JPS61264579A - Magnetic bubble memory - Google Patents

Abstract

PURPOSE:To make the shape of the whole of a magnetic bubble memory device small-sized and thin-walled and to operate the device in a wide temperature range without degrading the operation margin by reducing the rise of temperature of the device. CONSTITUTION:Since an element CHI counted on a substrate FPC is arranged in a central recessed part between an outside case RFSa and an inside case RFSb and a magnetic circuit PFC is arranged in a peripheral projecting part there, the packaging effect is improved and the assemblability is improved considerably. When a case RFS assembly is laminated and arranged on the bottom face side of an outside shield case SHIa so that its bending parts 31 and 34 face each other, constituting parts laminated between the outside shield case SHIa and an inside shield case SHIb are arranged close, thereby making the device small-sized and thin walled and attaining the heat radiation effect.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Application of the Invention] The present invention relates to a magnetic bubble memory, and particularly to a magnetic bubble memory suitable for reduction in thickness, size, and power consumption.

[Background of the invention]

Magnetic bubble memory devices, which have been put into practical use in recent years, generate a rotating magnetic field consisting of rectangular solenoid coils with an asymmetrical structure on an E-shaped ceramic or synthetic resin wiring board on which a magnetic claw memory chip is mounted. The structure is constructed by inserting the X coil and Y coil respectively and arranging them orthogonally. The X coil and Y coil have a structure in which they wrap not only the magnetic bubble memory chip but also a wiring board that is much larger than the chip, so the length from one end of each coil to the other becomes long, resulting in increased drive voltage and power consumption. I end up. In addition, the X coil and Y coil require a uniform inductor balance in order to provide a uniform and stable in-plane rotating magnetic field to the magnetic bubble memory element, so the coil shapes are different from each other and have an asymmetric structure, resulting in a larger structure. I had no choice but to do so. Furthermore, on the outer surfaces of these X coils and Y coils, a pair of permanent magnet plates that apply a perpendicular bias magnetic field to the magnetic bubble memory element and its magnetization plate are arranged, and their peripheral parts are covered with a resin mold. This structure increases the stacking thickness in the vertical direction, which is an obstacle to the demands for thinner and smaller magnetic A-pull memory devices.

The closest prior art to the present invention known to the applicant is Patent Application Publication No. 55129 of 1974. This publication describes the structure of a frame-shaped core that surrounds a chip and a conductive magnetic field reflection box that completely surrounds them. However, no further specific structure is shown, and it is theoretically impossible to make an electrical connection to a chip completely surrounded by a conductor case from outside the conductor case without shorting it. However, this description is clearly insufficient for people to think about putting it into practical use, including the fact that the method of attaching permanent magnets, magnetic shunt plates, bias coils, etc. is unknown. In other words, the embodiment of the present invention merely coincidentally coincides with the description in the above-mentioned publication in that a frame-shaped core is used as a result.

[Object of the Invention] An object of the present invention is to provide a magnetic bubble memory that can be made thinner.

Another object of the present invention is to provide a magnetic bubble memory that can be miniaturized by reducing the overall volume.

Another object of the present invention is to provide a magnetic bubble memory with reduced power consumption.

Another object of the present invention is to provide a magnetic bubble memory in which the VI product is reduced by reducing the inductance of the rotating magnetic field generating coil.

Another object of the present invention is to provide a magnetic bubble memory that allows or facilitates automation of assembly of component parts.

Another object of the present invention is to provide a magnetic bubble memory capable of increasing the number of connection terminals for input/output, etc., such as increasing capacity.

Another object of the present invention is to provide a magnetic bubble memory in which the inclination angle of the magnetic bubble memory element with respect to the direction of the bias magnetic field can be set easily and with high precision.

Another object of the present invention is to provide a magnetic bubble memory whose cassette can be made smaller.

Another object of the present invention is to provide a magnetic bubble memory whose peripheral circuitry can be manufactured at low cost.

Still another object of the present invention is to provide a magnetic bubble memory with expanded operating ambient temperature.

[Summary of the invention]

According to one embodiment of the present invention, a drive magnetic circuit using a frame-shaped core COR is provided (FIG. 8).

The magnetic bubble memory chip CHI is surrounded by the frame-shaped core C○R and arranged on the flexible wiring board FPC so as to be substantially flush with it (FIG. 13). The drive magnetic circuit COR and the magnetic bubble memory chip CHI are housed in a rotating magnetic field confinement case RFS made of a non-magnetic and highly conductive material (FIG. 13).

A pair of magnets are assembled on the outer surface of the case and held within the highly permeable case (Fig. 20). Join the external connection terminals of the flexible wiring board and the connection terminals of the terminal board (
Figure 35). A heat sink is placed in close contact with the terminal board connection terminal pull-out side of the highly permeable case (Fig. 36).

According to this configuration, the overall shape is made smaller.

It is possible to obtain a magnetic bubble memory that is thinner, has improved heat dissipation, and has a higher operating ambient temperature.

[Embodiments of the invention]

Next, the present invention will be explained in detail using the drawings.

(Overview of overall structure Figures 1 and 2) Figures 1 and 2 (a) and (b) are diagrams for explaining an embodiment of the magnetic bubble memory device according to the present invention. FIG. 2(a) is a partially broken perspective view, FIG. 2(a) is a bottom view thereof, and FIG. 2(b) is a sectional view taken along line 2B-2B of FIG. 2(a). In these figures, CHI is a magnetic bubble memory chip (hereinafter referred to as a chip). In these figures, the chip CHI is omitted and only one chip is shown, but in this example, two chips are arranged side by side. shall be.

(The chip yield is better with a multi-divided chip configuration that matches the total storage capacity than with one large-capacity chip.) F
The PC is equipped with two chips CHI and a chip C in the four corners.
This is a flexible wiring board (hereinafter referred to as a board) having a wire group extension for connecting the HI and external connection terminals. COI
is a drive coil (b) that surrounds two chips CHI on almost the same plane and is arranged so that the opposing sides are parallel to each other (b).
(hereinafter referred to as coil), COR is a rectangular coil assembly C
A frame-shaped core (hereinafter referred to as the core) made of a fixedly arranged soft magnetic material that is provided so as to penetrate the hollow part of the OI.
The chip C is calculated by this core COR and each coil COI.
It constitutes a magnetic circuit PFC that applies an in-plane rotating magnetic field to HI. The RFS is a rotating magnetic field confinement case (hereinafter referred to as the case) that houses the central rectangular portion of the substrate FPC, two chips CHI, and the entire magnetic circuit PFC.

Case RFS is formed by processing two independent plates,
The upper and lower plates are electrically connected on the side of the case.

A converging portion is formed in the peripheral portion so that the gap in the central portion is narrowed in a slightly wider range than the portion where the chip CHI is arranged. This constriction can also be used to position the magnet. Case PFS uses magnetic field confinement and soft substrate FP
It has the effect of killing two birds with one stone by mechanically supporting C).

In particular, there is a chip C between the case PFS and the chip CHI.
There is a gap SIR on the side surface of the HI, but this gap SIR, including the flat surface of the chip CHI, is coated or filled with silicone resin to prevent foreign matter from adhering to the main surface of the chip during assembly or moisture from entering after assembly. A passivation effect is intended to reduce intrusion into the main surface or side surfaces of the chip. If complete airtight sealing can be achieved on the outside of the case RFS, filling of the resin SIR may be omitted. INM is a pair of inclined plates made of magnetic material placed outside the case RFS, and in Fig. 2, the thickness of the upper inclined plate INM decreases as it moves to the left, and the thickness of the lower inclined plate INM decreases as it moves to the right. Both have an inclined surface formed on the case RFS side. As the material for the inclined plate INM, soft ferrite, permalloy, or the like, which has a high magnetic permeability μ and a small coercive force Hc, may be used, and in this embodiment, soft ferrite was selected because it is easy to process the inclined surface. MAG is a pair of permanent magnet plates C (hereinafter referred to as magnet plates) arranged inside and overlapping the pair of inclined plates INM. The ROM is a pair of magnetic shunt plates made of a magnetic material such as soft ferrite and arranged inside each magnet plate MAG and overlapping with it. The magnet plate MAG is formed to have a uniform thickness over the entire surface. The INN is a pair of inclined plates made of a non-magnetic material with good thermal conductivity such as copper, which are placed on the inner facing surfaces of a pair of magnetic shunt plates ROM and overlapped therewith. These inclined plates INN are formed to have substantially the same inclination angle as the inclined plate INM, and have inclined surfaces in opposite directions. The inclined plate INM, magnet plate MAG, magnetic shunt plate HOM, and inclined plate INN are arranged in a stacked manner and integrated to form a bias magnetic field generating magnet body BIM (hereinafter referred to as magnet body), when the entire laminated plate magnet body is formed. The thickness is uniform over almost the entire surface.

