, 61...Penetration Hole, 62
...Non-through hole, 63...Mark, 64...Opening,
65... Groove, 66... Corner, 70... Piece, 71
...Nickel plating layer. 72...Gold plating layer, 73...Bin, 73a...
Tip, 90...solder. IPl 1+ Fig. 4 C Fig. 4 Fig. 5 Fig. 6 Fig. 6 I) / Fig. 8 B Fig. 9 Fig. 10 A ) (?bQ Fig. 12 A Fig. 12 B Fig. 14 A Fig. 14 B Fig. 14 C HOM INNNN 1st mu Fig. 18 A Fig. 18 B Fig. 19 A Fig. 19 B 211 Yadansu Fig. 21 B 2 Fig. 22 A Fig. 22 B Fig. 22 C cL ζn: < LLL Q-Figure 26 Figure 28 Figure 33 C Shadow visit procedure correction band (method) Showa 6th September 13B

Claims (1)

[Claims] A magnetic bubble memory element mounted on a flexible substrate is disposed in a space formed by a frame-shaped core coiled so that sets of opposing windings are parallel to each other, and the coil, core, and magnetic bubble memory element are mounted on a flexible substrate. The entire element is sandwiched within a case made of a highly conductive material, and a pair of magnets are combined with the outer surface of the case made of a highly conductive material and sandwiched within the case made of a highly permeable material, and the magnetic bubble output is detected by the flexible wiring board. Magnetic bubble memory is equipped with a sense amplifier and is housed inside a packaging case.