JPS6254600B2 - - Google Patents

Info

Publication number
JPS6254600B2
JPS6254600B2 JP7707786A JP7707786A JPS6254600B2 JP S6254600 B2 JPS6254600 B2 JP S6254600B2 JP 7707786 A JP7707786 A JP 7707786A JP 7707786 A JP7707786 A JP 7707786A JP S6254600 B2 JPS6254600 B2 JP S6254600B2
Authority
JP
Japan
Prior art keywords
brazing
filler metal
brazing filler
melting point
content
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP7707786A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6224893A (ja
Inventor
Hideaki Yoshida
Masaki Morikawa
Kunio Kishida
Tadaharu Tanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Metal Corp
Original Assignee
Mitsubishi Metal Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Metal Corp filed Critical Mitsubishi Metal Corp
Priority to JP7707786A priority Critical patent/JPS6224893A/ja
Publication of JPS6224893A publication Critical patent/JPS6224893A/ja
Publication of JPS6254600B2 publication Critical patent/JPS6254600B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Ceramic Products (AREA)
JP7707786A 1986-04-03 1986-04-03 ぬれ性の良好な低融点Ｃｕ−Ａｇ系合金ろう材 Granted JPS6224893A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7707786A JPS6224893A (ja) 1986-04-03 1986-04-03 ぬれ性の良好な低融点Ｃｕ−Ａｇ系合金ろう材

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7707786A JPS6224893A (ja) 1986-04-03 1986-04-03 ぬれ性の良好な低融点Ｃｕ−Ａｇ系合金ろう材

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP5426681A Division JPS57171599A (en) 1981-04-13 1981-04-13 Low melting point cu-ag system alloy solder with excellent wetting property

Publications (2)

Publication Number Publication Date
JPS6224893A JPS6224893A (ja) 1987-02-02
JPS6254600B2 true JPS6254600B2 (cs) 1987-11-16

Family

ID=13623720

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7707786A Granted JPS6224893A (ja) 1986-04-03 1986-04-03 ぬれ性の良好な低融点Ｃｕ−Ａｇ系合金ろう材

Country Status (1)

Country Link
JP (1) JPS6224893A (cs)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03228565A (ja) * 1990-02-02 1991-10-09 Ietatsu Ono 研磨槽とその研磨槽を用いる研磨加工方法
EP2170781B1 (en) * 2007-07-17 2015-06-24 Element Six Limited Method for joining sic-diamond
CN101569967B (zh) 2009-06-16 2011-05-11 贵研铂业股份有限公司 一种含有Si和Ga的铜-银合金低蒸汽压钎料及其应用
JP5645307B2 (ja) * 2010-12-09 2014-12-24 日本発條株式会社 大気接合用ろう材、接合体、および、集電材料

Also Published As

Publication number Publication date
JPS6224893A (ja) 1987-02-02

Similar Documents

Publication Publication Date Title
US4121750A (en) Processes for soldering aluminum-containing workpieces
JPS6113916B2 (cs)
JPS6216752B2 (cs)
US2330062A (en) Silver-copper solder alloy
JPS6254600B2 (cs)
JP3398204B2 (ja) アルミニウム合金用ろう材およびアルミニウム合金製品
JPS6321737B2 (cs)
JP3625262B2 (ja) 高温耐酸化性および熱間加工性に優れた点火プラグ用電極材料
EP0058206B1 (en) Cu-ag base alloy brazing filler material
JPS63160B2 (cs)
JPS6116239B2 (cs)
JP2023519588A (ja) 電気真空素子の接合に用いる低銀ろう材及びその製造方法
JPS6216750B2 (cs)
CN110695567A (zh) 一种低熔点高塑性的银基钎料
US3249429A (en) Tantalum brazing alloy
CN101569967B (zh) 一种含有Si和Ga的铜-银合金低蒸汽压钎料及其应用
JP3057662B2 (ja) ロウ材料
RU2584357C1 (ru) Припой для пайки алюминия и его сплавов
JPS6113912B2 (cs)
JPS6111158B2 (cs)
JP3210766B2 (ja) Ｓｎ基低融点ろう材
JPS5831275B2 (ja) ＷＣ−Ｃｏ系超硬合金のフラックスなしろう付け用ろう材
JPS6216749B2 (cs)
JPS6119358B2 (cs)
JPS6236800B2 (cs)