A pair of magnet bodies BIM are adhered to a central flat part surrounded by the constriction part of the case RFS.

BIG is a bias magnetic field generating coil (
The bias coil BIC is used to adjust the magnetic force of the magnet plate MAG to match the characteristics of the chip CHI, or to test for the presence or absence of unnecessary bubble generation defects. erase)
It is driven when SHI includes a case RFS that houses the board FPC on which the chip CHI is mounted and the magnetic circuit PFC, and a pair of magnet bodies BIMa and BI on the outside.
This is an external magnetic shield case (hereinafter referred to as shield case) made of a magnetic material that houses Mb and bias coil BIC. The materials for shield case SHI are as follows:
A magnetic material with a high magnetic permeability μ, a large saturation magnetic flux density Bs, and a small Hc is preferable, and permalloy and ferrite have such characteristics. A strong permalloy iron-nickel alloy was selected. PKG is a packaging case made of a material such as AQ that has high thermal conductivity and is easy to process, and is attached to the outer peripheral surface of the shield case, SHI, by adhesive or fitting. GNP are contact pads extending from the four corners of the substrate FPC and arranged to contact external connection terminals folded back on the back surface of the shield case SHI. TEF is a terminal fixing plate made of an insulating material that supports and fixes each contact pad GNP at a stepped portion of an opening. REG is sealed in the four inner corners of packaging case PKG, and the shield case RFS assembly is sealed in packaging case PKG.
It is a resin molding agent that is fixed inside.

(Features of the overall structure, FIGS. 1 and 2) The features of the overall structure of the magnetic bubble memory device shown in FIGS. 1 and 2 are enumerated as follows. However, the features of this embodiment are not limited to these, and other features will become clear from the explanations that follow from Figure 3, but here we will focus on the relationships between each component. The features are described below.

(1) Since the rotating magnetic field generating coil PFC is shaped like a picture frame and the bubble memory chip CHI is arranged within the frame on almost the same plane, the thickness of the entire bubble device can be reduced. This is because in the current mainstream technology, the upper and lower surfaces of the chip are wrapped around the X and X coils, so the thickness of the entire device is a function of the sum of the chip thickness, the X coil thickness, and the Y coil thickness.

(2) Since the X coil and the X coil are arranged on almost the same plane, there are the following effects compared to the conventional structure in which the X coil is wound on top of the X coil.

■The total winding length of the coil does not become long. Therefore, the inductance L can be reduced, making it possible to drive at low voltage and reduce power consumption.

(2) The distance between the X coil and the X coil and the chip CHI can be made equal, and the magnetic field distribution can be made balanced.

(3) Since the rotating magnetic field generating coil PFC is surrounded by the conductor case RFS, leakage of magnetic flux is reduced and drive efficiency for the chip CHI can be increased.

(4) The conductor case PFS is a rotating magnetic field Hr generating coil P
The alternating current magnetic field generated from the FC is prevented from leaking to the magnet body BIM with a large magnetic permeability μ, while the direct current magnetic field of the bias magnetic field Hb to be applied from the magnet body B engineering M to the chip CHI is substantially prevented from passing through. There is a selectivity of not interfering with

(5) Since the conductor case PFS is made of a material such as copper, which is harder than epoxy glass or the like conventionally used for wiring boards, it can mechanically support the chip CHI firmly.

Therefore, when a multiple-chip mounting configuration is used to increase manufacturing yields, variations in the inclination angle between chips have a large effect on magnetic properties, but according to this embodiment, variations in the inclination angle between chips can be reduced. It can be held small.

(6) Flexible film board FPC as a wiring board
By using , the following effects can be obtained.

■The board thickness can be reduced.

■Since the lead bonding method can be used, the thickness occupied by the bonding part can be reduced compared to the conventional wire bonding method.

■The effects of ■ and ■ above are due to the magnetic circuit gap (magnetic permeability μ
A bias magnet MAG having a small thickness or a small planar area can be used, which leads to a thinner overall device or a smaller planar area.

■Wiring from the chip CHI can be bent freely. Therefore, the terminal portion 180' can be turned over, and the planar area of the entire device can be limited.

■The width of the opening for wiring out of the rotating magnetic field confinement case RFS can be made smaller. Therefore, leakage of the rotating magnetic field can be kept to a minimum.

(7) Since the external wiring of the wiring board FPC is concentrated at the corners of the rectangle, the opening of the rotating magnetic field confinement case RFS can be provided at the corner where the influence is least.

(8) Since the function of the inclined plate INN is not combined with the magnet or magnetization function, the following effects are obtained.

■Materials with good workability, such as copper, can be used to form the slope.

■Materials such as copper with a good thermal temperature coefficient can be used, and the heat generated by the rotating magnetic field generating coil COI can be efficiently dissipated.

■By using non-magnetic material, magnetic shunt plate HO
It is possible to avoid disturbing the magnetic field passing through M.

(9) It is preferable for the inclined plate INN to be as thin as possible in order to reduce the magnetic gap.Compared to the magnet MAG and magnetic shunt plate HOM, the inclined plate INN can be made thinner by limiting its width to the area necessary and sufficient for forming the inclined angle. This makes it easy to form an inclined angle in the thickness.

(]0) Between magnet MAG and shield case SHI.

Since a plate INM made of soft ferrite having a large magnetic permeability μ is inserted, the magnetic gap therebetween can be filled. The plate INM also contributes to heat radiation. Since a material having a smaller coercive force He than the magnets M, A, and G is selected for the plate INM, the effective thickness of the permanent magnet can be kept uniform.

(]1) Since the shield case SHI is made of a magnetic material such as permalloy with a high magnetic permeability μ, the magnetic resistance of the magnetic circuit using the magnet MAG as the magnetic field source can be reduced.
The thickness and planar area of the magnet MAG can be reduced.

(12) Since the shield case SHI is made of a magnetic material such as permalloy with a high saturation magnetic flux density Bs, it has the function of bypassing external magnetic field noise and preventing it from being transmitted to the chip CHI.

(13) The above (11) and (L2) each lead to reducing the thickness of the shield case SHI.

(14) Since the shield case SHI uses an iron-nickel alloy such as permalloy, it is suitable for bending and protects the parts incorporated therein against external mechanical forces.

(15) Rotating magnetic field generating coil PFC and bias coil B
Since both ICs are core-type, the storage efficiency or packaging density within the packaging case SHI or PKG can be increased.

(16) Since the case RFS is inserted between the core COR and the magnetic shunt plate HOM, the interval can be finely adjusted by adjusting the thickness of the rotating magnetic field confinement case RFS and the bending angle in addition to the thickness of the coil COI. . The shorter this distance is, the smaller the overall planar size can be, leading to lower power consumption by reducing the coil length.

However, if the distance is too short, the DC bias magnetic field Hb from the magnet MAG will leak to the core 0OR having high magnetic permeability, and the uniformity of the bias magnetic field around the chip will deteriorate. Therefore, this distance is very critical due to the above-mentioned characteristics, and according to the present structure, it can be precisely adjusted.

(17) Since the constriction portion is provided around the rotating magnetic field confinement case RFS, alignment of the magnet body BIM is easy.

(18) The inclined plate INN is made by arranging two plates made under the same manufacturing conditions so that there is a rotation angle difference of 180° between the top and bottom surfaces of the chip, so that the two plates are made under the same manufacturing conditions. A pair of magnetic shunt plates ROM and a pair of magnets M
AG can be aligned almost parallel.

(19) Since bias coils BIC and BICI are provided on the side wall of the rotating magnetic field confinement case RFS, it is possible to test whether or not unnecessary magnetic bubbles are generated while the element CHI is housed in the case RFS. , it is possible to clear all the bubbles of element CM engineering.

Furthermore, it is also possible to remove the bias coil BICI after use. In this case, the number of partial points in the bubble memory is reduced, making it possible to reduce manufacturing costs.

