JPS6252476B2 - - Google Patents
Info
- Publication number
- JPS6252476B2 JPS6252476B2 JP53112786A JP11278678A JPS6252476B2 JP S6252476 B2 JPS6252476 B2 JP S6252476B2 JP 53112786 A JP53112786 A JP 53112786A JP 11278678 A JP11278678 A JP 11278678A JP S6252476 B2 JPS6252476 B2 JP S6252476B2
- Authority
- JP
- Japan
- Prior art keywords
- main surface
- hole
- conductivity type
- regions
- junction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
Landscapes
- Bipolar Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11278678A JPS5539649A (en) | 1978-09-12 | 1978-09-12 | Semiconductor rectifier element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11278678A JPS5539649A (en) | 1978-09-12 | 1978-09-12 | Semiconductor rectifier element |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5539649A JPS5539649A (en) | 1980-03-19 |
| JPS6252476B2 true JPS6252476B2 (https=) | 1987-11-05 |
Family
ID=14595465
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11278678A Granted JPS5539649A (en) | 1978-09-12 | 1978-09-12 | Semiconductor rectifier element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5539649A (https=) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4938317A (https=) * | 1972-08-21 | 1974-04-10 |
-
1978
- 1978-09-12 JP JP11278678A patent/JPS5539649A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5539649A (en) | 1980-03-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR0161356B1 (ko) | 반도체 장치의 제조방법 | |
| US4179794A (en) | Process of manufacturing semiconductor devices | |
| JPH10294473A (ja) | 面実装型半導体装置及びその製造方法 | |
| US4104786A (en) | Method of manufacture of a semiconductor device | |
| US3200468A (en) | Method and means for contacting and mounting semiconductor devices | |
| US3594619A (en) | Face-bonded semiconductor device having improved heat dissipation | |
| GB2082836A (en) | Corrugated semiconductor devices | |
| US4215358A (en) | Mesa type semiconductor device | |
| JPS6351378B2 (https=) | ||
| US11094614B2 (en) | Semiconductor chip contact structure, device assembly, and method of fabrication | |
| JPS6252476B2 (https=) | ||
| US3419955A (en) | Semiconductor fabrication | |
| JPS6246534A (ja) | ガラス被覆半導体チツプの製造方法 | |
| JPH0613552A (ja) | ヘテロ接合バイポーラトランジスタ集積回路装置およびその製造方法 | |
| JP3238825B2 (ja) | 面実装型半導体装置 | |
| JPH0249732Y2 (https=) | ||
| US3934331A (en) | Method of manufacturing semiconductor devices | |
| JPS6068650A (ja) | 半導体装置の製造方法 | |
| JPS584815B2 (ja) | 半導体装置の製造方法 | |
| US20250246495A1 (en) | Chip | |
| JPS6244430B2 (https=) | ||
| US3678346A (en) | Semiconductor device and method of making the same | |
| JPS6387767A (ja) | 圧接型電力用半導体装置 | |
| KR100216736B1 (ko) | 캐소드 공통 및 애노드 공통 병렬 다이오드 및 다이오드 모듈 제조방법 | |
| JPH11186568A (ja) | 高耐圧ダイオードおよびその製造方法 |