JPS6251498B2 - - Google Patents

Info

Publication number
JPS6251498B2
JPS6251498B2 JP8957881A JP8957881A JPS6251498B2 JP S6251498 B2 JPS6251498 B2 JP S6251498B2 JP 8957881 A JP8957881 A JP 8957881A JP 8957881 A JP8957881 A JP 8957881A JP S6251498 B2 JPS6251498 B2 JP S6251498B2
Authority
JP
Japan
Prior art keywords
semiconductor element
bonded
cooling
flow channel
metal foil
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP8957881A
Other languages
English (en)
Japanese (ja)
Other versions
JPS57206055A (en
Inventor
Motohiro Sato
Noryuki Ashiwake
Akio Yasukawa
Susumu Hioki
Fumyuki Kobayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP8957881A priority Critical patent/JPS57206055A/ja
Publication of JPS57206055A publication Critical patent/JPS57206055A/ja
Publication of JPS6251498B2 publication Critical patent/JPS6251498B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP8957881A 1981-06-12 1981-06-12 Cooling system for electronic device Granted JPS57206055A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8957881A JPS57206055A (en) 1981-06-12 1981-06-12 Cooling system for electronic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8957881A JPS57206055A (en) 1981-06-12 1981-06-12 Cooling system for electronic device

Publications (2)

Publication Number Publication Date
JPS57206055A JPS57206055A (en) 1982-12-17
JPS6251498B2 true JPS6251498B2 (en, 2012) 1987-10-30

Family

ID=13974675

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8957881A Granted JPS57206055A (en) 1981-06-12 1981-06-12 Cooling system for electronic device

Country Status (1)

Country Link
JP (1) JPS57206055A (en, 2012)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6275599U (en, 2012) * 1985-10-30 1987-05-14
JPH01106992U (en, 2012) * 1988-01-06 1989-07-19

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4531146A (en) * 1983-07-14 1985-07-23 Cutchaw John M Apparatus for cooling high-density integrated circuit packages

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6275599U (en, 2012) * 1985-10-30 1987-05-14
JPH01106992U (en, 2012) * 1988-01-06 1989-07-19

Also Published As

Publication number Publication date
JPS57206055A (en) 1982-12-17

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