(Overview of assembly Fig. 3) Fig. 3 is an assembly perspective view for explaining the procedure for stacking and assembling each component constituting the above-mentioned magnetic bubble memory device, and the same reference numerals as above indicate the same members. . In the same figure, first, a board F has connection parts for input/output wiring protruding from the four corners and an element mounting part in the center.
Board assembly END with two element CHs mounted on the PC
is placed inside the outer case RFSa, which has an insulating sheet glued at the position indicated by the dotted line on the bottom surface, and this board F
After incorporating the magnetic circuit PFC on the PC, silicone resin SIR (not shown) is filled and the inner case R is placed on top of it.
FSb is assembled into the outer case RFSa, and the side contact portions of the outer case RFSa and the inner case RFSb are electrically connected by soldering or the like. After arranging the upper magnet body BI Ma and the lower magnet body B IMb in the concave constriction part, a gap (not shown) formed between the outer edge of the upper magnet body BI Ma and the inside of the inner case RFSb is Arrange the bias coils BIC wound in alignment on the outer case SHI.
a, further incorporate the inner case 5HIb, and magnetically connect the side contact portions of the outer case 5HIa and the inner case 5HIb by welding or the like. Next, inner case 5
Connect the external connection terminal connection portions of the board FP (E) protruding from the four corners of HIb to the fourth corner on the back of this inner case 5HIb.
As shown in Figure B, they are folded back and arranged in combination to have a certain shape, and each external connection terminal is provided at each of these connection parts and covered with solder or the like.

A terminal fixing plate TEF with contact pads COP (not shown) mounted in each opening is arranged in contact with each other, and each external connection terminal and contact pad COP are electrically connected by soldering or the like by thermocompression bonding or the like. Next, these assembled bodies are housed in a packaging case PKG, and sealed with a hermetic seal or the like at the contact portion between the terminal fixing plate TEF and the packaging case PKG, and then assembled.

Next, the structure of each component mentioned above will be explained.

(Flexible wiring board Fig. 4) Fig. 4 is a diagram showing a board FPC, where A is a plan view thereof and B is a layout in which the connection parts of external connection terminals protruding from the four corners are folded back and combined. The plan view, C is an enlarged sectional view of 4G-4G in figure A, and the same figure is 4D in figure A.
-4D enlarged sectional view. In the figure, the board FPC has a square element protection part 1 in the center, small bent parts 2 (2a, 2b, 2c, 2d) at the four corners, and a square external connection at the tip. It has a terminal connection part (hereinafter referred to as a connection part) 3 (3a, 3b, 3c, 3d), and is integrally formed with an almost windmill-like overall shape,
Further, on the opposite sides of the element protection part 1, there are rectangular openings 4 (4a, 4b) with a double frame structure in which two elements CHI, which will be described later, are mounted and the terminal parts thereof are connected, and a positioning 3 for positioning.
perforations 5 (5a, 5b, 5c) are provided, and one
A substrate protrusion 6 for positioning is provided at the tip of each connecting portion 3c.

In addition, as shown in FIG. C, this FPC board is made by forming a copper thin film on a base film 7 made of a polyimide resin film with a thickness of about 50 μm, for example, via an epoxy adhesive 8, and then applying the copper thin film to the desired shape. By etching into a pattern shape, wiring leads 9a as shown in FIG.
A circular external terminal 9b and an oval coil lead connection terminal 9c.

Patterns such as symbols 9d and index marks 9e are formed, and a transparent or semi-transparent cover film 10 is adhered to the upper surface of these through an adhesive 8 made of the same material as described above. And this board FP
In the opening 4 of C, an opening with highly accurate dimensions is formed in the base film 7 on the side where the element CHI (not shown) is mounted, and an opening with relatively large dimensions is formed in the cover film 10 on the upper surface side. Furthermore, base film 7
A wiring lead 9a is exposed between the wiring lead 9a and the cover film 10, and a tin plating layer 11 is formed on the surface of the wiring lead 9a.
is formed, and the opening shape is formed to have a two-layer structure and a double frame structure. On the other hand, in the connecting portion 3, as shown in the figure, a circular opening 12 is formed at a portion of the cover film 10 corresponding to the circular external terminal 9b and the unillustrated elliptical external terminal 9C. A solder layer 13 is formed by plating or dipping on the copper thin film patterns of the external terminals 9b and 9c exposed from the external terminals 9b and 9c. Each of the external terminals 9b and 9c provided in these connection parts 3 is each connection part 3a.

3b, 3c, 3d and bent portions 2a, 2b.

2c, 2d and each wiring lead 9a formed continuously on the element protection part 1. Each connection portion 3a is partially provided.

They are gathered in blocks 3b, 3c, and 3d, and their tips are exposed in the respective openings 4a and 4b.

That is, as shown in FIG. A, the wiring lead 9a of the connecting part 3a is located at the upper left of the opening 4a, the wiring lead 9a of the connecting part 8b is located at the lower left of the opening 4b, and the wiring lead 9a of the connecting part 3c is located at the lower left of the opening 4b. is wired to the upper right corner of the opening 4a, and the wiring lead 9a of the connecting portion 3d is wired to the lower right corner of the opening 4b. Then, this board FPC is connected to each connecting portion 3a in a later process.

3b, 3c, 3d are the respective bent portions 2a, 2b, 2c, 2
d and assembled as shown in Figure B,
The external terminals 9b and 9c on which the solder layer 13 is formed are exposed on the surface, and the surfaces of the wiring leads 9a, symbols 9d and index marks 9e are covered with the cover film 10, so these patterns are covered with the cover film. 10 is constructed so that it can be easily read through.

In such a configuration, the substrate FPC uses a polyimide resin film, and each bent portion 2 is provided at the four corners of the element protection portion 1.
Each connection 3a, 3b, 3 via a, 2b, 2c, 2d
c, 3d, and each of these connecting parts 3
By folding and combining a, 3b, 3c, and 3d to form the external terminal section, the element protection section 1 and the connection section are separated into two parts.
Since it has a layered wiring structure, the area of the element protection part 1 can be increased without reducing the area of the connection part 3, and at the same time, it is possible to increase the number of external terminals, and the overall shape can be made smaller. .

In addition, in such a configuration, the wiring leads 9a from each external terminal 9b to each opening 4a, 4b of the element protection part 1
Since the time can be significantly shortened, the influence of external noise etc. can be significantly reduced. That is, signals with a high S/N ratio can be input and output. Furthermore, a board protrusion 6 is provided at one end of the connecting part 3C, and an index mark 9e is provided on this protrusion 6, so that when the board is folded back and assembled, it can be used for displaying the central part of the board.
I (see Figure 2) can be used for positioning when assembling, distinguishing the type of wiring lead 9a, or displaying the product model. It can be streamlined. Additionally, holes 5a, 5b, 5c are provided at both ends of the element protection portion 1 of the FPC board.
By providing a
The positioning of the HI becomes easy, and the ease of assembly can also be streamlined.

(Substrate Assembly Figures 5.6.7) Figure 5 is a plan view showing the element CHI mounted on the aforementioned substrate FPC. In the figure, two elements CHI are mounted on the element mounting part 1 of the FPC board at the rear parts 4a and 4b.
A board assembly BND is constructed by being mounted in parallel between the two blocks, and one of the elements CH is constructed by integrating two blocks of IMb chips, as shown in an enlarged plan view in FIG. 4 blocks for 2 elements CHI, 4M in total
It constitutes the b chip. Note that the element C shown in FIG.
In one block of HI, thick lines indicate conductor patterns and thin lines indicate chevron pattern transfer paths. In addition, the element CHI shown in FIG. 5 is shown in FIG. 7A and FIG. 7B.
As shown in the enlarged cross-sectional views in FIG.
A gold bump 15 is interposed between the wiring lead 9a on which the tin plating layer 11 of the substrate FPC opening 4 is formed, and lead bonding is performed using Au-8n eutectic using a thermocompression bonding method.

According to such a configuration, the openings 4a, 4 of the substrate FPC
The wiring lead 9a of (b) and the bonding pad 14 of element (C) LI are connected by lead bonding using Au-8n eutectic, and the element CHI can be supported and fixed, so the connection strength can be greatly improved and the thickness can be reduced. becomes possible. Furthermore, since the surface of the element CHI is covered with the element mounting part 1 of the substrate FPC, the surface of the element CHI is protected, and handling properties can be improved.
The mechanical strength of the FPC board can be maintained. Further, according to such a configuration, since each element CHI is composed of two blocks, and two elements CHI are composed of four blocks, each block is connected to the respective connecting parts 3a, 3b, and 3c closest to each other.

Wiring can be distributed over 3D, symmetrical element CHI arrangement can be obtained, and testing, inspection, etc. can be extremely facilitated.

