JPS6252987A - プリント配線板用基板の製造方法 - Google Patents

プリント配線板用基板の製造方法

Info

Publication number
JPS6252987A
JPS6252987A JP19292985A JP19292985A JPS6252987A JP S6252987 A JPS6252987 A JP S6252987A JP 19292985 A JP19292985 A JP 19292985A JP 19292985 A JP19292985 A JP 19292985A JP S6252987 A JPS6252987 A JP S6252987A
Authority
JP
Japan
Prior art keywords
wiring board
printed wiring
manufacturing printed
board substrates
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP19292985A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0525195B2 (enExample
Inventor
大和　元亨
正宏 山崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zeon Corp
Original Assignee
Nippon Zeon Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Zeon Co Ltd filed Critical Nippon Zeon Co Ltd
Priority to JP19292985A priority Critical patent/JPS6252987A/ja
Publication of JPS6252987A publication Critical patent/JPS6252987A/ja
Publication of JPH0525195B2 publication Critical patent/JPH0525195B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Polyoxymethylene Polymers And Polymers With Carbon-To-Carbon Bonds (AREA)
JP19292985A 1985-08-31 1985-08-31 プリント配線板用基板の製造方法 Granted JPS6252987A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19292985A JPS6252987A (ja) 1985-08-31 1985-08-31 プリント配線板用基板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19292985A JPS6252987A (ja) 1985-08-31 1985-08-31 プリント配線板用基板の製造方法

Publications (2)

Publication Number Publication Date
JPS6252987A true JPS6252987A (ja) 1987-03-07
JPH0525195B2 JPH0525195B2 (enExample) 1993-04-12

Family

ID=16299338

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19292985A Granted JPS6252987A (ja) 1985-08-31 1985-08-31 プリント配線板用基板の製造方法

Country Status (1)

Country Link
JP (1) JPS6252987A (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6471195A (en) * 1987-08-14 1989-03-16 Goodrich Co B F Circuit board made of cycloolefin polymerized into lump
US5011730A (en) * 1987-08-14 1991-04-30 The B. F. Goodrich Company Bulk polymerized cycloolefin circuit boards
JP2001071416A (ja) * 1999-09-03 2001-03-21 Hitachi Chem Co Ltd 銅張り積層板の製造方法
JP2007231144A (ja) * 2006-02-28 2007-09-13 Sumitomo Bakelite Co Ltd 樹脂組成物、樹脂層、積層体、配線板および配線板の製造方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6471195A (en) * 1987-08-14 1989-03-16 Goodrich Co B F Circuit board made of cycloolefin polymerized into lump
US5011730A (en) * 1987-08-14 1991-04-30 The B. F. Goodrich Company Bulk polymerized cycloolefin circuit boards
JP2001071416A (ja) * 1999-09-03 2001-03-21 Hitachi Chem Co Ltd 銅張り積層板の製造方法
JP2007231144A (ja) * 2006-02-28 2007-09-13 Sumitomo Bakelite Co Ltd 樹脂組成物、樹脂層、積層体、配線板および配線板の製造方法

Also Published As

Publication number Publication date
JPH0525195B2 (enExample) 1993-04-12

Similar Documents

Publication Publication Date Title
US4555414A (en) Process for producing composite product having patterned metal layer
US4339303A (en) Radiation stress relieving of sulfone polymer articles
US4353954A (en) Flexible printed circuit base board and method for producing the same
KR960008311B1 (ko) 플라스틱 성형물 제조방법
US4424095A (en) Radiation stress relieving of polymer articles
US7989081B2 (en) Resin composite copper foil, printed wiring board, and production processes thereof
US4029845A (en) Printed circuit base board and method for manufacturing same
US4110147A (en) Process of preparing thermoset resin substrates to improve adherence of electrolessly plated metal deposits
CA1157622A (en) Polysulfone surfaced laminated blanks
US4254186A (en) Process for preparing epoxy laminates for additive plating
JPS6252987A (ja) プリント配線板用基板の製造方法
US5419946A (en) Adhesive for printed wiring board and production thereof
KR102041665B1 (ko) 동박 적층판용 접착제
JPH04268340A (ja) 積層板およびその製造法
JP3326862B2 (ja) プリプレグの製造方法
US3903326A (en) Process for producing metal clad circuit boards
JPS60141873A (ja) 化学メツキ用接着剤組成物
JPS6079080A (ja) 接着剤組成物
JP2605804B2 (ja) ポリエステルフイルム積層物
JPH0423654B2 (enExample)
JPS58199151A (ja) 化学メツキ用積層板の製造方法
KR102006499B1 (ko) 동박 적층판용 접착제
JP2005298670A (ja) 絶縁接着フィルム、プリント配線板
JPH04222840A (ja) 積層板の製造方法
JPS60208891A (ja) 金属層パタ−ンの形成方法