Furthermore, four connection parts 3a, 3b, 3c, 3 are attached to the board FPC.
d, the wires for the magnetic bubble detector DET and pine pull of each element CHI are distinguished from other functional wires and gathered at one connection point, and this connection point is selected to be away from the noise source. By placing
It is possible to exchange input/output signals with extremely low noise.

(Drive Magnetic Circuit FIGS. 8 and 9) FIG. 8 is a diagram showing the magnetic circuit PFC, and FIG. 8A is a perspective view, and FIG. 8B is a plan view showing the drive magnetic circuit. In the figure, the magnetic circuit PFC is.

A coil COI consisting of four sets of coils 20a, 20b, 20c, and 20d is formed by winding wires in the direction of the arrows on mutually parallel opposing sides of a frame-shaped core COR made of a soft magnetic material.
are wound, and the coils 20a and 20 on opposite sides
B is wound in series through the connection point 21b to form the X coil 2.
2a is wound in series with coils 20c and 20d via a connection point 21a to form a Y coil 22b.

Then, currents Ix and Iy (for example, triangular non-current) whose phases are different by 90 degrees are applied to the X coil 22a and the Y coil 22b.
As shown in Figure B, a leakage magnetic field Hz is generated in the X-axis direction and a leakage magnetic field Hy is generated in the y-axis direction.
It is supplied as a rotating magnetic field to the two elements CHI mentioned above.

In addition, the magnetic circuit PFC configured in this manner has windings arranged around a rectangular parallelepiped magnetic core 23 made of one soft magnetic material with taps 24 for each block, as shown in a perspective view in FIG.
are provided and wound in series to form a pair of coils, for example coil 20.
After forming a pair of X coils 22a consisting of coils 20a and 20b, a wide groove 25 having a constant width and a narrower groove 26 are formed by cutting between each coil 20a and 20b. Thereafter, the wide grooves 25 which are cut from the narrow groove 26 and then glued together in directions perpendicular to each other are formed into a picture frame shape as shown in FIG. Alternatively, the pair of X coils 22a may be formed by winding the coils 20a and 20b through the taps 24 around the rectangular parallelepiped core 23 in which the wide groove 25 and the narrow groove 26 described above are formed in advance. . Furthermore, the pair of Y coils 22b described above are formed in exactly the same manner.

In such a configuration, the coils 20a and 20b are wound in series around the rectangular parallelepiped magnetic core 23 with taps 24 provided, so when assembled as shown in FIG. 8, the wires are connected by crossing each other ( connection points), and the winding routing can be simplified.

According to such a configuration, the X coil 22a and the Y coil 2
2b and 2b have a symmetrical structure, the coupling becomes rough, the inductance balance is improved, and magnetic interference between the magnetic bodies due to the leakage magnetic field can be prevented. Furthermore, since the magnetic circuit PFC has a frame-shaped structure that is not disposed on the upper or lower surface of the element CHI, the thickness in the stacking direction is reduced, making it possible to reduce the thickness.

(Rotating magnetic field confinement case Fig. 10.11.12) 1st
Figure 0 is a diagram showing the case RFS, and Figure A is a plan view.
Figure B is a sectional view taken along the line 10B-10B. In the figure, the inner case RFSb has a frame-shaped constriction part 30 whose central part is concave, and whose opposing end sides extend upward by approximately 90 degrees.
The case RFSb has a bent portion 31 bent at 0 degrees and cutout portions 32 cut diagonally at each of its four corners, and the case RFSb is made of a highly conductive material,
For example, it is formed by pressing an oxygen-free copper plate. In this case, the constricted portion 30 and the bent portion 31 can improve the mechanical strength of the inner case RFSb in the torsion direction, and can appropriately limit the outer diameter dimensions in the longitudinal and lateral directions between the bent portions 31 facing each other. . Further, the aperture section 30 can appropriately adjust the distance between the magnet body BIMb arranged on the outer surface side of this case RFSb and the element CHI arranged on the inner surface side. Note that the cutout portions 32 provided at the four corners are each bent portion 2a of the board FPC disposed within this case RFSb.

It forms the drawer parts 2b, 2c, and 2d.

According to such a configuration, the inner case RFSb can be formed by a press working method, and therefore can be manufactured with high precision dimensions and at low cost.

Although the inner case RFSb is made of oxygen-free steel, it may also be made of copper, silver, gold plate, or a plated alloy plate thereof.

FIG. 11 is a diagram showing an outer case RFSa corresponding to the above-described inner case RFSb, with FIG. 11A being a plan view and FIG. 11B being a sectional view taken along line IIB-11B. In the same figure,
This outer case RF Sa is similar to the inner case R described above.
It is formed using the same material and manufacturing method as FSb, and its structure is almost the same as described above, with a frame-shaped constriction part 33 whose center part is concave, and the opposite end thereof is bent upward at approximately 90 degrees. It is configured to include a bent portion 34 and a notch portion 35 cut diagonally at each of its four corners. In this case, the mutually opposing bent portions 34 are formed so that the inner dimensions thereof are approximately the same as the outer dimensions between the bent portions 31 of the inner case RFSb described above, and the height H is increased. has been done. Note that the constriction portion 33 and the notch portion 35 are connected to the inner case RF described above.
It is formed to have substantially the same dimensions as Sb.

The outer case RFSa and the inner case RFSb configured in this way are constructed by inserting the inner case RFSb into the outer case RFSa, as shown in the plan view in FIG. 12A and the 12B-12B sectional view in FIG. , and the outer surface of the bent portion 31 of the outer case RFSa are brought into contact with each other and connected, thereby integrating the case RFS and assembling the case RFS.

(Case assembly Figure 13) Figure 13 shows the board assembly BND inside the case RFS mentioned above.
This figure shows a cross-sectional view of the storage arrangement. In the figure, a polyimide film 36 with a thickness of about 0° and 11 m, for example, is adhesively arranged as an electrically insulating sheet on the bottom surface of the outer case RF Sa, and a board assembly BND is mounted on this film 36. In addition, magnetic circuit FPCs are arranged on the peripheral edges thereof, and after applying an epoxy adhesive 37 to the upper surface of the board assembly END, an inner case RFSb is inserted into the upper part of these and arranged to be bonded. has been done. In this case, the inner surface of the bent portion 34 of the outer case RFSa and the bent portion 31 of the inner case RFSb
The outer surface of the substrate is electrically and mechanically joined by metal flow, soldering, etc. at the portion indicated by the x mark. Further, a gap between the outer case RFSa and the inner case RFSb is filled with silicone resin SIR, and the board assembly BND and the magnetic circuit PFC are fixedly arranged. In this case, the bent portions 2 (2a
, 2b, 2c, 2d) are drawn out. 38 is the connection of the coil CO worker or the coil CO worker and the board FP
This is a lead wire for connecting an external terminal 9C provided on C.

In such a configuration, when a leakage magnetic field is generated by driving the magnetic circuit FPC, an induced current flows through the case RFS to form a closed loop, and this induced current confines the rotating magnetic field within the case RFS, so that the element CHI is applied with a uniform rotating magnetic field.

According to such a configuration, the element CHI mounted on the substrate FPC is placed in the concave portion of the central portion between the outer case RF Sa and the inner case RFSb.

Since the magnetic circuits PFC are sandwiched and disposed within the convex portions of the peripheral portion, the packaging effect can be improved and the ease of assembly can be greatly improved.

Further, by reducing the volume covered by the outer case RFSa and the inner case RFsb, the VI product (volume) can be reduced, and the magnetic circuit PFC that generates the rotating magnetic field can be downsized. Furthermore, the outer case RFSa and the inner case RFSb are provided with concave portions formed by the constricted portions 30 and 33 to reduce the gap between the opposing concave portions.

In the rotating magnetic field, the component (Z component) perpendicular to the plane of the element CHI is close to zero, and there is only a horizontal component, so that uniformity can be improved.

(Magnet Figure 14) Figure 14 is a diagram showing the magnet body BIM, in which Figure A is a plan view, Figure B is a side view, and Figure C is a front view.

In the figure, the magnetic body BIM includes an inclined plate IN made of a non-magnetic material, such as copper, and one of the opposing surfaces has a predetermined inclined surface.
N, a first magnetic shunt plate HOM Yu with a uniform plate thickness disposed on the slope side of this inclined punching NN, and this first magnetic shunt plate HOM
A magnet plate MAG having a uniform thickness and placed on the upper surface of the first magnet plate MAG and a second magnetic shunt plate HOM having an inclined surface on the upper surface of this magnet plate MAG are sequentially laminated and integrated with an epoxy adhesive. The laminated plate thickness is uniform over almost the entire surface. A uniform magnetic field for generating a bias magnetic field is emitted from the upper and lower surfaces of this magnet body BIM over almost the entire surface.

(Bias Coil FIG. 15) FIG. 15 is a diagram showing the bias coil BIC, where A is a perspective view and FIG. B is a cross-sectional view taken along line 15B-15B. In the same figure, the bias coil BIC has a winding 40 whose outer surface is coated with an insulating member such as a thermosetting resin, and is wound in an array with a cross section of 5 x 4 wires so that the overall shape has a picture frame shape. After that, it is crimped by heat welding, cooled, and formed into a frame shape of a predetermined value. In this case, the thermosetting resin coated on the outer surface of each winding 40 is thermally welded to each other, and each winding 40 is clogged and formed by pressure bonding, and by cooling, each winding 40 is hardened in a bundled state. Therefore, it is formed into a predetermined picture frame shape.

(Mounting the magnet and bias coil on the case assembly
(FIG. 16) FIG. 16 is a sectional view of the case RFS assembly described in FIG. 13 incorporating the magnet body BIM and bias coil BIC. In the same figure,
An upper magnet body B I M a and a lower magnet body BIM b are adhesively arranged on the upper and lower surfaces of the case RFS assembly that houses the board assembly BND and the magnetic circuit PFC inside, respectively.
Further, a bias coil BIC is housed in a frame-shaped groove formed by being surrounded by the peripheral edge of the upper magnet B I Ma and the bent portion 31 of the inner case RFSb. In this case, the upper magnet body BIMa and the lower magnet body BIMb are made of the same material and 9 dimensions, and the inclined plate INN side of these magnet bodies BIMa and BIMb is connected to the constriction part of the inner case RFSb. 30 and the concave portion surrounded by the constriction portion 33 of the outer case RFSa in close contact with each other.

In such a configuration, a pair of magnet bodies BIMa,
Since the BIMb is placed and the bias coil BIC can be placed in the frame-shaped groove formed on the periphery of the BIMb,
The overall thickness of each component in the stacking direction is reduced, making it possible to make it smaller and thinner. Further, since a frame-shaped space groove is formed between the outer case RFSa and the outer edge portion of the lower magnet body BIMb, the bias coil BIC may be placed in this portion, or a new bias coil may be provided. Furthermore, it is also possible to form a bias coil by winding the wire as a coil bobbin.

(Magnetic shield case Fig. 17, 18, 19) Fig. 17
The figures show the shield case SHI, with figure A being a plan view and figure B being a 17B-17B cross-sectional view thereof. In the figure, the outer shield case 5HIa has a flat portion 51.
, a bent part 52 which is bent upward at an angle of approximately 90 degrees on the opposite end side of this flat part 51 , a recessed part 53 with a part cut out in the center of this bent part 52 , and each of the four corners thereof. The shield case SHIa is made of a material having high magnetic permeability and high saturation magnetic flux density, and preferably high thermal conductivity, such as a permalloy plate. It is formed by pressing.

FIG. 18 is a diagram showing an inner shield case 5HIb corresponding to the above-mentioned outer shield case 5HIa, with FIG. 18A being a plan view and FIG. 18B being a 18B-18B sectional view thereof. In the figure, this inner shield case 5I (I b
is formed using the same material and manufacturing method as the above-mentioned outer shield case S HI a, and its structure is almost the same as above, with a flat part 55 and an opposite edge of the flat part 55 extending upward at approximately 90 degrees. A folded portion 56 and a recessed portion 57 partially cut out in the center of the bent portion 56.
and a notch 58 cut diagonally at each of its four corners.
It is composed of: in this case.

The mutually opposing bent portions 56 are formed so that the outer dimensions thereof are approximately the same as the inner dimensions between the bent portions 52 of the outer shield case S HX a described above, and the height H is reduced. ing.

The outer shield case 5HIa and the inner shield case S HI'b configured in this way are arranged inside the outer shield case 5HIa, as shown in a plan view in FIG. Insert the inner shield case 5HIb and connect the recess 53 of the outer shield case SHIa and the inner shield case 5HIb.
The outer shield case 5HIa is assembled by performing spot welding or solder welding to the recess 59 formed with the recess 57 of the outer shield case 5HIa and magnetically and mechanically fixing the recess 59 and the recess 57. In such a configuration, the bent portion 52 of the outer shield case S HI a and the bent portion 56 of the inner shield case 5 HIb should not be set in the lateral direction, that is, in a direction that intersects with the laminated direction, but aligned in the laminated direction. As a result, the lateral dimension can be reduced, making it possible to achieve compactness and high integration of component parts.

(Magnetic shield case assembly FIG. 20) FIG. 20 shows the case RFS assembly, which incorporates the board assembly BND and magnetic circuit FPC inside the shield case SHI assembly described in FIG. magnetic plate BIM
Fig. 3a shows a cross-sectional view incorporating an assembly consisting of BIMb and bias coil BIC. In the same figure.

Inside the outer shield case SHI a, there is an upper magnet body B I M a in the center from the bottom side, a bias coil BIC in the periphery, a board assembly BND, a magnetic circuit PFC, etc. inside the case RFS assembly. After sequentially stacking and arranging the lower magnet bodies B IMb (incorporated), the inner shield case 5HIb is inserted, and the recess 53 of the outer shield case SH a and the inner shield case S are inserted.
It is fixed and sealed by welding in a recess 59 (see FIG. 19) formed with the recess 57 of HI b. In this case, by filling the shield case SHI with grease or the like, the internal components will come into close contact with each other, and the heat generated from the case RFS will be transferred to the outside through the shield case SHI. can be released to Furthermore, the heat dissipation effect can be improved by making the case RFS and the shield case SHI contact each other at their sides by press-fitting.

In such a configuration, the outer shield case S HI
The outer shield case 5HIa and the inner shield case S are stacked on the bottom side of the case RFS assembly so that the bent parts 31 and 34 thereof face each other.
Since each component laminated between the HI b and the HI b can be placed in close contact with each other, it is possible to make the IJX shape and thinner, and at the same time, a heat dissipation effect can be obtained.

(Packaging case FIG. 21) FIG. 21 is a diagram showing a packaging case PKG, in which FIG. 21A is a plan view and FIG. 21B is a 21B-21B sectional view thereof. In the figure, the packaging case PKG is formed by drawing a material with good thermal conductivity, for example, an aluminum plate with a thickness of about 0.5 mm, and has a black coating on its outer surface (not shown). There is. This packaging case PKG includes the outer shield case 5.
) (The shape of Ia can be improved and used for both purposes.)

In such a configuration, this packaging case P
KG is a magnetic bubble memory deno (which functions as an outer case and a heat sink after the chair is completed, and its inner corner also functions as a mold during resin molding using the potting method described later). ing.

(Terminal fixing plate and contact pad Fig. 22.23)
FIG. 22 is a diagram showing the terminal fixing plate TEF, in which FIG. 22A is a plan view, FIG. 22B is a sectional view taken along line 22B-22B, and FIG. 22C is a rear view thereof. In the same figure, the terminal fixing plate TEF is made of an electrically insulating material, for example, a glass epoxy resin plate 60, and its external shape is such that it can be freely inserted into and removed from the opening of the packaging case PKG. The resin plate 6 is formed to have dimensions in the direction.
A large number of through holes 61 are formed in a matrix arrangement at predetermined intervals in the vertical and horizontal directions except for the peripheral area of 0, and the corners of these through holes have cross sections that are not rotationally symmetrical. A concave non-through hole 62 is provided, and a mark 63 made of, for example, a white coating film for locating directionality or features is attached inside the non-through hole 62. In addition, a large number of through holes 6 are formed in this resin plate 60.
As shown in FIG. 1B, large-diameter openings 64 are coaxially communicated with each other on the back side of the plate, and all of these openings 64 have a depth of about 60% of the plate thickness. In addition, it communicates with the through hole 61 with a step in the middle. Also,
As shown in Figure C, the back side of this resin plate 60 has a depth approximately equal to the depth of the opening 64 along its peripheral portion, and has a different width in the plane direction and a concave cross section. A groove 65 is formed, and the above-mentioned coil CO is placed inside this groove 65.
It constitutes a passage section and a connection section for the winding of bias coil B and C of bias coil B and C. In addition, the corner portion 6 of this resin plate 60
6 does not have a concave shape, but has a predetermined plate thickness, and forms a contact surface with the inner surface of the packaging case PKG described above. In this way, the back side of the resin plate 60 is formed to have a two-stage structure with different plate thicknesses. 6 Figure 23 shows the contact pad GNP, where Figure A is a plan view and Figure B is a plan view. It is the 23B-23B sectional view. In the figure, the contact pad GNP is formed by forming a nickel plating layer 7 on the surface of a piece 70 punched out of a highly conductive material, for example, a copper plate with a thickness of approximately 0.5 m.
1. It is constructed by forming a gold plating layer 72.

(Final assembly FIG. 20.4.2) For each component configured in this way, first, the shield case assembly described in FIG. 20 is inserted into the packaging case PKG described above. In this state, the connection parts 3a, 3b, 3c, and 3d of the board assembly BND are connected from the four corners of this packaging case PKG (Fig. 4A).
(see) is about 9 from each bending part 2a, 2b, 2c, 2d.
It bends at 0 degrees and protrudes. Next, resin molding is performed at the four corners of this packaging case PKG by a potting method, and each individual component is fixedly arranged inside this packaging case PKG. Subsequently, these connecting portions 3a, 3b, 3c, and 3d are connected to the corresponding bent portions 2a,
2b, 2c, and 2d are further bent at approximately 90 degrees and attached to the outer surface of the inner shield case 5RIb with adhesive.
After combining as shown in Figure B, the terminal fixing plate TE
A contact pad GNP is mounted in each opening 64 on the back side of F, or the side surface of the contact pad GNP is further fixed with an adhesive, and inserted into the packaging case PKG, and each connection portion 3a, 3b, 3c is formed.

Place it in contact with 3d. In this case, each connection part 3a.

Since the arrangement pitch of each external terminal 9b provided in 3b, 3c, and 3d matches the arrangement pitch of each contact pad GNP, each external terminal 9b and contact pad GNP are in electrical contact.

Next, from the back side of the terminal fixing plate TEF placed, each through hole 61
For example, by inserting a heating element with a thin tip into the contact pad GNP and thermocompressing the contact pad GNP, each external terminal 9b and the corresponding contact pad GNP are electrically connected, and the terminal defining plate TEF is also mechanically connected at the same time. Once fixed, the magnetic bubble memory device shown in FIG. 2 is completed.

(Magnetic bubble memory element No. 24.25, 26.27.
Figure 28) Figure 24 shows the above-mentioned magnetic bubble memory element CH.
3 shows a cross-sectional view of the vicinity of the pumping pad PAD of the construction. In the same figure, GGG is gadolinium
-gallium -garnet substrate, LP
E is a bubble magnetic film formed by liquid phase epitaxial growth, and an example of its composition is shown in Table 1 on the next page.

(This page, the following margins) Table 1 1ON indicates an ion implantation layer formed on the surface of the LPE film to suppress hard bubbles. SPI is the first spacer, for example 3000 N thick Sio2 is formed by gas phase chemical reaction.

CND1 and CND2 indicate two conductor layers, which have the function of controlling bubble generation, copying (splitting) and exchange, which will be described later, and the lower first conductor layer CND1 is
, and the upper second conductor layers CND2 are each formed of a material such as AU. SF3 and SF3 are interlayer insulating films (second and third spacers) made of polyimide resin or the like that electrically insulate the conductor layer CND and the transfer pattern layer P formed thereon, such as permalloy. PAS is a passivation film made of a 5in2 film or the like formed by a vapor phase chemical reaction method. PAD indicates a bonding pad of the element CHI, and a thin connector wire such as an AU wire is bonded here by thermocompression bonding or ultrasonic bonding. This bonding pad PAD has the lower first layer PAD
r, second layer PAD in the center, Au layer, third layer PAD above
, are each made of a material such as an Au plating layer,
The second layer PAD and the third layer PAD3 may be made of materials such as Cr and Cu. 6P indicates a layer used for a bubble transfer path, a bubble division 2 generation, replacement and detection section, and a guardrail section. In the following explanation, this layer will be referred to as a transfer pattern layer for convenience.

In the example of Fig. 24, this transfer (turn layer P number ± lower layer P□
Fe-Ni is used for the upper layer P2, and Fe-Ni is used for the upper layer P2, but as described above, it is also possible to interchange the materials of the two above and below.

Hereinafter, the transfer pattern layer consisting of the plurality of layers described above will be transferred to the element C.
An example of application to each part of the HI will be explained using the plan views from Figure 25 onwards. In these plan views, each layer of the transfer pattern layer is formed by self-line, so it is represented by the same contour line. Please note that. Figure 25 shows the bubble detector part, where MEM is the main magnetoresistive element, which uses the change in resistance value when bubbles stretched in a strip shape in the horizontal direction pass through it to detect the presence or absence of bubbles. Detect. MED is a dummy magnetoresistive element having a pattern similar to that of the main magnetoresistive element MEM, and is used to detect noise components due to the influence of a rotating magnetic field. Above the main magnetoresistive element MEM, several dozen stages of bubble stretchers ST are formed, although only two stages are shown, which stretch the bubbles laterally and transfer them downward. Indicates the transfer direction.

ER is a bubble eraser, and when a bubble reaches the conductor layer CHD, it is erased. A guardrail GR consisting of three rows of pattern groups is provided around this detector and between the dummy and main detection.
It is designed to expel unnecessary bubbles generated inside the guardrail GR to the outside thereof, and prevent unnecessary bubbles generated outside the guardrail GR from entering inside it. In addition,
In the plane pattern diagrams shown in FIG. 25 and subsequent figures, patterns other than the conductor layer CND show the transfer pattern MP explained in FIG. 24. In the figure, the signal-to-noise ratio (S/
For example, when a three-layer permalloy layer with a SiO film interposed between each layer is used as a transfer pattern, the S /N ratio can be improved by more than 2 times Table 2 Furthermore, the performance of the guardrail GR is also improved, such as the removal rate of unnecessary bubbles becoming higher due to the reduction of the holding force Hc.

FIG. 26 shows the magnetic bubble generator GEN, and by making the transfer pattern layer P multilayer, the current generated by the magnetic bubble can be reduced, and the life of the conductor layer CND of the magnetic bubble generator can be extended. It became possible. Therefore, a semiconductor element with a small current capacity value can be used for the drive circuit of the conductor layer CHD, and the cost can be reduced.

FIG. 27 shows a minor loop m formed by a transfer pattern such as P a ” P h, a write major line WML formed by a transfer pattern row such as Pw to Pw 3, and a swap gate portion formed by a hairpin-shaped conductor layer CND. In the same figure, P7 is the same as the transfer pattern P7 in the bubble generator GEH in FIG. When a current is passed through the swap conductor layer CND, the transfer pattern Pd of the minor loop m1 is transferred to the write major line WML.
The magnetic bubbles are transferred to the transfer pattern Pw of the major line WML through transfer patterns PQ and Pm, and the magnetic bubbles from the major line Pw1 are transferred to the transfer pattern P of the minor loop via transfer patterns Pk, Pj, and Pi.
The data is transferred to A and the bubbles are exchanged, that is, the information is rewritten. Note that the rightmost minor loop md is not provided with a swap gate, but this is a dummy loop in which no magnetic bubble is injected to reduce the peripheral effect. In this way, the transfer pattern layer P at the exchange position
By multilayering i''Pm, magnetic bubbles can be exchanged with a small current value.

Further, as shown in FIG. 28, a magnetic bubble copying machine, that is, a divider, can be driven with a small current value as well. In the figure, a magnetic bubble is normally transferred along a path from Pn to Pg, Ps''Px, and when a current is passed through the conductor layer CND, the bubble is divided at the position of the transfer pattern Pg, and one divided magnetic bubble is transferred. The bubble is transferred to the read major line RML via Py?PI to P1.

(Holding magnetic field and rotating magnetic field FIG. 29) Magnet plate MAG is arranged at an angle of about 2 degrees with respect to element CHI. This is so that the bias magnetic field Hb is applied to the element CHI with a slight deviation from the perpendicular direction, thereby creating a holding magnetic field Hdc that improves the start and stop margins of bubble transfer by about 6 (Os) (No. 29 Figure A).

As shown in FIG. 29A, due to the inclination of the angle θ between the magnet body BIM and the element CHI, the DC magnetic field Hz has a component Hdc in the xy plane. And this in-plane component H
The magnitude of dc is Hdc-sinθ, and usually Hdc
The inclination angle θ is selected so that −sin θ=5 (Os) to 6 (Oe), and the direction of this in-plane component Hdc is determined by the start/stop (St/S) of the rotating magnetic field Hr.
p) direction (+xX axis direction).

This xy-plane component Hdc is a known magnetic field called a holding field, which functions effectively for the start/stop (St/Sp) operation of the rotating magnetic field Hr. Note that the magnitude of the bias magnetic field Hb acting perpendicularly to the element CHI surface is H2-cos θ.

Now, since the above-mentioned holding field HdC always acts on the 11 planes of the element CHI, the rotating magnetic field Hr' acting on the element CHI is eccentric, as illustrated in FIG. 29B. In the figure, Hr is a rotating magnetic field applied from the outside, and HF2 is a rotating magnetic field acting on the element CHI.

In this case, the rotating magnetic field Hr' acting on the CHI is a combination of the rotating magnetic field Hr applied from the outside and the in-plane component Hdc, and the center 0' of the rotating magnetic field Hr' is in the start/stop (St/Sp) direction. It moves in parallel in the +X-axis direction by an in-plane component Hdc. Therefore, as is clear from the results in the same figure, the rotating magnetic field Hr applied from the outside
Even if the strength of is l Hr l, it effectively acts on inhibiting CHI.

The strength IHr'l of the rotating magnetic field varies depending on the phase of the rotating magnetic field Hr. That is, IHr in S t / S p direction
1 becomes IHrl+IHdcl, which is stronger than 1Hrl by the strength of the holding field Hdc, IHdcl. Conversely, lHr'l in the opposite direction to the S t / Sp direction becomes 1Hrl - lHdcl,
l Hr It is weaker by 1Hdel compared to l.

(Peripheral Circuit FIG. 30) Finally, the peripheral circuit of element CHI will be explained with reference to FIG. 30. R
F is a circuit for generating a rotating magnetic field Hr by passing a current with a phase difference of 90'' through the X and Y coils of the element CHI.SA
is a sense amplifier that samples, senses, and amplifies the minute bubble detection signal from the magnetoresistive element of element CHI in synchronization with the timing of the rotating magnetic field. The DR is a drive circuit that applies current at predetermined timing to each functional conductor of a replicate that is related to bubble generation and swap and read related to writing of the MBM device.

The above circuit is synchronized by a timing generation circuit TG so as to operate in synchronization with the cycle and phase angle of the rotating magnetic field Hr.

(Rotating magnetic field distribution characteristics FIG. 31) FIG. 31 shows the rotating magnetic field distribution characteristics of the magnetic circuit PFC described above. That is, in the figure, the horizontal axis represents the length in the X-axis direction with the center of the magnetic circuit PFC shown in FIG. 8B as 0, and the vertical axis represents the rotating magnetic field strength Hx in the X-axis direction.
When the rotating magnetic field strength Hz in the X-axis direction when = O is shown, a rotating magnetic field distribution characteristic as shown by a one-curve line was obtained.

As is clear from the figure, a substantially uniform rotating magnetic field strength Hx is obtained within the range of -Xc to +XC between the opposing cores COR of the magnetic circuit PFC, and
Effective area of I (minimum range to which a rotating magnetic field should be applied) -X
In the range from s to +Xs, a magnetic field strength uniformity of about ±2% was obtained. Note that the curve (2) indicated by a broken line is the rotating magnetic field distribution characteristic due to the magnetic circuit of the conventional configuration.

(Modifications) Although the details have been described above in relation to the overall structure of the magnetic bubble memory shown in FIGS. 1 and 2, the present invention can be implemented in the following modifications.

FIG. 32 shows a substrate F for explaining another embodiment of the present invention.
It is a plan view of the PC, and the same parts as in the previous figure are given the same reference numerals. In the figure, the board FPC has a square element protection part 1 in the center and a frame-shaped external connection terminal connection part (hereinafter referred to as connection part) 3'(3a',
3b',3c',3d'), and are integrally formed with an almost rectangular overall shape, and two elements CHI are provided on opposite sides of the element protection part 1. A rectangular opening 4 (4a, 4b) with a double frame structure for mounting the device and connecting its terminal portion, and three perforations 5 (5a, 5b, 5c) for positioning the element CH1 are provided, and a At the periphery of the portion 1, there are two sets of trapezoidal openings 4' (4a
', 4b', 4c', 4d') are provided. On the other hand, the connection portion 3' has a plurality of external connection terminals (hereinafter referred to as connection terminals) 9, each having an annular conductor pattern 9f formed on the periphery and a circular opening 4' formed in the center thereof.
' are arranged at a predetermined pitch, and these connection terminals 9
A wiring lead 9a connected to the element CHI is connected to the board assembly BND.

FIG. 33 is a diagram showing the terminal plate PGA; FIG. 33A is a plan view, FIG. 33B is a sectional view taken along line 33B-33B, and FIG.

In the figure, the terminal board PGA is made of an electrically insulating material, for example, a glass epoxy resin plate 60', and has a square opening 60a in the center into which the shield case SHI assembly described above can be inserted. ', and its outer shape has dimensions in the vertical and horizontal directions that allow insertion of an opening of a packaging case PKG, which will be described later, and the peripheral part of this resin plate 60' is provided with the board FPC. A plurality of metal pins 73 are implanted at the same pitch as the arrangement of the provided external connection terminals 9'.

FIG. 34 is a diagram showing the packaging case PKG, with FIG. 34A being a plan view and FIG. 34B being a 34B-34B sectional view thereof. The packaging case PKG is made by drawing a material 5 with good thermal conductivity, such as an aluminum plate with a thickness of approximately 0°5 am, and includes a main body portion 81, a flange portion 82 that forms a space around the inside, and an open end. Locking part 83 that fixes the peripheral part
Although not shown, a black film is formed on the outer surface of the magnetic bubble memory device, and it functions as an outer case and a heat sink after the magnetic bubble memory device is completed.

Each of the components constructed in this way is first
The board assembly BND explained in the figure is sandwiched and joined between the outer case RF Sa and the lower case RFSb together with the magnetic circuit PFC as shown in FIG. 13. In this case, four trapezoidal openings 4a' formed in the substrate FPC
, 4b', 4c', and 4d' are penetrated by the bent portions 34 of the outer case RF S a, and the connecting portions 3' of the board FPC are protruded in a frame shape from the periphery of the case RFS assembly. It turns out.

Next, this case RFS assembly is connected to the above-mentioned pair of magnets B.
rM and bias coil BIC are stacked and sandwiched between the outer shield case SHI a and the inner shield case 5 HIb, and are electrically and mechanically connected. In this case as well, four trapezoidal openings 4a formed in the substrate FPC
/ , 4 b / , 4 C /.

4d' are penetrated by the bent portions 52 of the outer shield case SHIa, and similarly, each connection portion 3' of the board FPC is projected in a frame shape from the periphery of the shield case SHI assembly. Subsequently, this shield case SHI assembly is mounted on the terminal board PGA explained in FIG. Each connection terminal 9'
The opening 4' is inserted and the two are electrically and mechanically connected by solder 90, as shown in an enlarged cross-sectional view in FIG. In this case, the opening 60 provided in the terminal plate PGA
A shield case SHI assembly is inserted into a' with dimensional tolerance. Next, this shield case SHI
Insert the assembly into the packaging case PKG (Fig. 36). In this state, each connection part 3a of the board assembly BND is inserted from the four corners of the packaging case PKG.
', 3b', 3c', and 3d' are bent at about 90 degrees, further bent at about 90 degrees in the opposite direction, and placed in the flange 82 of the packaging case PKG.

Next, resin molding is performed inside this packaging case PKG by a potting method to securely arrange each component inside this packaging case PKG, and the locking part 83 of the packaging case PKG is attached to the terminal plate PGA.
Attach it to the periphery of the bottom. In addition, the surface of the shield case SHI assembly (inner shield case 5HIb) exposed in the opening 60a' of the terminal plate PGA is made of a material 1 with good thermal conductivity, such as aluminum, which is press-molded. A heat radiator RAD formed in a block shape is closely placed with a silicon adhesive having good thermal conductivity.

As shown in FIG. 36, the magnetic bubble memory device configured in this manner is mounted on a board BOD on which the drive circuit described in FIG. Mounted on pin 73 of terminal board PGA and wiring pattern 101 of board BOD.
are connected by solder 90 and completed. in this case,
The heat radiator RAD, which is closely disposed on the back surface of the shield case SHI assembly, is disposed in close contact with the front surface of the board BOD with its back surface side in contact with the surface of the board BOD.

According to this configuration, since the heat sink RAD is closely arranged on the back surface of the shield case SHI assembly, the magnetic circuit P
The heat released from the FC is transferred to the heat sink RA via the shield case SHI assembly (inner shield case 5HIb).
D, and part of it goes in the direction of the four sides (in the direction of arrow A indicated by the dotted line).

Also, a part goes inside the board BOD (in the direction of arrow B shown by the dotted line), and a part goes outside (in the direction of arrow B shown by the dotted line) through the board BOD.
The heat is radiated in the direction of arrow C indicated by the dotted line. Therefore, the temperature rise of the element CHI can be reduced. In addition, according to this configuration, since the heat sink RAD is provided on the bottom side of the shield case SHI assembly, it can also function as a positioning jig when mounting the magnetic bubble memory device on the board BOD. Then there is bottle 7
3. Effects such as being able to use a terminal board PGA that does not require a stopper can be obtained.

FIG. 37 shows another embodiment of the present invention, and the difference from FIG. 36 is that a first wiring pattern different from the signal circuit wiring pattern is provided on the front and back surfaces of the board BOD on which the magnetic bubble memory device is mounted. conductor pattern 102 and the second
A conductor pattern 103 is provided, and both are connected through a through hole 10.
4, and by arranging the heat dissipating body RAD in close contact with the first conductor pattern 102 on the surface of the board BOD, the heat dissipation performance can be further improved.

〔Effect of the invention〕

As explained above, according to the present invention, a magnetic bubble memory element mounted on a flexible substrate is placed in the space formed by the edge-shaped core, which is coiled so that the pairs of windings facing each other are parallel to each other. The coil, the core, and the magnetic bubble memory element are all sandwiched within a case made of a highly conductive material, and a pair of magnets are combined with the outer surface of the case made of a highly conductive material, and the entirety of the coil, core, and magnetic bubble memory element are sandwiched within a case made of a highly permeable material. At the same time, the external connection terminals of the flexible board and the connection terminals of the terminal board are bonded together, and a heat sink is closely placed on the terminal board connection terminal drawer side of the highly permeable material case, thereby reducing the temperature of the magnetic bubble memory device. Since the increase in temperature can be reduced, extremely excellent effects such as the ability to operate in a wide temperature range can be obtained without reducing the overall shape and reducing the operating margin.

[Brief explanation of the drawing]

FIG. 1 is a partially cutaway perspective view showing the whole magnetic bubble memory device according to the present invention, FIG. 2A is a bottom view, FIG. 2B is a sectional view taken along line 2B-2B of FIG. 3, and FIG. 3 is a stacked structure. Figure 4 is a diagram explaining the board FPC, Figure 5 is an exploded perspective view showing the
The figure shows a board assembly BN in which the element CHI is mounted on the board FPC.
6 is a diagram showing the element CHI, FIG. 7 is a diagram illustrating lead bonding of the board assembly BND, FIG. 8 is a diagram illustrating the magnetic circuit PFC, and FIG. 9 is a diagram illustrating the magnetic circuit. A diagram explaining the manufacturing method of PFC, FIG. 10 is a diagram showing the inner case RFSb, and FIG. 11 is a diagram showing the outer case RF S.
Figure 12 is an assembly diagram of the case RFS.
3 is a cross-sectional view of an assembly in which the board assembly END and the magnetic circuit FPC are housed in the case RFS, FIG. 14 is a diagram explaining the configuration of the magnet body BIM, FIG. 15 is a diagram explaining the bias coil, Figure 16 is a cross-sectional view of the case RFS assembly incorporating a pair of magnets BIM and bias coil BIC, and Figure 17 is the outer shield case S H
The figure showing I a, Fig. 18 is the inner shield case 5HI
Figure 19 is an assembly diagram of the shield case SHI, and Figure 20 is an assembly diagram of the shield case SHI shown in Figure 16.
21 is a diagram showing the package jig case PKG, FIG. 22 is a diagram explaining the configuration of the terminal fixing plate T-'E F, and FIG. 23 is the configuration of the contact pad. FIG. 24 is a cross-sectional view of the element CHI. Fig. 25 shows the configuration of the magnetic bubble detector of element CHI, and Fig. 26 shows the magnetic bubble generator GEN of element CHI.
27 is a diagram showing the configuration of the swap gate swp of the element CHI, FIG. 28 is a diagram showing the configuration of the replicate gate REP of the element CHI, and FIG. 29A is a diagram showing the configuration of the bias magnetic field Hb and the Halling magnetic field. FIG. 30 is a diagram showing the relationship between Hdc and Hdc, FIG. 30 is a diagram showing the total rotating magnetic field Hr', and FIG. 30 is a diagram showing the entire circuit of the magnetic bubble memory board. Figure 31 is a rotating magnetic field distribution characteristic diagram, Figures 32 to 37
The figure is a diagram illustrating another embodiment of the present invention. CHI...Magnetic bubble memory chip (element). FPC...Flexible wiring board (substrate), BND/
・・Substrate assembly, COI・・Drive coil (coil)
, COR...frame-shaped core (core), RFC...magnetic circuit, RFS...rotating magnetic field confinement case (case)
, RFSa...outer case, RFSb...inner case, BIM...magnet for generating bias magnetic field (magnet)
・BIMa. ...Top magnet body, BIMb...Bottom magnet body, Engineering NM・
... Inclined plate, MAG... Permanent magnet plate (magnet plate), HO
M...Magnetic adjustment plate, INN town...Non-magnetic inclined plate, BIC...
・・Bias magnetic field generation coil (bias coil), S
HI...External magnetic shield case (shield case)
, 5HIa...outer shield case, 5HIb...
Inner shield case, REG...resin molding agent, P
KG...Packaging case, TEF...Terminal fixing plate, GNP...Contact pad, RAD...Heat sink, BOD...Board, 1...Element mounting part, 2,
2a, 2b, 2c, 2d...Bending portion, 3.3'
, 3a, 3a' t 3bt 3b' p3c, 3c
' , 3d, 3d' ... External connection terminal connection part, 4
, 4', 4a, 4a', 4b, 4b'. 4c', 4d',...opening, 4'--opening, 5.
5a, 5b, 5c...perforation, 6...board protrusion, 7
Function...Base film, 8...Adhesive, 9'...
External connection terminal, 9a...Wiring lead, 9b...External terminal, 9c...Connection terminal, 9d...Symbol, 9e
...index mark, 9f...conductor pattern,
10...Cover film, 11...Tin plating layer, 1
2... Opening, 13... Solder plating layer, 14... Ponding pad, 15... Gold bump, 20ap2
0b, 20c, 20d... Helix coil. 21a, 21b...connection point, 22a...X coil,
22b...Y coil, 23...magnetic core, 24...
・Tap, 25... Large width groove, 26... Small width groove, 30... Squeezed part, 31... Bent part, 3
2... Notch part, 33... Squeezed part, 34... Bending part, 35... Notch part, 36... Polyimide film, 37... Adhesive, 38... Coil winding line, 4
0... Winding wire, 51... Flat part, 52... Bent part, 53... Concave part, 54... Notch part, 55...
Flat part, 56... Bent part, 57... Concave part. 58... Notch, 59... Recess, 6o, 60'
... Resin plate, 60a' ... Opening, 61...
Through hole, 62...Non-through hole, 263...Mark, 6
4...Opening, 65...Groove, 66...Corner, 70...
・・・Element piece, 71... Nickel plating layer, 72...
Gold plating layer, 73... Pin, 73a... Tip, 8
1... Main body part, 82... Flange part, 83... Locking part,
90... Solder, 100... Opening, 101... Wiring pattern, 102... First conductor pattern, 103...
...Fig. 4 C Fig. 4 Fig. 5 Fig. 6 Fig. 8 B Fig. 9 Fig. 10 A HFb (1 Fig. 14 A Fig. 14 B Fig. 14 C Fig. 15 B Fig. 17 A Fig. 19 A Fig. 19 B Fig. 21 A Figure 21 B E Fig. 22 A Fig. 22 B Fig. 22 C 7 size Q- Fig. 26, Fig. 28 Fig. 33 C Inset Procedural amendment (,, y.

Claims (1)

[Claims] A magnetic bubble memory element mounted on a flexible substrate is disposed in a space formed by a frame-shaped core coiled so that sets of opposing windings are parallel to each other, and the coil, core, and magnetic bubble memory element are mounted on a flexible substrate. The entire element is sandwiched within a case made of a highly conductive material, and a pair of magnets are combined with the outer surface of the case made of a highly conductive material and sandwiched within the case made of a highly permeable material. A magnetic bubble memory characterized in that the connection terminals of the terminal board are bonded to each other, and a heat dissipation body is closely disposed on the terminal board connection terminal pull-out side of the highly magnetically permeable material case.